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    PRINTED WIRING BOARD AND A METHOD OF PRODUCTION THEREOF
    251.
    发明申请
    PRINTED WIRING BOARD AND A METHOD OF PRODUCTION THEREOF 有权

    公开(公告)号：US20100155112A1

    公开(公告)日：2010-06-24

    申请号：US12641430

    申请日：2009-12-18

    Applicant: Tomoyuki IKEDA

    Inventor： Tomoyuki IKEDA

    IPC: H05K1/03

    CPC classification number: H05K3/0026 ,  C25D5/02 ,  H05K1/119 ,  H05K3/0032 ,  H05K3/0094 ,  H05K3/422 ,  H05K3/423 ,  H05K3/427 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2203/1572 ,  Y10T29/49124 ,  Y10T29/49126

    Abstract: A printed wiring board has an insulating resin substrate having a first surface and a second surface, the insulating resin substrate having one or more penetrating-holes passing through the insulating resin substrate from the first surface to the second surface, a first conductor formed on the first surface of the insulating resin substrate, a second conductor formed on the second surface of the insulating resin substrate, and a through-hole conductor structure formed in the penetrating-hole of the insulating resin substrate and electrically connecting the first conductor and the second conductor. The penetrating-hole has a first portion having an opening on the first surface and a second portion having an opening on the second surface. The first portion and the second portion are connected such that the first portion and the second portion are set off from each other.

    Multilayer printed circuit board having via arrangements for reducing crosstalk among vias
    253.
    发明授权
    Multilayer printed circuit board having via arrangements for reducing crosstalk among vias 失效
    具有用于减小通孔之间串扰的通孔装置的多层印刷电路板

    公开(公告)号：US07521637B2

    公开(公告)日：2009-04-21

    申请号：US11297303

    申请日：2005-12-08

    Applicant: Don A. Gilliland

    Inventor： Don A. Gilliland

    IPC: H01R12/04 ,  H05K1/11 ,  H01K3/10

    CPC classification number: H05K1/115 ,  H05K1/0216 ,  H05K2201/09245 ,  H05K2201/09836 ,  Y10T29/49167

    Abstract: A printed circuit board having via arrangements for reducing crosstalk is disclosed. The printed circuit board includes a first layer and a second layer. The printed circuit board also includes a first via and a second via, both traveling from the first layer to the second layer. The first via is orthogonal to the second via in a three dimensional space. In addition, the printed circuit board may include a third via traveling from the first layer to the second layer, and the third via is orthogonal to the first and second vias in the three dimensional space.

    Abstract translation: 公开了一种具有用于减少串扰的通孔装置的印刷电路板。 印刷电路板包括第一层和第二层。 印刷电路板还包括从第一层传播到第二层的第一通孔和第二通孔。 第一通孔在三维空间中与第二通孔正交。 此外，印刷电路板可以包括从第一层传播到第二层的第三通孔，并且第三通孔与三维空间中的第一和第二通孔正交。

    PRINTED WIRING BOARD AND A METHOD OF PRODUCTION THEREOF
    254.
    发明申请
    PRINTED WIRING BOARD AND A METHOD OF PRODUCTION THEREOF 有权
    印刷电路板及其生产方法

    公开(公告)号：US20080257591A1

    公开(公告)日：2008-10-23

    申请号：US12115286

    申请日：2008-05-05

    Applicant: Tomoyuki IKEDA

    Inventor： Tomoyuki IKEDA

    IPC: H05K1/02 ,  H05K3/36

    CPC classification number: H05K3/0026 ,  C25D5/02 ,  H05K1/119 ,  H05K3/0032 ,  H05K3/0094 ,  H05K3/422 ,  H05K3/423 ,  H05K3/427 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2203/1572 ,  Y10T29/49124 ,  Y10T29/49126

    Abstract: A printed wiring board has an insulating resin substrate having a first surface and a second surface, the insulating resin substrate having one or more penetrating-holes passing through the insulating resin substrate from the first surface to the second surface, a first conductor formed on the first surface of the insulating resin substrate, a second conductor formed on the second surface of the insulating resin substrate, and a through-hole conductor structure formed in the penetrating-hole of the insulating resin substrate and electrically connecting the first conductor and the second conductor. The penetrating-hole has a first portion having an opening on the first surface and a second portion having an opening on the second surface. The first portion and the second portion are connected such that the first portion and the second portion are set off from each other.

    Abstract translation: 印刷电路板具有具有第一表面和第二表面的绝缘树脂基板，所述绝缘树脂基板具有从所述第一表面到所述第二表面穿过所述绝缘树脂基板的一个或多个贯穿孔，形成在所述绝缘树脂基板上的第一导体 绝缘树脂基板的第一表面，形成在绝缘树脂基板的第二表面上的第二导体和形成在绝缘树脂基板的穿透孔中的通孔导体结构，并将第一导体和第二导体 。 所述贯穿孔具有在所述第一表面上具有开口的第一部分和在所述第二表面上具有开口的第二部分。 第一部分和第二部分被连接成使得第一部分和第二部分彼此脱离。

    Electrical circuit pattern design by injection mold
    255.
    发明申请
    Electrical circuit pattern design by injection mold 审中-公开
    注塑模具电路图案设计

    公开(公告)号：US20070146974A1

    公开(公告)日：2007-06-28

    申请号：US11318033

    申请日：2005-12-23

    Applicant: Cleopatra Cabuz ,  Eugen Cabuz ,  Tzu-Yu Wang

    Inventor： Cleopatra Cabuz ,  Eugen Cabuz ,  Tzu-Yu Wang

    IPC: H05K5/00

    CPC classification number: H05K3/107 ,  H05K1/0284 ,  H05K3/046 ,  H05K3/146 ,  H05K3/16 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09127 ,  H05K2201/09836 ,  H05K2201/09863

    Abstract: A method of forming an electronic part having a circuit pattern, by forming a cavity mold having trench lines in the cavity mold with a first area perpendicular to an axis and a second area having a negative slope with respect to the axis. The part is molded and removed, and a conductive material is deposited to form conductive and nonconductive areas thereon. The preferred deposit step is by blanket metallization which coats all surfaces except the sides of the trench lines and the second area of the part. The method may include the additional step of molding vertical flash portions on the part instead of or in addition to the trench lines that are removed after the conductive material is deposited thereon to form the circuit pattern.

    Abstract translation: 一种形成具有电路图形的电子部件的方法，通过在空腔模具中形成具有沟槽线的空腔模具，其具有垂直于轴线的第一区域和相对于该轴线具有负斜率的第二区域。 该部件被模制和去除，并且沉积导电材料以在其上形成导电和非导电区域。 优选的沉积步骤是通过覆盖金属化，其涂覆除了沟槽线的侧面和部分的第二区域之外的所有表面。 该方法可以包括在导电材料沉积在其上以形成电路图案之后，在部分上成型垂直闪光部分的附加步骤，而不是或除了沟槽线之外去除的导电材料。

    Sloped vias in a substrate, spring-like deflecting contacts, and methods of making
    256.
    发明申请
    Sloped vias in a substrate, spring-like deflecting contacts, and methods of making 有权
    衬底中的斜槽，弹簧状偏转触点，以及制作方法

    公开(公告)号：US20070045857A1

    公开(公告)日：2007-03-01

    申请号：US11588977

    申请日：2006-10-27

    Applicant: James Wark ,  Syed Ahmad

    Inventor： James Wark ,  Syed Ahmad

    IPC: H01L23/48 ,  H01L23/52

    CPC classification number: H01L23/5226 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/49827 ,  H01L25/0657 ,  H01L25/50 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/115 ,  H05K3/0029 ,  H05K3/0041 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09836 ,  H01L2924/00

    Abstract: Methods for forming vias are disclosed. The methods include providing a substrate having a first surface and an opposing, second surface. The vias are formed within the substrate to have a longitudinal axis sloped at an angle with respect to a reference line extending perpendicular to the first surface and the second surface of the substrate. The vias may be formed from the first surface to the opposing second surface, or the via may be formed as a first blind opening from the first surface, then a second opening may be formed from the second surface to be aligned with the first opening. Vias may be formed completely through a first substrate and a second substrate, and the substrates may be bonded together. Semiconductor devices including the vias of the present invention are also disclosed. A method of forming spring-like contacts is also disclosed.

    Abstract translation: 公开了形成通孔的方法。 所述方法包括提供具有第一表面和相对的第二表面的基底。 通孔形成在衬底内，以具有相对于垂直于衬底的第一表面和第二表面延伸的参考线成一定角度倾斜的纵向轴线。 通孔可以由第一表面形成到相对的第二表面，或者通孔可以从第一表面形成为第一盲孔，然后可以从第二表面形成第二开口以与第一开口对准。 可以通过第一基板和第二基板完全形成通孔，并且基板可以结合在一起。 还公开了包括本发明的通孔的半导体器件。 还公开了一种形成弹簧状触点的方法。

    Methods for making plated through holes usable as interconnection wire or probe attachments
    257.
    发明申请
    Methods for making plated through holes usable as interconnection wire or probe attachments 有权

    公开(公告)号：US20060185164A1

    公开(公告)日：2006-08-24

    申请号：US11403138

    申请日：2006-04-11

    Applicant: Gaetan Mathieu ,  Igor Khandros ,  Carl Reynolds

    Inventor： Gaetan Mathieu ,  Igor Khandros ,  Carl Reynolds

    IPC: H05K3/00

    CPC classification number: H05K3/42 ,  G01R1/06711 ,  G01R1/07307 ,  G01R3/00 ,  H05K3/308 ,  H05K2201/09836 ,  H05K2203/0338 ,  Y10T29/49117 ,  Y10T29/49139 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49156 ,  Y10T29/49162 ,  Y10T29/49165 ,  Y10T29/49169 ,  Y10T29/49194

    Abstract: Methods are provided for making plated through holes usable for inserting and attaching connector probes. In a first method, a curved plated through hole is formed by bonding curved etchable wires to a first substrate, plating the wires with a non-etchable conductive material, encasing the plated wires with a dielectric material to form a second substrate, planing the second substrate to expose the etchable wire, and etching the wires to leave plated through holes. In a second method, wires coated with a first etchable layer are initially bonded to a substrate, a second non-etchable plating layer is then applied over the first layer, and the first layer is etched away leaving plated through holes with wires disposed inside. In a third embodiment, a layer of masking material is initially deposited on a substrate and etched to form holes which are filled with a sacrificial fill material, the masking material is then removed, the fill material plated, grinding is performed to remove some plating to expose the fill material, and the fill material is then etched away leaving plated attachment wells. Probes may be attached to the plated through holes or attachment wells to create resilient spring contacts to form a wafer probe card assembly. A twisted tube plated through hole structure is formed by supporting twisted sacrificial wires coated with the plating material in a substrate, and later etching away the wires.

    Sloped vias in a substrate, spring-like deflecting contacts, and methods of making
    260.
    发明申请
    Sloped vias in a substrate, spring-like deflecting contacts, and methods of making 有权
    衬底中的斜槽，弹簧状偏转触点，以及制作方法

    公开(公告)号：US20060046475A1

    公开(公告)日：2006-03-02

    申请号：US10933847

    申请日：2004-09-02

    Applicant: James Wark ,  Syed Ahmad

    Inventor： James Wark ,  Syed Ahmad

    IPC: H01L21/44

    CPC classification number: H01L23/5226 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/49827 ,  H01L25/0657 ,  H01L25/50 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/115 ,  H05K3/0029 ,  H05K3/0041 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09836 ,  H01L2924/00

    Abstract: Methods for forming vias are disclosed. The methods include providing a substrate having a first surface and an opposing, second surface. The vias are formed within the substrate to have a longitudinal axis sloped at an angle with respect to a reference line extending perpendicular to the first surface and the second surface of the substrate. The vias may be formed from the first surface to the opposing second surface, or the via may be formed as a first blind opening from the first surface, then a second opening may be formed from the second surface to be aligned with the first opening. Vias may be formed completely through a first substrate and a second substrate, and the substrates may be bonded together. Semiconductor devices including the vias of the present invention are also disclosed. A method of forming spring-like contacts is also disclosed.

    Abstract translation: 公开了形成通孔的方法。 所述方法包括提供具有第一表面和相对的第二表面的基底。 通孔形成在衬底内，以具有相对于垂直于衬底的第一表面和第二表面延伸的参考线成一定角度倾斜的纵向轴线。 通孔可以由第一表面形成到相对的第二表面，或者通孔可以从第一表面形成为第一盲孔，然后可以从第二表面形成第二开口以与第一开口对准。 可以通过第一基板和第二基板完全形成通孔，并且基板可以结合在一起。 还公开了包括本发明的通孔的半导体器件。 还公开了一种形成弹簧状触点的方法。

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