公开(公告)号：US20120012464A1

公开(公告)日：2012-01-19

申请号：US13242166

申请日：2011-09-23

Applicant: Tomoyuki IKEDA

Inventor： Tomoyuki IKEDA

IPC: C25D5/02

CPC classification number: H05K3/0026 ,  C25D5/02 ,  H05K1/119 ,  H05K3/0032 ,  H05K3/0094 ,  H05K3/422 ,  H05K3/423 ,  H05K3/427 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2203/1572 ,  Y10T29/49124 ,  Y10T29/49126

Abstract: A method for manufacturing a printed wiring board including providing an insulating resin substrate having first and second surfaces, irradiating laser upon the first surface such that a first opening portion having an opening on the first surface and tapering inward is formed, irradiating laser upon the second surface such that a second opening portion having an opening on the second surface, tapering inward and communicated to the first opening portion is formed and that a penetrating-hole having the first and second opening portions is formed, forming an electroless plated film on an inner wall surface of the penetrating-hole, and forming an electrolytic plated film on the electroless plated film such that a through hole conductor structure is formed in the penetrating-hole. The opening of the first portion has an axis of the center of gravity offset with respect to that of the opening of the second opening portion.

Abstract translation: 一种制造印刷电路板的方法，包括：提供具有第一和第二表面的绝缘树脂基板，在第一表面上照射激光，使得形成在第一表面上具有开口并向内逐渐变细的第一开口部分，在第二表面上照射激光 形成第二开口部，该第二开口部在第二面上形成有向内侧逐渐变细并且与第一开口部连通的第二开口部，形成有具有第一开口部和第二开口部的贯通孔，在内部形成无电解电镀膜 并且在所述化学镀膜上形成电解镀膜，使得在所述贯通孔中形成贯通孔导体结构。 第一部分的开口具有相对于第二开口部分的开口偏心的重心轴线。

公开(公告)号：US20070271783A1

公开(公告)日：2007-11-29

申请号：US11832378

申请日：2007-08-01

Applicant: Tomoyuki IKEDA

Inventor： Tomoyuki IKEDA

IPC: H05K3/46

CPC classification number: H01L23/50 ,  B32B3/10 ,  B32B7/02 ,  H01L23/49827 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/3011 ,  H05K1/115 ,  H05K3/4608 ,  H05K3/4641 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09827 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24322 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A multilayer core board 10 includes tapered first via hole conductors 51 extending from the outer surface of a first insulating layer 24 to conductive portions 42a of a power source layer 42, second via hole conductors 52 extending from the outer surface of a second insulating layer 26 to the conductive portions 42a of the power source layer 42, tapered third via hole conductors 53 extending from the outer surface of the second insulating layer 26 to conductive portions 40a of a ground layer 40, and fourth via hole conductors 54 extending from the outer surface of a center insulating layer 22 to the conductive portions 40a of the ground layer 40. The first via hole conductors 51 are tapered, and thus the interval distance to the adjacent first via hole conductor 51 is shorter than straight-shaped first via hole conductors, and thus the pitch of the first via hole conductor 51 at the positive pole side and the fourth via hole conductor 54 at the negative pole side can be sufficiently reduced. This point is applicable to the third via hole conductors 53.

Abstract translation: 多层芯板10包括从第一绝缘层24的外表面延伸到电源层42的导电部分42a的锥形第一通孔导体51，从第二绝缘层的外表面延伸的第二通孔导体52 26连接到电源层42的导电部分42,4a，从第二绝缘层26的外表面延伸到接地层40的导电部分40a的锥形第三通孔导体53以及从第二绝缘层40延伸的第四通孔导体54 中心绝缘层22的外表面连接到接地层40的导电部分40a。 第一通孔导体51是锥形的，因此到相邻的第一通路孔导体51的间隔距离比直线状的第一通孔导体短，因此第一通孔导体51在正极侧的间距和 可以充分降低负极侧的第四通孔导体54。 这点适用于第三通孔导体53。

公开(公告)号：US20120175155A1

公开(公告)日：2012-07-12

申请号：US13422884

申请日：2012-03-16

Applicant: Tomoyuki IKEDA

Inventor： Tomoyuki IKEDA

IPC: H05K1/03 ,  H05K3/00

CPC classification number: H05K3/0026 ,  C25D5/02 ,  H05K1/119 ,  H05K3/0032 ,  H05K3/0094 ,  H05K3/422 ,  H05K3/423 ,  H05K3/427 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2203/1572 ,  Y10T29/49124 ,  Y10T29/49126

Abstract: A printed wiring board has an insulating resin substrate having a first surface and a second surface, the insulating resin substrate having one or more penetrating-holes passing through the insulating resin substrate from the first surface to the second surface, a first conductor formed on the first surface of the insulating resin substrate, a second conductor formed on the second surface of the insulating resin substrate, and a through-hole conductor structure formed in the penetrating-hole of the insulating resin substrate and electrically connecting the first conductor and the second conductor. The penetrating-hole has a first portion having an opening on the first surface and a second portion having an opening on the second surface. The first portion and the second portion are connected such that the first portion and the second portion are set off from each other.

Abstract translation: 印刷电路板具有具有第一表面和第二表面的绝缘树脂基板，所述绝缘树脂基板具有从所述第一表面到所述第二表面穿过所述绝缘树脂基板的一个或多个贯穿孔，形成在所述绝缘树脂基板上的第一导体 绝缘树脂基板的第一表面，形成在绝缘树脂基板的第二表面上的第二导体和形成在绝缘树脂基板的穿透孔中的通孔导体结构，并将第一导体和第二导体 。 所述贯穿孔具有在所述第一表面上具有开口的第一部分和在所述第二表面上具有开口的第二部分。 第一部分和第二部分被连接成使得第一部分和第二部分彼此脱离。

公开(公告)号：US20110247208A1

公开(公告)日：2011-10-13

申请号：US13167305

申请日：2011-06-23

Applicant: Tomoyuki IKEDA ,  Naoaki Fujii ,  Seiji Izawa

Inventor： Tomoyuki IKEDA ,  Naoaki Fujii ,  Seiji Izawa

IPC: H05K3/40

CPC classification number: H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/3011 ,  H05K1/112 ,  H05K1/115 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0394 ,  H05K2201/096 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2203/0733 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24322 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A method of manufacturing a multilayered printed wiring board including forming a multilayered core substrate including insulation layers and one or more stacked via structures formed through the insulation layers, the stacked via structure including vias formed in the insulation layers, respectively, the insulation layers in the multilayered core substrate including at least three insulation layers and each of the insulation layers in the multilayered core substrate including a core material impregnated with a resin, and forming a build-up structure over the multilayered core substrate and including interlaminar insulation layers and conductor circuits, each of the interlaminar insulation layers including a resin material without a core material.

Abstract translation: 一种制造多层印刷布线板的方法，包括形成包括绝缘层和通过绝缘层形成的一个或多个堆叠的通孔结构的多层芯基板，分别形成在绝缘层中的通孔的堆叠通孔结构分别包括在绝缘层中的绝缘层 所述多层芯基板包括至少三个绝缘层，所述多层芯基板中的每个所述绝缘层包括浸渍有树脂的芯材，并且在所述多层芯基板上形成堆积结构，并且包括层间绝缘层和导体电路， 每个层间绝缘层包括没有芯材的树脂材料。

公开(公告)号：US20110108311A1

公开(公告)日：2011-05-12

申请号：US13004325

申请日：2011-01-11

Applicant: Yukihiko TOYODA ,  Yoichiro KAWAMURA ,  Tomoyuki IKEDA

Inventor： Yukihiko TOYODA ,  Yoichiro KAWAMURA ,  Tomoyuki IKEDA

IPC: H05K1/11

CPC classification number: H05K1/115 ,  H01L21/486 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/0271 ,  H05K1/113 ,  H05K1/116 ,  H05K3/28 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4661 ,  H05K3/4688 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/068 ,  H05K2201/09454 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09627 ,  H05K2201/09745 ,  H01L2924/00

Abstract: A multilayered printed circuit board including a substrate, a multilayered structure built thereon and having conductor circuits and interlaminar resin insulating layers in an alternate fashion, and one or more stack-via structures including via-holes stacked one another and electrically connected to the conductor circuits through the insulating layers. Each of the via-holes includes a land portion formed on a respective one of the insulating layers and a filled via structure portion filling an opening of the respective one of the insulating layers with a metal layer such that the via-holes are stacked one another immediately above the filled via structure portion of each via-hole, the via-holes include the outermost layer via-hole in the outermost layer of the insulating layers, and one or more via-holes have the land portion having the land diameter which is larger than the land diameter of the land portion of the outermost layer via-hole.

Abstract translation: 一种多层印刷电路板，包括基板，在其上构建的多层结构，并且具有交替形式的导体电路和层间树脂绝缘层，以及一个或多个堆叠通孔结构，其包括彼此堆叠并且电连接到导体电路的通孔 通过绝缘层。 每个通孔包括形成在绝缘层的相应一个上的接合部分和填充的通孔结构部分，其中填充有绝缘层的相应一个绝缘层的开口的金属层使得通孔彼此堆叠 在通孔的填充通孔结构部分的正上方，通孔包括绝缘层的最外层中的最外层通孔，一个或多个通孔具有焊盘直径为 大于最外层通孔的陆部的陆部直径。

公开(公告)号：US20100155112A1

公开(公告)日：2010-06-24

申请号：US12641430

申请日：2009-12-18

Applicant: Tomoyuki IKEDA

Inventor： Tomoyuki IKEDA

IPC: H05K1/03

CPC classification number: H05K3/0026 ,  C25D5/02 ,  H05K1/119 ,  H05K3/0032 ,  H05K3/0094 ,  H05K3/422 ,  H05K3/423 ,  H05K3/427 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2203/1572 ,  Y10T29/49124 ,  Y10T29/49126

Abstract: A printed wiring board has an insulating resin substrate having a first surface and a second surface, the insulating resin substrate having one or more penetrating-holes passing through the insulating resin substrate from the first surface to the second surface, a first conductor formed on the first surface of the insulating resin substrate, a second conductor formed on the second surface of the insulating resin substrate, and a through-hole conductor structure formed in the penetrating-hole of the insulating resin substrate and electrically connecting the first conductor and the second conductor. The penetrating-hole has a first portion having an opening on the first surface and a second portion having an opening on the second surface. The first portion and the second portion are connected such that the first portion and the second portion are set off from each other.

公开(公告)号：US20080257591A1

公开(公告)日：2008-10-23

申请号：US12115286

申请日：2008-05-05

Applicant: Tomoyuki IKEDA

Inventor： Tomoyuki IKEDA

IPC: H05K1/02 ,  H05K3/36

CPC classification number: H05K3/0026 ,  C25D5/02 ,  H05K1/119 ,  H05K3/0032 ,  H05K3/0094 ,  H05K3/422 ,  H05K3/423 ,  H05K3/427 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2203/1572 ,  Y10T29/49124 ,  Y10T29/49126

Abstract: A printed wiring board has an insulating resin substrate having a first surface and a second surface, the insulating resin substrate having one or more penetrating-holes passing through the insulating resin substrate from the first surface to the second surface, a first conductor formed on the first surface of the insulating resin substrate, a second conductor formed on the second surface of the insulating resin substrate, and a through-hole conductor structure formed in the penetrating-hole of the insulating resin substrate and electrically connecting the first conductor and the second conductor. The penetrating-hole has a first portion having an opening on the first surface and a second portion having an opening on the second surface. The first portion and the second portion are connected such that the first portion and the second portion are set off from each other.

Abstract translation: 印刷电路板具有具有第一表面和第二表面的绝缘树脂基板，所述绝缘树脂基板具有从所述第一表面到所述第二表面穿过所述绝缘树脂基板的一个或多个贯穿孔，形成在所述绝缘树脂基板上的第一导体 绝缘树脂基板的第一表面，形成在绝缘树脂基板的第二表面上的第二导体和形成在绝缘树脂基板的穿透孔中的通孔导体结构，并将第一导体和第二导体 。 所述贯穿孔具有在所述第一表面上具有开口的第一部分和在所述第二表面上具有开口的第二部分。 第一部分和第二部分被连接成使得第一部分和第二部分彼此脱离。