公开(公告)号：US07267558B1

公开(公告)日：2007-09-11

申请号：US11509535

申请日：2006-08-24

Applicant: Igor Polnyi

Inventor： Igor Polnyi

IPC: H01R12/00

CPC classification number: H05K3/325 ,  H05K2201/0969 ,  H05K2201/10628 ,  H05K2201/10795 ,  H05K2203/167

Abstract: An electrical connector includes an insulative housing adapted to engage a conductive contact (20). The conductive contact has a tail end, wherein the tail end (22) is angled and has a generally dished shape such that at least a portion of the tail end terminates within a hole (10) in a contact pad (12) of a circuit board (1). The conductive contact tail end in a dished shape has the advantages of facilitating the guiding of the tail end into or out of the hole of the circuit board during wipe actions, without removing gold plated layer, and of achieving a reliable travel of the tail end across the hole of the contact pad of the circuit board.

Abstract translation: 电连接器包括适于接合导电触头（20）的绝缘外壳。 导电接触具有尾端，其中尾端（22）成角度并且具有大体上的碟形形状，使得尾端的至少一部分终止于电路的接触焊盘（12）内的孔（10）内 董事会（1）。 导电接触尾端呈碟形状的优点在于，在擦除动作期间，便于将尾端引入或移出电路板的孔，而无需去除镀金层，并且实现尾端的可靠行进 穿过电路板接触垫的孔。

公开(公告)号：US20060137815A1

公开(公告)日：2006-06-29

申请号：US11355772

申请日：2006-02-16

Applicant: Masato Koike ,  Katsumi Fujimoto

Inventor： Masato Koike ,  Katsumi Fujimoto

IPC: B32B37/00 ,  B32B7/12

CPC classification number: G01C19/5663 ,  H01L41/053 ,  H05K3/321 ,  H05K3/3426 ,  H05K2201/10083 ,  H05K2201/10628 ,  H05K2201/10757 ,  H05K2201/10848 ,  H05K2201/2045 ,  Y02P70/613

Abstract: In a vibrator support structure, a vibrator is supported on a substrate through support pins, substrate connection portions of the support pins and pin connection portions of the substrate are joined through conductive adhesive which is made of a resin including conductive filler and has a pencil hardness of about 4H or less, and the conductive adhesive has a thickness which can buffer vibrations and impacts propagated through the support pins.

Abstract translation: 在振动器支撑结构中，振动器通过支撑销支撑在基板上，支撑销的基板连接部分和基板的销连接部分通过由包括导电填料的树脂制成并具有铅笔硬度的导电粘合剂 约4H或更小，并且导电粘合剂具有可以缓冲通过支撑销传播的振动和冲击的厚度。

公开(公告)号：US20040155560A1

公开(公告)日：2004-08-12

申请号：US10735704

申请日：2003-12-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Masato Koike ,  Katsumi Fujimoto

IPC: H02N002/00

CPC classification number: G01C19/5663 ,  H01L41/053 ,  H05K3/321 ,  H05K3/3426 ,  H05K2201/10083 ,  H05K2201/10628 ,  H05K2201/10757 ,  H05K2201/10848 ,  H05K2201/2045 ,  Y02P70/613

Abstract: In a vibrator support structure, a vibrator is supported on a substrate through support pins, substrate connection portions of the support pins and pin connection portions of the substrate are joined through conductive adhesive which is made of a resin including conductive filler and has a pencil hardness of about 4H or less, and the conductive adhesive has a thickness which can buffer vibrations and impacts propagated through the support pins.

Abstract translation: 在振动器支撑结构中，振动器通过支撑销支撑在基板上，支撑销的基板连接部分和基板的引脚连接部分通过由包括导电填料的树脂制成并具有铅笔硬度的导电粘合剂 约4H或更小，并且导电粘合剂具有可以缓冲通过支撑销传播的振动和冲击的厚度。

公开(公告)号：US5831214A

公开(公告)日：1998-11-03

申请号：US744226

申请日：1996-11-05

Applicant: Ralf Diehlmann ,  Volker Block

Inventor： Ralf Diehlmann ,  Volker Block

IPC: H05K1/11 ,  H01R4/02 ,  H01R13/58 ,  H01R43/02 ,  H05K1/09 ,  H05K3/32 ,  H01R4/00

CPC classification number: H05K3/328 ,  H01R13/5845 ,  H01R4/027 ,  H01R43/0256 ,  H01R12/53 ,  H01R4/023 ,  H05K1/092 ,  H05K2201/10287 ,  H05K2201/10628 ,  H05K2201/10977 ,  H05K2203/0495

Abstract: A circuit (1) includes a plate-shaped substrate (2), a thick-film conductor array (8) having first contact parts (11), with which second contact parts (13) of connecting leads (15) are connected two-dimensionally by a compression bond. The second contact parts (13) are configured tape-like by compression from a copper strand. An additional, non-conducting positional seal (30) of a potting compound (31) positively locates the connecting leads (15) in position with respect to the substrate (2), as a result of which very high currents can be handled at very high operating temperatures by simple means.

Abstract translation: 电路（1）包括板状基板（2），具有第一接触部分（11）的厚膜导体阵列（8），连接引线（15）的第二接触部分（13） 通过压缩键来进行尺寸。 第二接触部分（13）由铜绞线压缩而构成带状。 灌封化合物（31）的附加的非导电位置密封（30）将连接引线（15）相对于基底（2）正确地定位在适当位置，结果非常高的电流可以非常地处理 操作温度高，通过简单的手段。

公开(公告)号：US5447267A

公开(公告)日：1995-09-05

申请号：US190605

申请日：1994-02-02

Applicant: Tadahiko Sakai ,  Shinichi Kuroki

Inventor： Tadahiko Sakai ,  Shinichi Kuroki

IPC: B23K1/20 ,  H05K3/30 ,  H05K3/34 ,  B23K31/02

CPC classification number: B23K1/20 ,  H05K3/305 ,  H05K3/3421 ,  H05K2201/10628 ,  H05K2201/10651 ,  H05K2203/1163 ,  H05K3/341 ,  H05K3/3494 ,  Y02P70/613 ,  Y10T428/31678

Abstract: An electronic part is tacked to a circuit board, leads of the electronic part being made into contact with cream solder built up on the circuit board, and thereafter, the circuit board is heated up so as to melt the cream solder in order to solder the electronic part to the circuit board. In this procedure, the melting temperature of a hardener in the tacking bond, that is, the hardening temperature of the tacking bond, is higher than that of the cream solder, thereby making it possible to prevent hindrance to sinking of the lead terminal of the electronic part into the melted cream solder.

Abstract translation: 将电子部件固定到电路板上，使电子部件的引线与构成在电路板上的膏状焊膏接触，然后将电路板加热，使熔融焊膏熔化，从而焊接 电子部件到电路板。 在该方法中，粘合剂中的固化剂的熔融温度，即固着粘合剂的固化温度高于膏状焊剂的熔化温度，从而可以防止引线端子的下沉 电子部分进入熔化的奶油焊料。

公开(公告)号：US3896285A

公开(公告)日：1975-07-22

申请号：US36088173

申请日：1973-05-16

Applicant: HONEYWELL BULL SA

Inventor： DELORME RAYMOND LOUIS

IPC: H01R43/02 ,  H05K3/32 ,  B23K11/00

CPC classification number: H01R43/02 ,  H05K3/328 ,  H05K2201/10287 ,  H05K2201/10356 ,  H05K2201/10628

Abstract: A process and device are provided for welding a flat multiwire cable onto a printed circuit, the wires of the cable being evenly spaced and the printed circuit comprising conductive strips of equal spacing. In accordance with the invention, the conductors are stripped close to their end, bent so that their lower portion is of the same length as the conductive strip and undergo a preliminary cut. The lower portion of the wire is there inserted onto the conductive strip and heated. The portion which is preliminary cut, is removed by plying.

公开(公告)号：US3747051A

公开(公告)日：1973-07-17

申请号：US3747051D

申请日：1970-07-16

Applicant: AMP INC

Inventor： SWENGEL R ,  CRUMLEY J

IPC: B23K9/22 ,  H01R4/02 ,  H01R43/02 ,  H05K3/40 ,  H01R5/04

CPC classification number: B23K9/22 ,  H01R4/029 ,  H01R43/02 ,  H05K3/4046 ,  H05K2201/10295 ,  H05K2201/10303 ,  H05K2201/10628

Abstract: A welding method and means is disclosed utilizing a conductive foil disposed between or adjacent members to be welded together with the foil serving as one electrode and one or both of the members serving as another electrode of the welding circuit and with the members being forced together or with the foil being forced against the members by a separate electrode.

Abstract translation: 公开了一种焊接方法和装置，其使用设置在待焊接在一起的成员之间或相邻构件之间的导电箔，其中所述箔用作一个电极，并且所述构件中的一个或两个用作焊接电路的另一个电极，并且构件被强制在一起， 其中箔被单独的电极压在构件上。

公开(公告)号：US3737986A

公开(公告)日：1973-06-12

申请号：US3737986D

申请日：1971-11-26

Applicant: WESTERN ELECTRIC CO

Inventor： CRANSTON B

IPC: B23K20/08 ,  H01L21/00 ,  H01L21/607 ,  H05K1/03 ,  H05K3/20 ,  H05K3/32 ,  H05K3/38 ,  B01J17/00 ,  H01L7/02 ,  H01L7/16

CPC classification number: H01L21/67144 ,  B23K20/08 ,  H01L24/80 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K1/0306 ,  H05K3/202 ,  H05K3/328 ,  H05K3/38 ,  H05K2201/10628 ,  H05K2203/0271 ,  Y10T29/49121 ,  Y10T29/49144 ,  H01L2924/00 ,  H01L2224/48

Abstract: First workpieces, for example, beam-leaded integrated circuits, and the like, are bonded to second workpieces, for example, metallized ceramic substrates by first depositing a quantity of primary explosive, such as lead azide, onto each beam lead and then detonating the explosive to explosively bond the integrated circuits to the substrate. In another embodiment of the invention, the explosive bonding force is applied through a buffer sheet of plastic or metallic material which protects the surface of the substrate from contamination and which, in addition, dampens the shock of the explosion. In yet another embodiment of the invention, metal conductive paths are explosively bonded directly to a ceramic or glass substrate to form a ''''printed circuit pattern.'''' The same techniques are used to manufacture resistors, capacitors, inductors, etc.

公开(公告)号：US3499218A

公开(公告)日：1970-03-10

申请号：US3499218D

申请日：1966-10-31

Applicant: ELECTRO MECHANISMS INC

Inventor： DAHLGREN VICTOR F ,  TALLY SIDNEY K ,  STEARNS THOMAS H

IPC: H05K3/28 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K3/30

CPC classification number: H05K3/3426 ,  H05K3/28 ,  H05K3/281 ,  H05K3/328 ,  H05K3/3463 ,  H05K3/4015 ,  H05K2201/10628 ,  H05K2201/10946 ,  H05K2203/0264 ,  H05K2203/0582 ,  Y02P70/613 ,  Y10T29/49101 ,  Y10T29/49155 ,  Y10T156/1052

公开(公告)号：US3300851A

公开(公告)日：1967-01-31

申请号：US33527264

申请日：1964-01-02

Applicant: GEN ELECTRIC

Inventor： LODDER CLIFFORD K

IPC: H05K1/00 ,  H05K1/18 ,  H05K3/28 ,  H05K3/32 ,  H05K3/34

CPC classification number: H05K3/3421 ,  H05K1/0289 ,  H05K1/0393 ,  H05K1/189 ,  H05K3/281 ,  H05K3/328 ,  H05K2201/10287 ,  H05K2201/10628 ,  H05K2201/10651 ,  H05K2201/10977 ,  H05K2203/0285 ,  H05K2203/1189 ,  Y02P70/613 ,  Y10T29/4919