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公开(公告)号：US09795035B2
公开(公告)日：2017-10-17
申请号：US15356852
申请日：2016-11-21
Inventor： Jonathan Douglas Hatch , Stephen McGarry Hatch
CPC classification number: H05K1/0306 , H05K1/02 , H05K1/028 , H05K1/0393 , H05K1/115 , H05K1/144 , H05K3/0023 , H05K3/0064 , H05K3/007 , H05K3/048 , H05K3/103 , H05K3/125 , H05K3/386 , H05K3/389 , H05K3/4611 , H05K3/4644 , H05K2201/0145 , H05K2201/0154 , H05K2201/05 , H05K2201/09009 , H05K2203/0152
Abstract: A PCB page blank includes a flexible substrate, a curable adhesive, a conductive layer, and a conductive layer support. The flexible substrate receives an opaque negative circuit pattern thereon. Portions of the curable adhesive not obscured by the circuit pattern may bond to portions of the conductive layer when exposed to light. The bonded portions of the conductive layer shear or tear from non-bonded portions of the conductive layer such that the bonded portions remain with the flexible substrate and the non-bonded portions remain with the conductive layer support when the flexible substrate and the conductive layer support are separated. The flexible substrate and the bonded portions of the conductive layer thus form a PCB prototype with the bonded portions of the conductive layer forming circuit traces of the circuit pattern.
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公开(公告)号：US09717144B2
公开(公告)日：2017-07-25
申请号：US14768800
申请日：2014-02-19
Inventor： Koichi Sakajiri , Keisuke Azuma , Hidetoshi Matsumoto , Junji Watanabe , Masatoshi Tokita
IPC: H05K1/09 , H05K3/02 , G06F3/041 , H01L31/0224 , H01B1/02 , G02F1/1343
CPC classification number: H05K1/097 , G02F1/13439 , G06F3/041 , G06F2203/04102 , G06F2203/04103 , H01B1/023 , H01L31/022466 , H05K3/02 , H05K2201/05
Abstract: There are provided a conductive nanowire network, a conductive board and transparent electrode utilizing it, and a method for producing the same. The conductive nanowire network of the invention has essentially unbroken, continuous conductive nanowires randomly formed into a network. In the method for producing a conductive nanowire network according to the invention, nanofibers are applied in a random network-like fashion onto a substrate covered with a conductive layer, the conductive layer regions that are not covered with the nanofibers are removed, and then the nanofibers are removed. The network structure (wire diameter and network density) are also controlled to obtain a transparent electrode exhibiting both transparency and conductivity.
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公开(公告)号：US20170164463A1
公开(公告)日：2017-06-08
申请号：US15356852
申请日：2016-11-21
Inventor： JONATHAN DOUGLAS HATCH , STEPHEN MCGARRY HATCH
CPC classification number: H05K1/0306 , H05K1/02 , H05K1/028 , H05K1/0393 , H05K1/115 , H05K1/144 , H05K3/0023 , H05K3/0064 , H05K3/007 , H05K3/048 , H05K3/103 , H05K3/125 , H05K3/386 , H05K3/389 , H05K3/4611 , H05K3/4644 , H05K2201/0145 , H05K2201/0154 , H05K2201/05 , H05K2201/09009 , H05K2203/0152
Abstract: A PCB page blank includes a flexible substrate, a curable adhesive, a conductive layer, and a conductive layer support. The flexible substrate receives an opaque negative circuit pattern thereon. Portions of the curable adhesive not obscured by the circuit pattern may bond to portions of the conductive layer when exposed to light. The bonded portions of the conductive layer shear or tear from non-bonded portions of the conductive layer such that the bonded portions remain with the flexible substrate and the non-bonded portions remain with the conductive layer support when the flexible substrate and the conductive layer support are separated. The flexible substrate and the bonded portions of the conductive layer thus form a PCB prototype with the bonded portions of the conductive layer forming circuit traces of the circuit pattern.
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公开(公告)号：US20170094806A1
公开(公告)日：2017-03-30
申请号：US14941887
申请日：2015-11-16
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： William L. BRODSKY , James A. BUSBY , Phillip Duane ISAACS , David C. LONG
CPC classification number: H05K1/0275 , H05K1/0298 , H05K1/034 , H05K1/09 , H05K1/183 , H05K3/12 , H05K3/30 , H05K3/301 , H05K3/46 , H05K5/0208 , H05K7/023 , H05K2201/015 , H05K2201/05 , H05K2201/055 , H05K2201/056
Abstract: Methods of fabricating tamper-respondent assemblies are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor. The tamper-respondent sensor includes, for instance, at least one flexible layer having opposite first and second sides, and circuit lines forming at least one resistive network. The circuit lines are disposed on at least one of the first or second side of the at least one flexible layer, and have a line width Wl≦200 μm, as well as a line-to-line spacing width Ws≦200 μm. In certain enhanced embodiments, the tamper-respondent sensor includes multiple flexible layers, with a first flexible layer having first circuit lines, and a second flexible layer having second circuit lines, where the first and second circuit lines may have different line widths, different line-to-line spacings, and/or be formed of different materials.
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公开(公告)号：US20170077211A1
公开(公告)日：2017-03-16
申请号：US15363228
申请日：2016-11-29
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Shunpei YAMAZAKI , Kensuke YOSHIZUMI
CPC classification number: H01L27/3276 , G04G9/0088 , H01L27/1244 , H01L27/3262 , H01L51/0097 , H01L2227/323 , H01L2251/5338 , H05K1/0277 , H05K1/028 , H05K1/0283 , H05K1/147 , H05K1/189 , H05K2201/05 , H05K2201/051 , H05K2201/052 , H05K2201/053 , H05K2201/055 , Y02E10/549
Abstract: One embodiment of the present invention provides a highly reliable display device. In particular, a display device to which a signal or a power supply potential can be supplied stably is provided. Further, a bendable display device to which a signal or a power supply potential can be supplied stably is provided. The display device includes, over a flexible substrate, a display portion, a plurality of connection terminals to which a signal from an outside can be input, and a plurality of wirings. One of the plurality of wirings electrically connects one of the plurality of connection terminals to the display portion. The one of the plurality of wirings includes a first portion including a plurality of separate lines and a second portion in which the plurality of lines converge.
Abstract translation: 本发明的一个实施例提供了一种高度可靠的显示装置。 特别地，提供可以稳定地供给信号或电源电位的显示装置。 此外，提供了可稳定地供给信号或电源电位的可弯曲显示装置。 显示装置在柔性基板上包括显示部分，可以输入来自外部的信号的多个连接端子和多个布线。 多个布线中的一个将多个连接端子中的一个电连接到显示部分。 多个布线中的一个布线包括包括多条单独的线的第一部分和多条线会聚的第二部分。
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Patent Agency Ranking
公开(公告)号：US20170075054A1
公开(公告)日：2017-03-16
申请号：US15363789
申请日：2016-11-29
Applicant: LG INNOTEK CO., LTD.
Inventor： Hyun Duck YANG , Jin Hee KIM , Chul Hong KIM , Gwang Ho PARK , Moo Ryoung PARK
CPC classification number: G02B6/0036 , F21S43/14 , F21S43/145 , F21S43/239 , F21S43/245 , F21S43/249 , F21S43/26 , F21S43/40 , F21V13/12 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , G02B6/0001 , G02B6/0021 , G02B6/0025 , G02B6/003 , G02B6/0031 , G02B6/0068 , G02B6/0073 , G02B6/0083 , H05K1/00 , H05K1/0274 , H05K1/0393 , H05K1/189 , H05K2201/05 , H05K2201/10106 , H05K2201/2054
Abstract: Disclosed is a lighting device which comprises: an optical member comprising a protruding optical pattern forming a gap with an adjacent layer; at least one light emitting unit inserted into the optical member; and a resin layer formed on the optical member and the at least one light emitting unit, whereby it is possible to obtain an effect that the shapes of light change depending on the viewing angle when viewing the light source by producing various protruding optical patterns, an effect that the whole thickness can be reduced, and an effect that the degree of design freedom can be enhanced when designing products thanks to an enhanced flexibility.
Abstract translation: 公开了一种照明装置，其包括：光学构件，包括与相邻层形成间隙的突出光学图案; 至少一个发光单元插入到光学构件中; 以及形成在所述光学构件和所述至少一个发光单元上的树脂层，由此可以获得当通过产生各种突出的光学图案来观察光源时，光的形状随着视角而变化的效果， 可以降低整个厚度，并且由于增强的灵活性，在设计产品时可以提高设计自由度。
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公开(公告)号：US20170034909A1
公开(公告)日：2017-02-02
申请号：US15223241
申请日：2016-07-29
Applicant: Nitto Denko Corporation
Inventor： Daisuke YAMAUCHI , Hiroyuki TANABE
CPC classification number: G11B5/4833 , G11B5/484 , H05K1/056 , H05K1/09 , H05K1/111 , H05K3/244 , H05K3/388 , H05K2201/0341 , H05K2201/0347 , H05K2201/05 , Y02P70/611
Abstract: A conductor trace is formed on a base insulating layer. The conductor trace includes two terminal portions and one wiring portion. The wiring portion is formed to connect the two terminal portions to each other and extend from each terminal portion. A metal cover layer is formed to cover the terminal portion and the wiring portion of the conductor trace and continuously extend from a surface of the terminal portion to a surface of the wiring portion. The metal cover layer is made of metal having magnetism lower than magnetism of nickel, and is made of gold, for example. A cover insulating layer is formed on the base insulating layer to cover a portion, of the metal cover layer formed on the conductor trace, covering the wiring portion and not to cover a portion of the metal cover layer covering the terminal portion.
Abstract translation: 在基底绝缘层上形成导体迹线。 导体迹线包括两个端子部分和一个布线部分。 布线部形成为将两个端子部彼此连接并从各端子部延伸。 形成金属覆盖层以覆盖导体迹线的端子部分和布线部分并且从端子部分的表面连续地延伸到布线部分的表面。 金属覆盖层由具有低于镍的磁性的金属制成，例如由金制成。 在绝缘层上形成覆盖绝缘层，以覆盖形成在导体迹线上的金属覆盖层的覆盖布线部分的部分，而不覆盖覆盖端子部分的金属覆盖层的一部分。
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公开(公告)号：US09543533B2
公开(公告)日：2017-01-10
申请号：US14192178
申请日：2014-02-27
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Shunpei Yamazaki , Kensuke Yoshizumi
CPC classification number: H01L27/3276 , G04G9/0088 , H01L27/1244 , H01L27/3262 , H01L51/0097 , H01L2227/323 , H01L2251/5338 , H05K1/0277 , H05K1/028 , H05K1/0283 , H05K1/147 , H05K1/189 , H05K2201/05 , H05K2201/051 , H05K2201/052 , H05K2201/053 , H05K2201/055 , Y02E10/549
Abstract: One embodiment of the present invention provides a highly reliable display device. In particular, a display device to which a signal or a power supply potential can be supplied stably is provided. Further, a bendable display device to which a signal or a power supply potential can be supplied stably is provided. The display device includes, over a flexible substrate, a display portion, a plurality of connection terminals to which a signal from an outside can be input, and a plurality of wirings. One of the plurality of wirings electrically connects one of the plurality of connection terminals to the display portion. The one of the plurality of wirings includes a first portion including a plurality of separate lines and a second portion in which the plurality of lines converge.
Abstract translation: 本发明的一个实施例提供了一种高度可靠的显示装置。 特别地，提供可以稳定地供给信号或电源电位的显示装置。 此外，提供了可稳定地供给信号或电源电位的可弯曲显示装置。 显示装置在柔性基板上包括显示部分，可以输入来自外部的信号的多个连接端子和多个布线。 多个布线中的一个将多个连接端子中的一个电连接到显示部分。 多个布线中的一个布线包括包括多条单独的线的第一部分和多条线会聚的第二部分。
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269.发明授权Method of making an electronic device having a thin film resistor formed on an LCP solder mask and related devices 有权制造具有形成在LCP焊接掩模上的薄膜电阻器的电子器件和相关器件的方法公开(公告)号：US09521752B2
公开(公告)日：2016-12-13
申请号：US14490866
申请日：2014-09-19
Applicant: HARRIS CORPORATION
Inventor： Louis Joseph Rendek, Jr.
CPC classification number: H05K3/3452 , H01L2224/16225 , H05K1/028 , H05K1/03 , H05K1/0393 , H05K1/111 , H05K1/115 , H05K1/167 , H05K3/16 , H05K3/3436 , H05K3/4038 , H05K2201/0141 , H05K2201/05 , Y02P70/613
Abstract: A method of making an electronic device may include forming at least one circuit layer that includes solder pads on a substrate and forming at least one liquid crystal polymer (LCP) solder mask having mask openings therein. The method may also include forming at least one thin film resistor on the LCP solder mask and coupling the at least one LCP solder mask to the substrate so that the at least one thin film resistor is coupled to the at least one circuit layer and so that the solder pads are aligned with the mask openings.
Abstract translation: 制造电子器件的方法可以包括在衬底上形成至少一个包括焊盘的电路层，并在其中形成至少一个具有掩模开口的液晶聚合物（LCP）焊料掩模。 该方法还可以包括在LCP焊接掩模上形成至少一个薄膜电阻器并且将至少一个LCP焊接掩模耦合到衬底，使得至少一个薄膜电阻器耦合到至少一个电路层，并且使得 焊盘与掩模开口对准。
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270.发明申请公开(公告)号：US20160345437A1
公开(公告)日：2016-11-24
申请号：US15158645
申请日：2016-05-19
Applicant: TactoTek Oy
Inventor： Mikko HEIKKINEN , Jarmo SÄÄSKI , Jarkko TORVINEN
CPC classification number: H05K1/186 , H01L23/4985 , H01L23/5387 , H01L33/52 , H01L51/0097 , H01L2224/1319 , H01L2933/005 , H05K1/0274 , H05K1/0298 , H05K1/189 , H05K3/284 , H05K2201/0129 , H05K2201/05 , H05K2201/09872 , H05K2201/10106 , H05K2201/10151 , H05K2203/1316 , H05K2203/1322
Abstract: A multilayer structure for an electronic device having a flexible substrate film (202) for accommodating electronics (204); at least one electronic component (204) provided on said substrate film (202); and a number of conductive traces (206) provided on said substrate film (202) for electrically powering and/or connecting electronics including said at least one electronic component (204), wherein at least one preferably thermoformed cover (210) is attached to said substrate film (202) on top of said at least one electronic component (204), the at least one thermoformed cover (210) and the substrate film (202) accommodating the electronics (204) being overmolded with thermoplastic material (208). The invention also relates to a method for manufacturing a multilayer structure for an electronic device
Abstract translation: 一种用于电子设备的多层结构，其具有用于容纳电子设备（204）的柔性基底膜（202）。 设置在所述衬底膜（202）上的至少一个电子部件（204）; 以及设置在所述衬底膜（202）上的多个导电迹线（206），用于对包括所述至少一个电子部件（204）的电子元件进行电力供应和/或连接，其中至少一个优选地，热成型盖（210）附接到所述 在所述至少一个电子部件（204）的顶部上的所述基底膜（202），所述至少一个热成型盖（210）和容纳所述电子器件（204）的所述基底膜（202）用热塑性材料（208）包覆成型。 本发明还涉及一种用于制造电子设备的多层结构的方法
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