Abstract:
The invention is a novel backplane interconnection system (5) that is useful in the telecommunication and data process industries for ultra high speed backplane systems. It is capable of transmitting digital signals with bandwidths of 10GHz and beyond. The invention provides high performance at a low cost of manufacture. It is suitable for use in a wide variety of system applications. One embodiment of the invention comprises an air dielectric and copper conductor matched impedance transmission line system (15) that interconnects daughter cards in a conventional backplane configuration. The high speed transmission-line structure is continuous through the backplane-daughter card and return path. Such embodiments are also integrated with conventional printed circuit backplanes or can be a stand-alone device.
Abstract:
A high frequency bus system (450) which insures uniform arrival times of high fidelity signals to the devices (510), despite the use of the bus (450) on modules (420) and connectors. The high frequency bus system (450) includes a first bus segment having one or more devices (510) connected between a first and second end. The high frequency bus system (450) also includes a second bus segment which has no devices connected to it. The first end of the first segment and the second end of the second segment are coupled in series to form a chain of segments and when two signals are introduced to the first end of the second bus segment at substantially the same time, they arrive at each device (510) connected to the first bus segment at substantially the same time. Conversely when two signals originate at a device (510) substantially at the same time, they arrive at the first end of the second bus segment at substantially the same time. Uniform arrival times hold despite the use of connectors to couple the segments together, despite the segments being located on modules, without the need for stubs, despite the presence of routing turns in the segments and despite the type of information, such as address, data, or control, carried by the signals.
Abstract:
A mechanical support and electrical interconnection device consisting at least of a rigid printed circuit (26) with a plurality of portions (22, 23, 24) extending in different spatial directions, as well as connecting elements (22). The device is useful in complex electronic systems.
Abstract:
Interlayer connections (3) for internal signal paths of the printed circuit board (1) are combined in groups and preferably situated in the shielding zone of shielded connectors for shielding cable to be plugged in. This arrangement insulates the interlayer connections (3) against high frequencies.
Abstract:
A bus termination network as described for terminating transmission lines used with high speed digital backplanes and which meets futurebus+ specifications. The network consists of a plurality of resistors (R) each of which is connected between a hole (15), which receives a connector, and a common junction (22) which is connected to a 2.1 voltage supply at connector (26). The junction (22) is connected to ground (24) via a capacitor (20). The resistor network is provided in a surface mount chip (18) provided with gull-wing connectors. Each transmission line is connected through a single resistor R in network package (18) so that the signal on the transmission line is decoupled from a 2.1 voltage supply and capacitor (20) decouples the resistors (R) from ground (24).