Abstract:
Producing composite structures includes dispersing a first plurality of objects, a second plurality of objects, and a third plurality of objects in a fluid, the third and second plurality of objects having an average maximum dimension that is smaller than the first plurality o objects The first plurality of objects comprise a first, a second, a third and a forth object, each having mating surface regions The fist and second objects' mating surfaces are complimentary and the third and forth objects' mating surfaces are complementary The first and second object aggregate together in response to the dispersing of the second plurality of objects in the fluid due to a depletion attraction between the first and the second object The third and forth object aggregate together in response to dispersing the third plurality of objects in the fluid due to a depletion attraction between the third and the fourth object
Abstract:
In a method for synthesizing polymeric microstructures, a monomer stream is flowed, at a selected flow rate, through a fluidic channel. At least one shaped pulse of illumination is projected to the monomer stream, defining in the monomer stream a shape of at least one microstructure corresponding to the illumination pulse shape while polymerizing that microstructure shape in the monomer stream by the illumination pulse.
Abstract:
The invention relates to a lithographic method for producing patterns in a photosensitive resin layer (601) placed on a substrate (600). Said patterns (607) comprises flanks (608) inclined with respect to a normal (n) to the main substrate plane forming an inclination angle ( theta ) which is much greater than the inclination angle of the patters obtainable by the previous state of the art. A device for carrying out the inventive method is also disclosed.
Abstract:
A method for forming a micro- or nano-pattern of a material on a substrate is presented. The method utilizes a buffer layer assisted laser patterning (BLALP). A layered structure is formed on the substrate, this layered structure being in the form of spaced-apart regions of the substrate defined by the pattern to be formed, each region including a weakly physisorbed buffer layer and a layer of the material to be patterned on top of the buffer layer. A thermal process is then applied to the layered structure to remove the remaining buffer layer in said regions, and thus form a stable pattern of said material on the substrate resulting from the buffer layer assisted laser patterning. The method may utilize either positive or negative lithography. The patterning may be implemented using irradiation with a single uniform laser pulse via a standard mask used for optical lithography.
Abstract:
A method of manufacturing a plurality of through-holes (132) in a layer of first material, for example for the manufacturing of a probe (100) comprising a tip containing a channel. To manufacture the through-holes (132) in a batch process, - a layer of first material is deposited on a wafer (200) comprising a plurality of pits (210) - a second layer is provided on the layer of first material, and the second layer is provided with a plurality of holes at central locations of the pits (210); - using the second layer as a shadow mask when depositing a third layer (240) at an angle, covering a part of the first material with said third material (240) at the central locations, and - etching the exposed parts of the first layer using the third layer (240) as a protective layer.
Abstract:
The invention provides a system and process of patterning structures on a carbon based surface comprising exposing part of the surface to an ion flux, such that material properties of the exposed surface are modified to provide a hard mask effect on the surface. A further step of etching unexposed parts of the surface forms the structures on the surface. The inventors have discovered that by controlling the ion exposure, alteration of the surface structure at the top surface provides a mask pattern, without substantially removing any material from the exposed surface. The mask allows for subsequent ion etching of unexposed areas of the surface leaving the exposed areas raised relative to the unexposed areas thus manufacturing patterns onto the surface. For example, a Ga+ focussed ion beam exposes a pattern onto a diamond surface which produces such a pattern after its exposure to a plasma etch. The invention is particularly suitable for patterning of clear well-defined structures down to nano-scale dimensions.
Abstract:
The invention relates to a method for making patterns on the surface of a substrate by graphoepitaxy, comprising the following steps: a step of depositing a layer of resin on the surface of the substrate; a step of making patterns in the resin on the surface of a substrate; a step of curing the patterns in the resin by producing a layer of amorphous carbon on the surface of the patterns in the resin; a step of depositing a layer of statistical copolymer after the step of curing the patterns in the resin; a step of grafting the layer of statistical copolymer onto the patterns in the resin by annealing; and a step of depositing a layer of a block copolymer into the spaces defined by the patterns in the resin after the step of curing the patterns and the grafting of the layer of statistical copolymer.