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    METHOD FOR PRODUCING AN ELECTRICALLY CONDUCTIVE STRUCTURE AND SUPPORT MATERIAL PRODUCED ACCORDING TO SAID METHOD
    217.
    发明申请
    METHOD FOR PRODUCING AN ELECTRICALLY CONDUCTIVE STRUCTURE AND SUPPORT MATERIAL PRODUCED ACCORDING TO SAID METHOD 审中-公开
    方法用于生产导电结构体和带有这种方法制成的打底

    公开(公告)号：WO2016058594A3

    公开(公告)日：2016-06-16

    申请号：PCT/DE2015100416

    申请日：2015-10-07

    Applicant: LPKF LASER & ELECTRONICS AG

    Inventor： KRÜGER ROBIN ALEXANDER ,  RÖSENER BERND ,  FENGLER MALTE

    IPC: H05K3/18 ,  C23C18/16 ,  C23C18/20 ,  C23C18/30

    CPC classification number: C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/30 ,  H05K1/0373 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/107

    Abstract: The invention relates to a method for producing an electrical conductive structure, in particular a conductor path, on a non-conductive support material which contains an additive having at least one metal compound. Said support material is at least partially exposed to electromagnetic radiation in order to activate the metal compounds contained in the additive, catalytically active germs thus forming in the activated areas with respect to an external, currentless metallization, said germs generating the electrically conductive structure on the non-conductive support material. During the method and prior to metallization, in order to efficiently and economically increase the proportion and the activity of the catalytically active germs, at least one part of the germs in the activated areas is substituted by a chemical exchange reaction by means of at least one catalytically active metal as an exchange metal. Also, the metallization takes place on the exchange metal and the optionally remaining, catalytically active germs in an external currentless metallization bath. As a result, in particular all two-step metallization processes become superfluous due to the fact that the claimed essentially increased catalytic activity allows a simple and fast metallization. The claimed method is suitable, preferably, also for plastic materials as support material which display a lower metallization suitability.

    Abstract translation: 本发明涉及一种用于产生导电结构，特别是一个导体线路，在一个非导电性载体材料，其包含添加剂，其包括至少一种金属化合物的方法。 载体材料部分电磁辐射暴露于激活包含在添加剂，从而形成相对于如此激活区到随后的化学镀，其产生对非导电性载体材料中的导电结构的催化活性核的金属化合物。 为了提高效率，在激活区域中的馏分和催化活性核的活动之前的金属化成本的方法的有效性，所述细菌中的至少一部分由至少一种催化活性金属作为替代金属代替通过化学交换反应。 因此，金属化的金属置换，并在电金属化浴的任选剩余的催化活性核进行。 这使得可以用特别的两步金属化工艺来分配，因为本发明显著增强的催化活性能够容易和快速的金属化。 特征在于本发明的方法还优选的是这种塑料作为载体材料，其显示出较低的Metallisierungseignung合适的。

    FORMING CONDUCTIVE METAL PATTERNS USING REACTIVE POLYMERS
    220.
    发明申请
    FORMING CONDUCTIVE METAL PATTERNS USING REACTIVE POLYMERS 审中-公开
    使用反应性聚合物形成导电金属图案

    公开(公告)号：WO2015069475A1

    公开(公告)日：2015-05-14

    申请号：PCT/US2014/062337

    申请日：2014-10-27

    Applicant: EASTMAN KODAK COMPANY

    Inventor： BRUST, Thomas, B. ,  IRVING, Mark Edward ,  FALKNER, Catherine Ann ,  WYAND, Anne Troxell

    IPC: H05K3/18 ,  C23C18/16 ,  C23C18/20

    CPC classification number: G03F7/40 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/208 ,  C23C18/30 ,  C23C18/38 ,  G03F7/039 ,  G03F7/16 ,  G03F7/20 ,  H05K3/185 ,  H05K2201/0166 ,  H05K2201/0236 ,  H05K2203/0759 ,  Y10T428/24917

    Abstract: A conductive pattern is prepared in a polymeric layer that has (a) a reactive polymer comprising pendant tertiary alkyl ester groups, (b) a compound that provides an acid upon exposure to radiation having a λ max of at least 150 nm and up to and including 450 nm, and (c) a crosslinking agent. The polymeric layer is patternwise exposed to provide a polymeric layer comprising non-exposed regions and exposed regions comprising a polymer comprising carboxylic acid groups. The exposed regions are contacted with electroless seed metal ions to form a pattern of electroless seed metal ions. The pattern of electroless seed metal ions is then reduced to provide a pattern of corresponding electroless seed metal nuclei. The corresponding electroless seed metal nuclei are then electrolessly plated with a conductive metal.

    Abstract translation: 在聚合物层中制备导电图案，该聚合物层具有（a）包含叔烷基酯基侧基的反应性聚合物，（b）在暴露于λmax为至少150nm并且包括 450nm，（c）交联剂。 图案化地暴露聚合物层以提供包含非暴露区域的聚合物层和包含包含羧酸基团的聚合物的暴露区域。 暴露的区域与无电子种子金属离子接触以形成无电子种子金属离子的图案。 然后减少无电子种子金属离子的图案以提供相应的无电子种子金属核的图案。 然后将相应的无电子种子金属核用导电金属无电镀。

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