公开(公告)号：WO2004042797A3

公开(公告)日：2005-07-07

申请号：PCT/US0334705

申请日：2003-10-31

Applicant: GEORGIA TECH RES INST

Inventor： KOHL PAUL A ,  ALLEN SUEANN BIDSTRUP ,  HENDERSON CLIFFORD LEE ,  JAYACHANDRAN JOSEPH PAUL ,  REED HOLLIE ,  WHITE CELESTA E

IPC: B81B1/00 ,  B81C1/00 ,  H01L21/768 ,  C08J3/28 ,  G03C1/76 ,  G03C1/795 ,  G03C5/00 ,  G03C5/56

CPC classification number: B81C1/00476 ,  B81C2201/0108 ,  H01L21/7682 ,  Y10S430/114

Abstract: Polymers, methods of use thereof, and methods of decomposition thereof, are provided. One exemplary polymers, among others, includes, a composition having a sacrificial polymer and a pthotoacid generator.

Abstract translation: 提供聚合物，其使用方法及其分解方法。 一个示例性的聚合物，其中包括具有牺牲聚合物和光致酸产生剂的组合物。

公开(公告)号：WO2004042797A2

公开(公告)日：2004-05-21

申请号：PCT/US2003/034705

申请日：2003-10-31

Applicant: GEORGIA TECH RESEARCH CORPORATION

Inventor： KOHL, Paul, A. ,  ALLEN, SueAnn, Bidstrup ,  HENDERSON, Clifford, Lee ,  JAYACHANDRAN, Joseph, Paul ,  REED, Hollie ,  WHITE, Celesta, E.

IPC: H01L

CPC classification number: B81C1/00476 ,  B81C2201/0108 ,  H01L21/7682 ,  Y10S430/114

Abstract: Polymers, methods of use thereof, and methods of decomposition thereof, are provided. One exemplary polymers, among others, includes, a composition having a sacrificial polymer and a pthotoacid generator.

Abstract translation: 提供聚合物，其使用方法及其分解方法。 一个示例性的聚合物，其中包括具有牺牲聚合物和光致酸产生剂的组合物。

公开(公告)号：WO2004007349A1

公开(公告)日：2004-01-22

申请号：PCT/US2002/022251

申请日：2002-07-11

Applicant: HONEYWELL INTERNATIONAL INC.

Inventor： GUTIERREZ, David ,  BURGESS, Mary, C. ,  LUCIANI, Vincent, K.

IPC: B81C1/00

CPC classification number: B81C1/00476 ,  B81C2201/0108

Abstract: A method for using an organic dielectric as a sacrificial layer for forming suspended or otherwise spaced structures. The use of an organic dielectric has a number of advantages, including allowing use of an organic solvent or etch to remove the sacrificial layer. Organic solvents only remove organic materials, and thus do not affect or otherwise damage non-organic layers such as metal layers. This may reduce or eliminate the need for the rinsing and drying steps often associated with the use of acidic etchants such as Hydrofluoric Acid.

Abstract translation: 一种使用有机电介质作为牺牲层的方法，用于形成悬浮或其它间隔结构。 有机电介质的使用具有许多优点，包括允许使用有机溶剂或蚀刻去除牺牲层。 有机溶剂仅除去有机物质，因此不会影响或以其他方式损坏金属层等非有机层。 这可以减少或消除与使用酸性蚀刻剂如氢氟酸常常相关的漂洗和干燥步骤的需要。

公开(公告)号：WO2003040338A2

公开(公告)日：2003-05-15

申请号：PCT/US2002/035988

申请日：2002-11-08

Applicant: COVENTOR, INCORPORATED ,  SETT, Subham ,  CUNNINGHAM, Shawn, J.

Inventor： SETT, Subham ,  CUNNINGHAM, Shawn, J.

IPC: C12N

CPC classification number: B81B3/0024 ,  B81B3/0051 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/0015 ,  B81C2201/0107 ,  B81C2201/0108 ,  B81C2201/0109 ,  H01H1/04 ,  H01H1/504 ,  H01H59/0009 ,  H01H61/04 ,  H01H2001/0042 ,  H01H2001/0063 ,  H01H2001/0089 ,  H01H2059/0072 ,  H01H2061/006 ,  H01L23/3735 ,  H01L23/522 ,  H01L27/1203 ,  H01L2924/0002 ,  H01L2924/09701 ,  H02N1/006 ,  H02N10/00 ,  Y10T29/49222 ,  H01L2924/00

Abstract: A micro-scale interconnect device with internal heat spreader and method for fabricating same. The device includes first and second arrays of generally coplanar electrical communication lines. The first array is disposed generally along a first plane, and the second array is disposed generally along a second plane spaced from the first plane. The arrays are electrically isolated from each other. Embedded within the interconnect device is a heat spreader element. The heat spreader element comprises a dielectric material disposed in thermal contact with at least one of the arrays and a layer of thermally conductive material embedded in the dielectric material. The device is fabricated by forming layers of electrically conductive, dielectric, and thermally conductive materials on a substrate. The layers are arranged to enable heat energy given off by current-carrying communciation lines to be transferred away from the communciation lines.

Abstract translation: 具有内部散热器的微尺寸互连装置及其制造方法。 该装置包括大致共面电通信线路的第一和第二阵列。 第一阵列大致沿着第一平面布置，并且第二阵列通常沿着与第一平面间隔开的第二平面设置。 阵列彼此电隔离。 嵌入在互连装置内的是散热器元件。 散热器元件包括设置成与阵列中的至少一个热交换的介电材料和嵌入电介质材料中的导热材料层。 该器件通过在衬底上形成导电的，介电的和导热的材料层来制造。 这些层被布置成使得由载流通信线发出的热能被转移离开通信线。

公开(公告)号：US12128401B2

公开(公告)日：2024-10-29

申请号：US17947207

申请日：2022-09-19

Applicant: UNIST(ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY)

Inventor： Taesung Kim ,  Juyeol Bae

IPC: B29C33/38 ,  B01L3/00 ,  B29C33/52 ,  B81C1/00 ,  B29K83/00

CPC classification number: B01L3/502707 ,  B29C33/3842 ,  B29C33/52 ,  B81C1/00119 ,  B01L2300/0874 ,  B29K2083/00 ,  B81C2201/0108

Abstract: Provided is a microfluidic film including a first microfluidic film including a first base film, a first microchannel, which is formed on the first base film and through which a fluid flows, and a first through passage, which is configured to pass through the first base film, and a second microfluidic film including a second base film being stacked on the first base film and a second through passage, which is configured to pass through the second base film and communicates with the first through passage.

公开(公告)号：US12070307B2

公开(公告)日：2024-08-27

申请号：US17132165

申请日：2020-12-23

Applicant: International Business Machines Corporation

Inventor： Neil Ebejer ,  Ute Drechsler ,  Patrick Ruch

IPC: A61B5/145 ,  A61B5/00 ,  A61B5/1473 ,  H05K3/00 ,  A61B10/00

CPC classification number: A61B5/14514 ,  A61B5/1473 ,  A61B5/685 ,  H05K3/0014 ,  A61B2010/008 ,  A61B2562/125 ,  B81C2201/0101 ,  B81C2201/0108 ,  B81C2201/013 ,  B81C2201/0147 ,  B81C2201/056

Abstract: A sensor device, such as a biosensor, may comprise a polymer substrate, which is structured so as to form sets of microneedles and respective vias. The microneedles extend, each, from a base surface of the substrate. Each of the vias extends through a thickness of the substrate, thereby forming a corresponding set of apertures on the base surface. Each of the apertures is adjacent to a respective one of the microneedles. The device further may comprise two or more electrodes, these including a sensing electrode and a reference electrode. Each electrode may comprise an electrically conductive material layer that coats a region of the substrate, so as to coat at least some of the microneedles and neighboring portions of said base surface. Related devices, apparatuses, and methods of fabrication and use of such devices may be provided.

公开(公告)号：US09650538B2

公开(公告)日：2017-05-16

申请号：US14305767

申请日：2014-06-16

Applicant: SHIN-ETSU CHEMICAL CO., LTD.

Inventor： Hideto Kato ,  Hiroshi Kanbara ,  Tomoyoshi Furihata ,  Yoshinori Hirano

IPC: G03F7/023 ,  C09D163/04 ,  G03F7/022 ,  B81C1/00 ,  G03F7/40 ,  G03F7/30 ,  G03F7/20

CPC classification number: C09D163/04 ,  B81C1/00619 ,  B81C2201/0108 ,  G03F7/0226 ,  G03F7/0236 ,  G03F7/30 ,  G03F7/40 ,  G03F7/70466

Abstract: A micro-structure is manufactured by patterning a sacrificial film, forming an inorganic material film on the pattern, providing the inorganic material film with an aperture, and etching away the sacrificial film pattern through the aperture to define a space having the contour of the pattern. The patterning stage includes the steps of (A) forming a sacrificial film using a composition comprising a cresol novolac resin and a crosslinker, (B) exposing patternwise the film to first high-energy radiation, (C) developing, and (D) exposing the sacrificial film pattern to second high-energy radiation and heat treating for thereby forming crosslinks within the cresol novolac resin.

公开(公告)号：US20170113925A1

公开(公告)日：2017-04-27

申请号：US15297662

申请日：2016-10-19

Applicant: Commissariat a L'Energie Atomique et aux Energies Alternatives

Inventor： Patrice REY

IPC: B81C1/00

CPC classification number: B81C1/0023 ,  B81C1/00333 ,  B81C2201/0108 ,  B81C2201/0109 ,  B81C2201/0126 ,  B81C2201/014 ,  B81C2201/056 ,  B81C2203/01 ,  B81C2203/0792

Abstract: Method for encapsulation of a microelectronic component, including making of a portion of sacrificial material on a front face of a first substrate in which the component is intended to be made, then making of a cover encapsulating the portion of sacrificial material, then making of the component by etching the first substrate from its back face, such that part of the component is arranged to face the portion of sacrificial material and such that the portion of sacrificial material is accessible from a back face of the component, then elimination of the portion of sacrificial material by etching from the back face of the component, then securing of the back face of the component to a second substrate.

公开(公告)号：US09567213B1

公开(公告)日：2017-02-14

申请号：US14827683

申请日：2015-08-17

Applicant: Texas Instruments Incorporated

Inventor： John Charles Ehmke ,  Virgil Cotoco Ararao

IPC: H01L21/00 ,  H01L21/44 ,  H01L21/31 ,  G02B6/12 ,  G02B5/124 ,  G09G3/34 ,  H01J5/00 ,  H01L23/02 ,  B81C1/00 ,  B81B7/00 ,  G02B26/08 ,  G02B6/42 ,  G02B26/00 ,  B82Y30/00

CPC classification number: B81B7/0038 ,  B81B2203/0315 ,  B81C1/00269 ,  B81C1/00285 ,  B81C1/00293 ,  B81C2201/0108 ,  B81C2201/013 ,  B81C2201/0188 ,  B81C2201/0198 ,  B81C2201/053 ,  B81C2203/0109 ,  B81C2203/0118 ,  B81C2203/019 ,  B81C2203/035 ,  B82Y30/00 ,  G02B6/4204 ,  G02B6/4208 ,  G02B6/4248 ,  G02B26/001 ,  G02B26/0833 ,  H01L24/03 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/94 ,  H01L2224/03612 ,  H01L2224/03614 ,  H01L2224/039 ,  H01L2224/04026 ,  H01L2224/05083 ,  H01L2224/05109 ,  H01L2224/05123 ,  H01L2224/05138 ,  H01L2224/05163 ,  H01L2224/05166 ,  H01L2224/0517 ,  H01L2224/05562 ,  H01L2224/27462 ,  H01L2224/2747 ,  H01L2224/279 ,  H01L2224/29006 ,  H01L2224/29011 ,  H01L2224/29023 ,  H01L2224/29109 ,  H01L2224/29144 ,  H01L2224/32058 ,  H01L2224/32227 ,  H01L2224/83121 ,  H01L2224/83193 ,  H01L2224/8381 ,  H01L2224/83825 ,  H01L2224/94 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01074 ,  H01L2924/1461 ,  H01L2924/164 ,  H01L2924/00014 ,  H01L2924/01049 ,  H01L2224/03 ,  H01L2924/01042 ,  H01L2924/01072 ,  H01L2924/01004 ,  H01L2224/83 ,  H01L2224/0345 ,  H01L2224/0361 ,  H01L2224/03462

Abstract: A hermetic package comprising a substrate (110) having a surface with a MEMS structure (101) of a first height (101a), the substrate hermetically sealed to a cap (120) forming a cavity over the MEMS structure; the cap attached to the substrate surface by a vertical stack (130) of metal layers adhering to the substrate surface and to the cap, the stack having a continuous outline surrounding the MEMS structure while spaced from the MEMS structure by a distance (140); the stack having a bottom first metal seed film (131a) adhering to the substrate and a bottom second metal seed film (131b) adhering to the bottom first seed film, both seed films of a first width (131c) and a common sidewall (138); further a top first metal seed film (132a) adhering to the cap and a top second metal seed film (132b) adhering to the top first seed film, both seed films with a second width (132c) smaller than the first width and a common sidewall (139); the bottom and top metal seed films tied to a metal layer (135) including gold-indium intermetallic compounds, layer (135) having a second height (133a) greater than the first height and encasing the seed films and common sidewalls.

Abstract translation: 一种密封包装，其包括具有具有第一高度（101a）的MEMS结构（101）的表面的基底（110），所述基底被气密地密封到在所述MEMS结构上形成空腔的帽（120） 所述盖通过粘附到所述基板表面和所述盖的金属层的垂直堆叠（130）附接到所述基板表面，所述堆叠具有围绕所述MEMS结构的连续轮廓，同时与所述MEMS结构隔开距离（140）; 所述堆叠具有附着到所述基板的底部第一金属种子膜（131a）和粘附到所述底部第一种子膜的底部第二金属种子膜（131b），具有第一宽度（131c）和公共侧壁（138）的两种种子膜 ）; 另外，粘附到盖的顶部第一金属种子膜（132a）和粘附到顶部第一种子膜的顶部第二金属种子膜（132b），具有小于第一宽度的第二宽度（132c）的两种种子膜和共同的 侧壁（139）; 连接到包括金 - 铟金属间化合物的金属层（135）的底部和顶部金属种子膜，具有大于第一高度的第二高度（133a）的层（135）并且包围种子膜和共同侧壁。

公开(公告)号：US09550023B2

公开(公告)日：2017-01-24

申请号：US14317854

申请日：2014-06-27

Applicant: Changlin Pang ,  Jason Shih ,  Fukang Jiang ,  Changgeng Liu ,  Sean Caffey ,  Andrew Urazaki

Inventor： Changlin Pang ,  Jason Shih ,  Fukang Jiang ,  Changgeng Liu ,  Sean Caffey ,  Andrew Urazaki

IPC: B29C59/14 ,  A61M5/145 ,  B44C1/22 ,  F04B43/00 ,  F04B45/04 ,  B81C99/00 ,  A61M5/142 ,  B29K23/00 ,  F16K99/00

CPC classification number: A61M5/14586 ,  A61M5/14276 ,  A61M2005/14204 ,  B29C59/14 ,  B29C2791/004 ,  B29K2023/00 ,  B81B2203/0127 ,  B81C99/008 ,  B81C2201/0108 ,  F04B43/0054 ,  F04B45/04 ,  F16K2099/008

Abstract: A removable material is deposited or otherwise applied to a flat substrate surface in a pattern corresponding to desired corrugations in a membrane, e.g., a deflection diaphragm. The applied material serves as a scaffold for a polymeric material, which is applied thereover, and following cure or hardening, the polymeric material is removed to form a finished corrugated membrane.

Abstract translation: 将可移除材料沉积或以其它方式施加到平坦的基底表面上，图案对应于膜（例如偏转膜片）中的期望波纹。 施加的材料用作聚合材料的支架，其被施加到其上，并且在固化或硬化之后，去除聚合物材料以形成成品波纹膜。