公开(公告)号：US08585916B2

公开(公告)日：2013-11-19

申请号：US12812986

申请日：2009-01-21

Applicant: Thomas D. Perroud ,  Kamlesh D. Patel ,  Robert J. Meagher

Inventor： Thomas D. Perroud ,  Kamlesh D. Patel ,  Robert J. Meagher

IPC: B31D3/00

CPC classification number: G01N33/5005 ,  B01F3/0807 ,  B01F5/0471 ,  B01F13/0059 ,  B01L3/502707 ,  B01L3/502753 ,  B01L3/502761 ,  B01L3/502776 ,  B01L3/502784 ,  B01L2200/0668 ,  B01L2300/0816 ,  B01L2300/0864 ,  B01L2400/0688 ,  B81B2201/058 ,  B81C1/00047 ,  B81C1/00087 ,  B81C1/00119 ,  B81C1/00404 ,  B81C2201/0133 ,  B81C2201/0142 ,  Y10T137/9464 ,  Y10T428/24479

Abstract: Disclosed herein are methods of making micropores of a desired height and/or width between two isotropic wet etched features in a substrate which comprises single-level isotropic wet etching the two features using an etchant and a mask distance that is less than 2× a set etch depth. Also disclosed herein are methods using the micropores and microfluidic devices comprising the micropores.

Abstract translation: 本文公开的方法是在衬底中的两个各向同性湿蚀刻特征之间制造所需高度和/或宽度的微孔的方法，其包括使用蚀刻剂和小于2×一组的掩模距离的单层各向同性湿蚀刻两个特征 蚀刻深度。 本文还公开了使用包括微孔的微孔和微流体装置的方法。

公开(公告)号：US07900350B2

公开(公告)日：2011-03-08

申请号：US11373521

申请日：2006-03-10

Applicant: Taku Masai ,  Koji Sano

Inventor： Taku Masai ,  Koji Sano

IPC: H05K3/02

CPC classification number: H05K7/06 ,  B81B2207/097 ,  B81C1/00301 ,  B81C1/00571 ,  B81C2201/0133 ,  B81C2201/0142 ,  B81C2203/0109 ,  B81C2203/036 ,  H01L2924/16235 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49156

Abstract: A circuit element comprises a wiring board; the wiring board comprises a substrate and a wiring formed on the substrate, and a lid joined on the substrate containing a part of the wiring with a binder and making a sealed space above the substrate, wherein if a spot of the wiring joined with the lid by a binder is a spot of junction, a flank of both flanks of the wiring comprise bends in the spot of junction.

Abstract translation: 电路元件包括布线板; 布线板包括基板和形成在基板上的布线，以及盖子，其接合在基板上，该基板包含布线的一部分，并具有粘合剂并且在基板上方形成密封空间，其中如果布线与盖子接合的点 通过粘合剂是接合点，布线两侧的侧面包括在接合部位的弯曲部。

公开(公告)号：US07745308B2

公开(公告)日：2010-06-29

申请号：US12417114

申请日：2009-04-02

Applicant: Myung Lae Lee ,  Jong Hyun Lee ,  Sung Sik Yun ,  Dae Hun Jeong ,  Gunn Hwang ,  Chang Auck Choi ,  Chang Han Je ,  Jae Yong An

Inventor： Myung Lae Lee ,  Jong Hyun Lee ,  Sung Sik Yun ,  Dae Hun Jeong ,  Gunn Hwang ,  Chang Auck Choi ,  Chang Han Je ,  Jae Yong An

IPC: H01L21/00

CPC classification number: B81C1/00619 ,  B81C1/00626 ,  B81C2201/0132 ,  B81C2201/0133

Abstract: A method of fabricating a micro-vertical structure is provided. The method includes bonding a second crystalline silicon (Si) substrate onto a first crystalline Si substrate by interposing an insulating layer pattern and a cavity, etching the second crystalline Si substrate using a deep reactive ion etch (DRIE) process along a [111] crystal plane vertical to the second crystalline Si substrate, and etching an etched vertical surface of the second crystalline Si substrate using a crystalline wet etching process to improve the surface roughness and flatness of the etched vertical surface. As a result, no morphological defects occur on the etched vertical surface. Also, footings do not occur at an etch end-point due to the insulating layer pattern. In addition, the micro-vertical structure does not float in the air but is fixed to the first crystalline Si substrate, thereby facilitating subsequent processes.

Abstract translation: 提供一种制造微垂直结构的方法。 该方法包括通过插入绝缘层图案和空腔将第二晶体硅（Si）衬底接合到第一晶体Si衬底上，使用沿[111]晶体的深反应离子蚀刻（DRIE）工艺蚀刻第二晶体Si衬底 垂直于第二晶体Si衬底，并且使用结晶湿蚀刻工艺蚀刻第二晶体Si衬底的蚀刻垂直表面，以改善蚀刻垂直表面的表面粗糙度和平坦度。 结果，蚀刻的垂直表面上没有形成形态缺陷。 此外，由于绝缘层图案，在蚀刻终点处不发生基脚。 此外，微垂直结构不会浮在空气中，而是固定在第一晶体Si衬底上，从而有助于后续工艺。

公开(公告)号：US07741142B2

公开(公告)日：2010-06-22

申请号：US11286065

申请日：2005-11-22

Applicant: Manish Sharma

Inventor： Manish Sharma

IPC: H01L21/4763

CPC classification number: B81C1/00063 ,  B81B2201/06 ,  B81C2201/0133 ,  B81C2201/0153

Abstract: The present invention provides a method of fabricating a biosensor. The method includes providing a substrate which has a surface coating. The surface coating is deformable and the substrate includes a layered structure which has at least two electrically conductive layers separated by at least one electrically insulating layer. The method also includes imprinting a structure into the surface coating. Further, the method includes etching at least a region of the imprinted structure and the substrate to remove at least a portion of the structure and the substrate. The structure is shaped so that the etching forms at least a portion of the biosensor in the substrate and exposes at least a portion of each electrically conductive layer to form electrodes of the biosensor.

Abstract translation: 本发明提供一种制造生物传感器的方法。 该方法包括提供具有表面涂层的基底。 表面涂层是可变形的，并且衬底包括具有由至少一个电绝缘层分开的至少两个导电层的分层结构。 该方法还包括将结构压印到表面涂层中。 此外，所述方法包括蚀刻所述压印结构的至少一个区域和所述衬底以去除所述结构和所述衬底的至少一部分。 该结构被成形为使得蚀刻形成衬底中的生物传感器的至少一部分并且暴露出每个导电层的至少一部分以形成生物传感器的电极。

公开(公告)号：US07514287B2

公开(公告)日：2009-04-07

申请号：US11308303

申请日：2006-03-15

Applicant: Ter-Chang Huang ,  Hung-Yi Lin ,  Wen-Syang Hsu

Inventor： Ter-Chang Huang ,  Hung-Yi Lin ,  Wen-Syang Hsu

IPC: H01L21/00

CPC classification number: B81C1/00587 ,  B81C2201/0133

Abstract: A method for reducing dimension of an MEMS device. A single crystalline substrate having a diaphragm is provided. A first-step anisotropic dry etching process is performed to form an opening corresponding to the diaphragm in the back surface, the anisotropic dry etching stopping on a specific lattice plane extending from the edge of the diaphragm. A second-step anisotropic wet etching process is performed to etch the single crystalline substrate along the specific lattice plane until the diaphragm is exposed to form a cavity having a diamond-like shape.

Abstract translation: 一种减小MEMS器件尺寸的方法。 提供具有隔膜的单晶衬底。 执行第一步各向异性干法蚀刻工艺以形成与背面中的隔膜对应的开口，各向异性干蚀刻停止在从隔膜的边缘延伸的特定晶格面上。 执行第二步各向异性湿蚀刻工艺以沿着特定的晶格平面蚀刻单晶衬底，直到膜片暴露以形成具有菱形形状的空腔。

公开(公告)号：US07399585B2

公开(公告)日：2008-07-15

申请号：US09848727

申请日：2001-05-03

Applicant: Vincent Jen-Jr. Gau

Inventor： Vincent Jen-Jr. Gau

IPC: C12Q1/68

CPC classification number: B01L3/5088 ,  B01J2219/00317 ,  B01J2219/00497 ,  B01J2219/00585 ,  B01J2219/00596 ,  B01J2219/00605 ,  B01J2219/0061 ,  B01J2219/00612 ,  B01J2219/00617 ,  B01J2219/00619 ,  B01J2219/00621 ,  B01J2219/0063 ,  B01J2219/00637 ,  B01J2219/00653 ,  B01J2219/00659 ,  B01J2219/00702 ,  B01J2219/00722 ,  B01J2219/00725 ,  B81C2201/0133 ,  B82Y30/00 ,  C12Q1/68 ,  C12Q1/6876 ,  C12Q2600/156 ,  C40B40/06 ,  C40B40/10 ,  C40B60/14 ,  G01N27/3277

Abstract: The system includes a microfabricated electrochemical biosensor for detecting the presence and/or quantity of the target analyte in the sample reagent. The biosensor includes a substrate and at least two electrically conductive electrodes. Each of the electrical conductive electrodes consists of a single layer of an electrically conductive material. The electrodes can be fabricated on the substrate by integrated circuit technology.

Abstract translation: 该系统包括用于检测样品试剂中目标分析物的存在和/或数量的微制造电化学生物传感器。 生物传感器包括基板和至少两个导电电极。 每个导电电极由单层导电材料组成。 电极可以通过集成电路技术在基板上制造。

公开(公告)号：US07362488B2

公开(公告)日：2008-04-22

申请号：US11717022

申请日：2007-03-13

Applicant: Susumu Yasuda ,  Hidemasa Mizutani ,  Takayuki Yagi ,  Yasuhiro Shimada ,  Futoshi Hirose ,  Takahisa Kato

Inventor： Susumu Yasuda ,  Hidemasa Mizutani ,  Takayuki Yagi ,  Yasuhiro Shimada ,  Futoshi Hirose ,  Takahisa Kato

IPC: G02B26/08 ,  G09G5/00 ,  F16M13/00 ,  B44C1/22 ,  C25F3/00 ,  H01L21/302

CPC classification number: G02B26/105 ,  B81B3/0051 ,  B81B3/0067 ,  B81B2201/038 ,  B81B2201/042 ,  B81B2203/0181 ,  B81B2203/058 ,  B81C2201/0133 ,  G02B26/0841 ,  Y10S359/90 ,  Y10S359/904

Abstract: The tiltable-body apparatus including a frame member, a tiltable body, and a pair of torsion springs having a twisting longitudinal axis. The torsion springs are disposed along the twisting longitudinal axis opposingly with the tiltable body being interposed, support the tiltable body flexibly and rotatably about the twisting longitudinal axis relative to the frame member, and include a plurality of planar portions, compliant directions of which intersect each other when viewed along a direction of the twisting longitudinal axis. A center of gravity of the tiltable body is positioned on the twisting longitudinal axis of the torsion springs.

Abstract translation: 可倾斜体装置包括框架构件，可倾斜体和具有扭转纵向轴线的一对扭转弹簧。 扭转弹簧沿着与可倾斜主体相对的扭转纵向轴线布置，其相对于框架构件围绕扭转纵向轴线柔性地和可旋转地支撑可倾斜体，并且包括多个平面部分，顺应方向与每个 另外当沿着扭转纵向轴线的方向观察时。 可倾斜体的重心位于扭转弹簧的扭转纵向轴线上。

公开(公告)号：US20070066028A1

公开(公告)日：2007-03-22

申请号：US11532190

申请日：2006-09-15

Applicant: Gerald Beyer

Inventor： Gerald Beyer

IPC: H01L21/76

CPC classification number: H01L21/31111 ,  B81C1/00595 ,  B81C2201/0132 ,  B81C2201/0133 ,  H01L21/31633 ,  H01L21/76224 ,  H01L21/76816

Abstract: A method for producing narrow trenches in semiconductor devices. The narrow trenches are formed by chemically changing the properties of a first dielectric layer locally, such that the side walls of a patterned hole in the first dielectric layer is converted locally and becomes etchable by a first etching substance. Subsequently a second dielectric material is deposited in the patterned structure and the damaged part of the first dielectric material is removed such that small trenches are obtained.

Abstract translation: 一种在半导体器件中制造窄沟槽的方法。 通过局部化学地改变第一电介质层的性质来形成窄沟槽，使得第一介电层中的图案化孔的侧壁被局部地转换并且可被第一蚀刻物质蚀刻。 随后，在图案化结构中沉积第二介电材料，并且去除第一介电材料的损坏部分，从而获得小的沟槽。

公开(公告)号：US07129179B2

公开(公告)日：2006-10-31

申请号：US09905037

申请日：2001-07-13

Applicant: Zine Eddine Boutaghou

Inventor： Zine Eddine Boutaghou

IPC: H01L21/302

CPC classification number: B81C1/00103 ,  B81B2203/0346 ,  B81B2203/0361 ,  B81B2203/0376 ,  B81C1/00404 ,  B81C1/00547 ,  B81C1/00626 ,  B81C2201/0133 ,  C04B41/009 ,  C04B41/5346 ,  C04B41/91 ,  G11B5/4813 ,  C04B35/00

Abstract: The device of the present invention facilitates engaging mating elements, such as actuators used in disc drives, with a pattern on the device. The improved device includes arcuate edges between at least one of the sidewalls in the pattern and the surface of the device. The arcuate edges minimize some of the fracturing of the device that typically occurs when a mating element is inserted on or into the device. The present invention also relates to a method of fabricating a device. The method comprises positioning a mask in the form of a pattern relative to the device, and then etching the pattern into a surface on the device to form at least one sidewall and an arcuate edge such that the arcuate edge extends between the surface on the device and one of the sidewalls.

公开(公告)号：US06991957B2

公开(公告)日：2006-01-31

申请号：US11000652

申请日：2004-11-30

Applicant: Mark H. Eskridge

Inventor： Mark H. Eskridge

IPC: H01L21/00

CPC classification number: G01P15/125 ,  B81B3/0051 ,  B81B2201/0235 ,  B81B2203/0181 ,  B81B2203/058 ,  B81C2201/0133 ,  G01P15/08 ,  G01P15/097 ,  G01P2015/0828 ,  G01P2015/0831

Abstract: A method for suspending a movable structure form a support structure wherein first and second flat and thin arcuately shaped flexures are formed having spaced apart substantially planar and parallel opposing surfaces, each of the first and second flexures being structured for connection between a support structure and a movable structure to be suspended from the support structure and being aligned along a common axis of rotation between the support structure and the movable structure.

Abstract translation: 一种用于将可移动结构悬挂形成支撑结构的方法，其中形成具有间隔开的基本上平坦且平行的相对表面的第一和第二扁平和细弧形弯曲的弯曲部，所述第一和第二挠曲中的每一个构造成用于在支撑结构和 可移动结构从支撑结构悬挂并且沿着支撑结构和可移动结构之间的公共旋转轴对准。