公开(公告)号：US20130319745A1

公开(公告)日：2013-12-05

申请号：US13519374

申请日：2012-06-11

Applicant: Hua Zheng ,  Cheng-hung Chen

Inventor： Hua Zheng ,  Cheng-hung Chen

IPC: H05K1/11

CPC classification number: H05K1/0269 ,  H05K1/0289 ,  H05K2201/09281 ,  H05K2201/09936

Abstract: The present invention provides a routing structure and display panel. The routing structure includes a plurality of routing, disposed separately. Each routing corresponds to a symbol, and the symbol is disposed on the routing to act as a part of the routing to conduct electricity. In this manner, the routing structure and display panel of the present invention allow expansion of routing width, effectively reduce RC constant and energy-consumption, and improve yield rate.

Abstract translation: 本发明提供一种路由结构和显示面板。 路由结构包括多个路由，分开设置。 每个路由对应于符号，并且该符号被布置在路由上以充当路由的一部分以进行电力。 以这种方式，本发明的路由结构和显示面板允许扩展路由宽度，有效降低RC常数和能量消耗，并提高成品率。

公开(公告)号：US20130200783A1

公开(公告)日：2013-08-08

申请号：US13575036

申请日：2011-01-31

Applicant: Gerardus Titus Van Heck ,  Margaretha Maria De Kok ,  Jeroen Van Den Brand

Inventor： Gerardus Titus Van Heck ,  Margaretha Maria De Kok ,  Jeroen Van Den Brand

IPC: H05K1/02 ,  H05B33/10 ,  H05B33/08

CPC classification number: H05K1/0277 ,  G09F9/00 ,  G09F19/22 ,  H01L27/3293 ,  H01L31/0392 ,  H01L31/042 ,  H01L51/5203 ,  H01L2251/5338 ,  H01L2251/5361 ,  H01R4/04 ,  H01R4/70 ,  H01R12/7076 ,  H05B33/0896 ,  H05B33/10 ,  H05K1/0283 ,  H05K1/038 ,  H05K1/147 ,  H05K1/189 ,  H05K3/321 ,  H05K3/325 ,  H05K3/365 ,  H05K13/04 ,  H05K2201/029 ,  H05K2201/0311 ,  H05K2201/046 ,  H05K2201/083 ,  H05K2201/09081 ,  H05K2201/09281 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2201/10484 ,  Y02E10/50 ,  Y10T29/4913

Abstract: An assembly is provided of an electro-physical transducer (10) on a flexible foil (20) with a carrier (40). The flexible foil (20) has a first main surface (22) provided with at least a first electrically conductive track (24) connected to the electro-physical transducer and opposite said first main surface a second main surface (23) facing towards the carrier. At least a first incision (25a) extends through the flexible foil alongside said at least a first electrically conductive track, therewith defining a strip shaped portion (27) of the flexible foil that carries a portion of the at least a first electrically conductive track. The at least a first electrically conductive track is electrically connected to an electrical conductor (421) of the carrier, and the flexible foil is attached to the carrier with its strip shaped portion.

Abstract translation: 在具有载体（40）的柔性箔（20）上提供由电 - 物理传感器（10）组成的组件。 柔性箔（20）具有第一主表面（22），第一主表面（22）设置有至少第一导电轨道（24），第一导电轨道（24）连接到电物理换能器并与所述第一主表面相对，第二主表面（23）面向载体 。 至少第一切口（25a）沿着所述至少第一导电轨道延伸穿过柔性箔片，从而限定柔性箔片的带状部分（27），其承载至少第一导电轨道的一部分。 至少第一导电轨道电连接到载体的电导体（421），并且柔性箔片与其带状部分连接到载体上。

公开(公告)号：US20120267148A1

公开(公告)日：2012-10-25

申请号：US13536988

申请日：2012-06-28

Applicant: YU-HSU LIN ,  JENG-DA WU ,  CHIH-HANG CHAO

Inventor： YU-HSU LIN ,  JENG-DA WU ,  CHIH-HANG CHAO

IPC: H05K1/02

CPC classification number: H01L23/50 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0224 ,  H05K1/0253 ,  H05K2201/09281 ,  H05K2201/09681 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A circuit board includes a signal plane and a ground plane. The signal plane is configured to have a plurality of signal traces. Each of the signal traces includes a plurality of straight line segments. Each line segment extends along a path different from the others. The ground plane includes a plurality of tiles connected in an array. Each tile is formed by ground traces. The straight line segments of each signal trace mapped on the ground plane are arranged at an angle relative to any one ground trace of the tiles. The angle is defined within a range determined by one of ground traces of a tile and an adjacent diagonal line of the tile. A method for laying out such a circuit board is also provided.

Abstract translation: 电路板包括信号平面和接地平面。 信号平面被配置为具有多个信号迹线。 每个信号迹线包括多个直线段。 每个线段沿着与其他线不同的路径延伸。 接地平面包括以阵列连接的多个瓦。 每个瓷砖由地面痕迹形成。 映射在接地平面上的每个信号迹线的直线段相对于瓦片的任何一个接地迹线以一定角度布置。 该角度限定在由瓦片的接地轨迹和瓦片的相邻对角线之一确定的范围内。 还提供了布线这种电路板的方法。

公开(公告)号：US08203082B2

公开(公告)日：2012-06-19

申请号：US12272797

申请日：2008-11-18

Applicant: Yu-Chang Pai ,  Shou-Kuo Hsu ,  Chien-Hung Liu ,  Ying-Tso Lai

Inventor： Yu-Chang Pai ,  Shou-Kuo Hsu ,  Chien-Hung Liu ,  Ying-Tso Lai

IPC: H05K1/11

CPC classification number: H05K1/116 ,  H05K1/0245 ,  H05K1/0251 ,  H05K1/165 ,  H05K3/429 ,  H05K2201/09236 ,  H05K2201/09281 ,  H05K2201/09636

Abstract: A printed circuit board includes a first layout layer, a second layout layer, a copper foil layer, a first via and a second via. The first layout layer has a first signal line and a second signal line, each of which has a curved first portion. The second layout layer has a third signal line and a fourth signal line, each of which also has a curved first portion. The curved first portions of the first signal line, the second signal line, the third signal line and the fourth signal line are coupled to the first via and the second via. In this case, the curved first portions of the first signal line, the second signal line, the third signal line and the fourth signal line cooperatively generate spiral inductance characteristic.

Abstract translation: 印刷电路板包括第一布局层，第二布局层，铜箔层，第一通孔和第二通孔。 第一布局层具有第一信号线和第二信号线，每条信号线都具有弯曲的第一部分。 第二布局层具有第三信号线和第四信号线，每条信号线还具有弯曲的第一部分。 第一信号线，第二信号线，第三信号线和第四信号线的弯曲的第一部分耦合到第一通孔和第二通孔。 在这种情况下，第一信号线，第二信号线，第三信号线和第四信号线的弯曲的第一部分协同地产生螺旋电感特性。

公开(公告)号：US20120006590A1

公开(公告)日：2012-01-12

申请号：US13238745

申请日：2011-09-21

Applicant: Fa-Ping Fan

Inventor： Fa-Ping Fan

IPC: H05K1/11

CPC classification number: H05K1/111 ,  H05K1/0245 ,  H05K2201/09236 ,  H05K2201/09281 ,  Y02P70/611

Abstract: An exemplary printed circuit board includes a substrate, a differential transmission line, and at least two weld pad pairs. The differential transmission line and the at least two weld pad pairs are disposed on the substrate. The differential transmission line includes two parallel signal conductors disposed on the substrate. Each of the two signal conductors is electrically connected to an edge of one of the weld pads of a respective pair of the at least two weld pad pairs. Thereby, the two signal conductors of the differential transmission line can extend in the same distance anywhere, particularly in the position where the two signal conductors pass the two weld pad pairs. As a result, the coupling performance and the capability of the differential transmission line to resist electromagnetic interference are both enhanced.

公开(公告)号：US20110310547A1

公开(公告)日：2011-12-22

申请号：US13195638

申请日：2011-08-01

Applicant: Cheng Siew TAY ,  Wendy Chet Ming NGOH ,  Choi Keng CHAN

Inventor： Cheng Siew TAY ,  Wendy Chet Ming NGOH ,  Choi Keng CHAN

IPC: G06F1/16 ,  H05K13/04 ,  H05K7/02

CPC classification number: H05K1/111 ,  H05K2201/09227 ,  H05K2201/09281 ,  H05K2201/09481 ,  H05K2201/10734 ,  Y02P70/611 ,  Y10T29/49144 ,  Y10T29/5313

Abstract: A printed circuit board includes a group of pads suitable to be soldered to a respective group of solder-balls of a device. Each pad of the group has a crack initiation point on its perimeter at a location where cracks in a solder-ball are anticipated to start after that solder-ball is soldered to that pad. For a pad of that group having a microvia located therein, a center of that microvia is located farther than a center of that pad from its crack initiation point. For a pad of that group having a trace merging along a portion of its perimeter, that portion does not include a vicinity of that crack initiation point.

Abstract translation: 印刷电路板包括适合于焊接到装置的相应组焊球的一组焊盘。 该组的每个焊盘在其焊接球被焊接到该焊盘之后预期在焊球上的裂纹开始的位置处具有在其周边上的裂纹起始点。 对于具有位于其中的微孔的该组的垫，该微孔的中心位于比该垫的中心从其裂纹起始点更远的位置。 对于具有沿着其周边的一部分的轨迹合并的该组的焊盘，该部分不包括该裂纹起始点的附近。

公开(公告)号：US08035034B2

公开(公告)日：2011-10-11

申请号：US12118658

申请日：2008-05-09

Applicant: Yu-Hsu Lin ,  Jeng-Da Wu ,  Chih-Hang Chao

Inventor： Yu-Hsu Lin ,  Jeng-Da Wu ,  Chih-Hang Chao

IPC: H05K1/03

CPC classification number: H05K1/0366 ,  H05K1/0245 ,  H05K1/0248 ,  H05K2201/029 ,  H05K2201/09236 ,  H05K2201/09281

Abstract: A printed circuit board includes a base and a signal trace laid on the base. The signal trace includes a plurality of straight line segments parallel to the first fibers. The signal trace is laid on the base in such a manner that the line segments of the signal trace mapped on the base partly superpose the first fibers and partly superpose gaps between two adjacent first fibers.

Abstract translation: 印刷电路板包括放置在基座上的基座和信号迹线。 信号迹线包括平行于第一光纤的多条直线段。 信号迹线以这样的方式铺设在基座上，使得映射在基座上的信号迹线的线段部分地叠加第一光纤并且部分地叠加两个相邻的第一光纤之间的间隙。

公开(公告)号：US08013253B2

公开(公告)日：2011-09-06

申请号：US12062580

申请日：2008-04-04

Applicant: Pierre Bormann ,  Luc Morineau ,  Jacques Chavade

Inventor： Pierre Bormann ,  Luc Morineau ,  Jacques Chavade

IPC: H05K1/00 ,  H05K1/11

CPC classification number: H01L23/49838 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/15311 ,  H05K1/111 ,  H05K2201/09281 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00

Abstract: An electrical connection board includes electrical connection terminals on one face with a view toward connecting with a semiconductor component and electrical connection tracks connected respectively to these terminals. The terminals are arranged in a square matrix having two orthogonal directions. On its face, the board includes a multiplicity of identical adjacent connection groups, each group having N adjacent terminals and N tracks placed along this direction while extending towards an edge of the matrix. The terminals of a group are offset by one pitch relative to the terminals of an adjacent group. The board and a semiconductor component are connected together by electrical connection balls.

Abstract translation: 电连接板包括在一个面上的电连接端子，其具有与半导体部件连接的视图和分别连接到这些端子的电连接轨道。 端子布置成具有两个正交方向的正方形矩阵。 在其表面上，板包括多个相同的相邻连接组，每个组具有N个相邻的端子和沿着该方向放置的N个磁道，同时向矩阵的边缘延伸。 组的端子相对于相邻组的端子偏移一个间距。 板和半导体部件通过电连接球连接在一起。

公开(公告)号：US20090294168A1

公开(公告)日：2009-12-03

申请号：US12272797

申请日：2008-11-18

Applicant: YU-CHANG PAI ,  SHOU-KUO HSU ,  CHIEN-HUNG LIU ,  YING-TSO LAI

Inventor： YU-CHANG PAI ,  SHOU-KUO HSU ,  CHIEN-HUNG LIU ,  YING-TSO LAI

IPC: H05K1/11

CPC classification number: H05K1/116 ,  H05K1/0245 ,  H05K1/0251 ,  H05K1/165 ,  H05K3/429 ,  H05K2201/09236 ,  H05K2201/09281 ,  H05K2201/09636

Abstract: A printed circuit board includes a first layout layer, a second layout layer, a copper foil layer, a first via and a second via. The first layout layer has a first signal line and a second signal line, each of which has a curved first portion. The second layout layer has a third signal line and a fourth signal line, each of which also has a curved first portion. The curved first portions of the first signal line, the second signal line, the third signal line and the fourth signal line are coupled to the first via and the second via. In this case, the curved first portions of the first signal line, the second signal line, the third signal line and the fourth signal line cooperatively generate spiral inductance characteristic.

Abstract translation: 印刷电路板包括第一布局层，第二布局层，铜箔层，第一通孔和第二通孔。 第一布局层具有第一信号线和第二信号线，每条信号线都具有弯曲的第一部分。 第二布局层具有第三信号线和第四信号线，每条信号线还具有弯曲的第一部分。 第一信号线，第二信号线，第三信号线和第四信号线的弯曲的第一部分耦合到第一通孔和第二通孔。 在这种情况下，第一信号线，第二信号线，第三信号线和第四信号线的弯曲的第一部分协同地产生螺旋电感特性。

公开(公告)号：US20090236126A1

公开(公告)日：2009-09-24

申请号：US12227365

申请日：2007-06-06

Applicant: Seiichiro Miyahara

Inventor： Seiichiro Miyahara

IPC: H05K1/02

CPC classification number: H05K1/025 ,  H05K1/028 ,  H05K2201/09263 ,  H05K2201/09281

Abstract: A flexible wiring board is provided having a wiring structure which can reduce transmission loss by reducing impedance mismatching even if being folded in a three-dimensional manner. In a flexible wiring board 10 having a characteristic impedance control circuit 20, the flexible wiring board has a planar projection shape of a folded spot 20A in the characteristic impedance control circuit after folding in an arc state along a tangent.

Abstract translation: 提供了具有布线结构的柔性布线板，即使以三维方式折叠，也可以通过降低阻抗失配来降低传输损耗。 在具有特性阻抗控制电路20的柔性布线板10中，柔性布线板在沿着切线折叠成弧状态之后，在特性阻抗控制电路中具有折叠点20A的平面投影形状。