公开(公告)号：US07001793B2

公开(公告)日：2006-02-21

申请号：US10791840

申请日：2004-03-04

Applicant: Kia Silverbrook

Inventor： Kia Silverbrook

IPC: H01L21/00

CPC classification number: B81C1/00333 ,  B29C33/0022 ,  B29C43/36 ,  B29C2035/0822 ,  B29C2043/503 ,  B81C1/00904 ,  B81C2201/034 ,  B81C2203/0109 ,  B81C2203/0127 ,  H01L21/4803 ,  H01L23/04 ,  H01L2924/0002 ,  H01L2924/16235 ,  H01L2924/00

Abstract: A method of using protective caps (160) applied to a first side of a wafer (150) in the production of microfabricated devices (152), such as micro-electro-mechanical systems (MEMS) devices. One cap (160) covers each microfabricated device or group respectively, such that a gap remains between adjacent protective caps. One or more etches are applied to the gaps between the caps to remove material and separate the wafer into separate units.

Abstract translation: 在制造微机电系统（MEMS）装置的微加工装置（152）中使用施加到晶片（150）的第一侧的保护帽（160）的方法。 一个盖（160）分别覆盖每个微加工装置或组，使得相邻保护盖之间保留间隙。 将一个或多个蚀刻施加到盖之间的间隙以移除材料并将晶片分离成单独的单元。

公开(公告)号：US20050258570A1

公开(公告)日：2005-11-24

申请号：US10852448

申请日：2004-05-24

Applicant: Yen Kong ,  Hong Low ,  Stella Pang ,  Albert Yee

Inventor： Yen Kong ,  Hong Low ,  Stella Pang ,  Albert Yee

IPC: B28B11/08 ,  B29C59/02 ,  B81C1/00 ,  B81C99/00 ,  B82B3/00 ,  G03C5/00 ,  G03F7/00

CPC classification number: A61M25/00 ,  B27N3/08 ,  B28B3/06 ,  B81C99/0085 ,  B81C2201/034 ,  B81C2203/032 ,  B81C2203/038 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  Y10T428/24479 ,  Y10T428/254

Abstract: The present invention is directed to micro- and nano-scale imprinting methods and the use of such methods to fabricate supported and/or free-standing 3-D micro- and/or nano-structures of polymeric, ceramic, and/or metallic materials. In some embodiments, a duo-mold approach is employed in the fabrication of these structures. In such methods, surface treatments are employed to impart differential surface energies to different molds and/or different parts of the mold(s). Such surface treatments permit the formation of three-dimensional (3-D) structures through imprinting and the transfer of such structures to a substrate. In some or other embodiments, such surface treatments and variation in glass transition temperature of the polymers used can facilitate separation of the 3-D structures from the molds to form free-standing micro- and/or nano-structures individually and/or in a film. In some or other embodiments, a “latch-on” assembly technique is utilized to form supported and/or free-standing stacked micro- and/or nano-structures that enable the assembly of polymers without a glass transition temperature and eliminate the heating required to assemble thermoplastic polymers.

Abstract translation: 本发明涉及微尺度和纳米级压印方法，并且使用这种方法来制造聚合物，陶瓷和/或金属材料的负载和/或独立的3-D微观和/或纳米结构 。 在一些实施例中，在制造这些结构中采用双模方法。 在这种方法中，使用表面处理以将不同的表面能赋予模具的不同模具和/或模具的不同部分。 这种表面处理允许通过压印形成三维（3-D）结构并将这种结构转移到基底上。 在一些或其它实施方案中，所使用的聚合物的这种表面处理和玻璃化转变温度的变化可促进3-D结构与模具的分离，以单独形成独立的和/或纳米结构，并且/ 电影。 在一些或其它实施方案中，使用“闭锁”组装技术来形成支撑和/或独立堆叠的微结构和/或纳米结构，其能够组装聚合物而不具有玻璃化转变温度并消除所需的加热 组装热塑性聚合物。

公开(公告)号：US20050226742A1

公开(公告)日：2005-10-13

申请号：US11129167

申请日：2005-05-13

Applicant: Marc Unger ,  Hou-Pu Chou ,  Todd Thorsen ,  Axel Scherer ,  Stephen Quake

Inventor： Marc Unger ,  Hou-Pu Chou ,  Todd Thorsen ,  Axel Scherer ,  Stephen Quake

IPC: G03F7/20 ,  B01L3/00 ,  B81B1/00 ,  B81B3/00 ,  B81B7/00 ,  B81C1/00 ,  B81C99/00 ,  C12Q1/68 ,  F04B17/00 ,  F04B35/04 ,  F04B43/04 ,  F15C5/00 ,  F16K7/00 ,  F16K17/02 ,  F16K99/00

CPC classification number: B29C51/00 ,  B01L3/502707 ,  B01L3/50273 ,  B01L3/502738 ,  B01L2300/0861 ,  B01L2300/0887 ,  B01L2300/123 ,  B01L2400/046 ,  B01L2400/0481 ,  B01L2400/0655 ,  B33Y80/00 ,  B81B5/00 ,  B81B2201/036 ,  B81B2201/054 ,  B81C1/00119 ,  B81C2201/019 ,  B81C2201/034 ,  C12Q1/6874 ,  F04B43/043 ,  F15C1/06 ,  F15C5/00 ,  F16K11/20 ,  F16K13/00 ,  F16K31/126 ,  F16K99/0001 ,  F16K99/0015 ,  F16K99/0046 ,  F16K99/0048 ,  F16K99/0051 ,  F16K99/0059 ,  F16K2099/0074 ,  F16K2099/0076 ,  F16K2099/0078 ,  F16K2099/008 ,  F16K2099/0094 ,  Y10T137/0491 ,  Y10T137/0497 ,  Y10T137/2224 ,  Y10T137/87249 ,  Y10T156/10 ,  Y10T428/24479 ,  Y10T428/24744 ,  C12Q2535/125

Abstract: A method of fabricating an elastomeric structure, comprising: forming a first elastomeric layer on top of a first micromachined mold, the first micromachined mold having a first raised protrusion which forms a first recess extending along a bottom surface of the first elastomeric layer; forming a second elastomeric layer on top of a second micromachined mold, the second micromachined mold having a second raised protrusion which forms a second recess extending along a bottom surface of the second elastomeric layer; bonding the bottom surface of the second elastomeric layer onto a top surface of the first elastomeric layer such that a control channel forms in the second recess between the first and second elastomeric layers; and positioning the first elastomeric layer on top of a planar substrate such that a flow channel forms in the first recess between the first elastomeric layer and the planar substrate.

公开(公告)号：US20050199584A1

公开(公告)日：2005-09-15

申请号：US10911049

申请日：2004-08-04

Applicant: Ralph Nuzzo ,  William Childs

Inventor： Ralph Nuzzo ,  William Childs

IPC: B81C99/00 ,  B32B3/00 ,  B44C1/165 ,  B81C1/00 ,  C03C25/68 ,  G03F7/00

CPC classification number: B81C1/0046 ,  B81C2201/034 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  Y10T428/24562 ,  Y10T428/24628

Abstract: A method of making a microstructure includes forming a pattern in a surface of a silicon-containing elastomer, oxidizing the pattern, contacting the pattern with a substrate; and bonding the oxidized pattern and the substrate such that the pattern and the substrate are irreversibly attached. The silicon-containing elastomer may be removably attached to a transfer pad.

Abstract translation: 制造微结构的方法包括在含硅弹性体的表面形成图案，氧化图案，使图案与基板接触; 并且结合氧化图案和基板，使得图案和基板不可逆地附着。 含硅弹性体可以可移除地附接到转移垫。

公开(公告)号：US20050151371A1

公开(公告)日：2005-07-14

申请号：US10754286

申请日：2004-01-08

Applicant: Blake Simmons ,  Linda Domeier ,  Noble Woo ,  Timothy Shepodd ,  Ronald Renzi

Inventor： Blake Simmons ,  Linda Domeier ,  Noble Woo ,  Timothy Shepodd ,  Ronald Renzi

IPC: B01L99/00 ,  B81C3/00 ,  F15C5/00 ,  F16K99/00 ,  F16L39/00

CPC classification number: F16K99/0001 ,  B81C3/002 ,  B81C2201/034 ,  F15C5/00 ,  F16K2099/0076 ,  F16K2099/0078 ,  F16K2099/008 ,  Y10T436/11 ,  Y10T436/2575

Abstract: Injection molding is used to form microfluidic devices with integrated functional components. One or more functional components are placed in a mold cavity which is then closed. Molten thermoplastic resin is injected into the mold and then cooled, thereby forming a solid substrate including the functional component(s). The solid substrate including the functional component(s) is then bonded to a second substrate which may include microchannels or other features.

Abstract translation: 注射成型用于形成具有集成功能组件的微流体装置。 将一个或多个功能部件放置在模腔中，然后关闭模腔。 将熔融的热塑性树脂注入模具中，然后冷却，从而形成包括功能组分的固体基材。 然后将包括功能组分的固体基质结合到可包括微通道或其它特征的第二基底。

公开(公告)号：US20040222349A1

公开(公告)日：2004-11-11

申请号：US10626391

申请日：2003-07-24

Inventor： Kenneth G. Powell ,  Larry A. Monahan ,  Burton H. Sage JR.

IPC: B29C033/38 ,  B29C033/56 ,  B29C043/02 ,  B29C045/37

CPC classification number: B29C33/405 ,  A61M37/0015 ,  A61M2037/0046 ,  A61M2037/0053 ,  B29C33/424 ,  B29C45/372 ,  B29C2045/0094 ,  B29K2883/00 ,  B29L2031/7544 ,  B29L2031/756 ,  B81B2201/055 ,  B81C1/00111 ,  B81C2201/034

Abstract: A device, preferably a micro-device, is molded from a plastic material by injection molding, compression molding or embossing. A microabrader can be molded having microneedles for abrading the stratum corneum of the skin to form an abraded site in the tissue for enhancing drug delivery. The micro-device is molded using a mold assembly having a silicon molding surface. The silicon molding surface can include a recess corresponding to the desired shape and length of the microneedles. The silicon molding surface enables micron and submicron size features to be molded from polymeric materials without the polymeric material adhering to the mold surface. Micro-devices having molded features having micron and submicron dimensions can be rapidly produced without the use of a release agent.

Abstract translation: 一种装置，优选一种微型装置，通过注塑，压塑或压花由塑料材料模制。 微型造型机可以模制成具有用于研磨皮肤角质层的微针，以在组织中形成用于增强药物递送的磨损部位。 使用具有硅模制表面的模具组件来模制微型装置。 硅成型表面可以包括对应于所需形状和长度的微针的凹部。 硅成型表面使得微米和亚微米尺寸的特征能够由聚合物材料模制而不会使聚合材料粘附到模具表面。 具有微米和亚微米尺寸的模制特征的微型装置可以在不使用脱模剂的情况下快速生产。

公开(公告)号：US06793753B2

公开(公告)日：2004-09-21

申请号：US09796378

申请日：2001-02-28

Applicant: Marc A. Unger ,  Hou-Pu Chou ,  Todd A. Thorsen ,  Axel Scherer ,  Stephen R. Quake

Inventor： Marc A. Unger ,  Hou-Pu Chou ,  Todd A. Thorsen ,  Axel Scherer ,  Stephen R. Quake

IPC: F16K1120

CPC classification number: B29C51/00 ,  B01L3/502707 ,  B01L3/50273 ,  B01L3/502738 ,  B01L2300/0861 ,  B01L2300/0887 ,  B01L2300/123 ,  B01L2400/046 ,  B01L2400/0481 ,  B01L2400/0655 ,  B33Y80/00 ,  B81B5/00 ,  B81B2201/036 ,  B81B2201/054 ,  B81C1/00119 ,  B81C2201/019 ,  B81C2201/034 ,  C12Q1/6874 ,  F04B43/043 ,  F15C1/06 ,  F15C5/00 ,  F16K11/20 ,  F16K13/00 ,  F16K31/126 ,  F16K99/0001 ,  F16K99/0015 ,  F16K99/0046 ,  F16K99/0048 ,  F16K99/0051 ,  F16K99/0059 ,  F16K2099/0074 ,  F16K2099/0076 ,  F16K2099/0078 ,  F16K2099/008 ,  F16K2099/0094 ,  Y10T137/0491 ,  Y10T137/0497 ,  Y10T137/2224 ,  Y10T137/87249 ,  Y10T156/10 ,  Y10T428/24479 ,  Y10T428/24744 ,  C12Q2535/125

Abstract: A method of fabricating an elastomeric structure, comprising: forming a first elastomeric layer on top of a first micromachined mold, the first micromachined mold having a first raised protrusion which forms a first recess extending along a bottom surface of the first elastomeric layer; forming a second elastomeric layer on top of a second micromachined mold, the second micromachined mold having a second raised protrusion which forms a second recess extending along a bottom surface of the second elastomeric layer; bonding the bottom surface of the second elastomeric layer onto a top surface of the first elastomeric layer such that a control channel forms in the second recess between the first and second elastomeric layers; and positioning the first elastomeric layer on top of a planar substrate such that a flow channel forms in the first recess between the first elastomeric layer and the planar substrate.

Abstract translation: 一种制造弹性体结构的方法，包括：在第一微加工模具的顶部上形成第一弹性体层，所述第一微加工模具具有形成沿所述第一弹性体层的底表面延伸的第一凹槽的第一凸起突起; 在第二微加工模具的顶部上形成第二弹性体层，所述第二微加工模具具有第二凸起突起，所述第二凸起突起形成沿所述第二弹性体层的底表面延伸的第二凹槽; 将第二弹性体层的底表面粘合到第一弹性体层的顶表面上，使得控制通道在第一和第二弹性体层之间的第二凹部中形成; 以及将第一弹性体层定位在平面基底的顶部上，使得流动通道在第一弹性体层和平面基底之间的第一凹部中形成。

公开(公告)号：US06777259B2

公开(公告)日：2004-08-17

申请号：US10129505

申请日：2002-05-06

Applicant: Kia Silverbrook

Inventor： Kia Silverbrook

IPC: H01L21784

CPC classification number: H01L23/315 ,  B29C33/0022 ,  B29C43/36 ,  B29C2035/0822 ,  B29C2043/503 ,  B81B2201/0235 ,  B81B2207/056 ,  B81C1/00269 ,  B81C1/00333 ,  B81C1/00904 ,  B81C2201/034 ,  B81C2203/0127 ,  G01P1/023 ,  G01P15/0802 ,  H01L23/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An accelerometer chip (202) has a molded thermoplastic cap (210) applied on one surface to provide a cavity into which the cantilevered mass (204) of the accelerometer may move. An array of caps is applied to a wafer of accelerometer chips (202) before singulation of the wafer.

Abstract translation: 加速度计芯片（202）具有在一个表面上施加的模制的热塑性帽（210），以提供加速度计的悬臂式物体（204）能够移动的空腔。 在晶片分离之前，将一组盖子施加到加速度计芯片（202）的晶片上。

公开(公告)号：US20040146611A1

公开(公告)日：2004-07-29

申请号：US10727124

申请日：2003-12-03

Applicant: The Procter & Gamble Company

Inventor： Francisco Arias ,  Faiz Feisal Sherman ,  Grover David Owens

IPC: C12C001/027

CPC classification number: A61B5/1411 ,  A61B5/14514 ,  A61B5/150022 ,  A61B5/150282 ,  A61B5/150419 ,  A61B5/150984 ,  A61M37/0015 ,  A61M2037/0038 ,  A61M2037/0053 ,  B81B2201/055 ,  B81C1/00111 ,  B81C2201/034

Abstract: A method for manufacturing microneedle structures is disclosed using soft lithography and photolithography, in which micromold structures made of a photoresist material or PDMS are created. The micromold manufacturing occurs quite quickly, using inexpensive materials and processes. Once the molds are available, using moldable materials such as polymers, microneedle arrays can be molded or embossed in relatively fast procedures. In some cases a sacrificial layer is provided between the forming micromold and its substrate layer, for ease of separation. The microneedles themselves can be solid projections, hollow nullmicrotubes,null or shallow nullmicrocups.null Electrodes can be formed on the microneedle arrays, including individual electrodes per hollow microtube.

Abstract translation: 公开了使用软光刻和光刻技术制造微针结构的方法，其中制造由光致抗蚀剂材料或PDMS制成的微型结构。 使用廉价的材料和工艺，微型制造相当快速地发生。 一旦模具可用，使用可模塑材料如聚合物，微针阵列可以以相对较快的程序模制或压花。 在一些情况下，为了易于分离，在成形微胶体与其基底层之间提供牺牲层。 微针本身可以是固体突起，中空的“微管”或浅的“微型杯”。 电极可以形成在微针阵列上，包括每个中空微管的单个电极。

公开(公告)号：US06752942B2

公开(公告)日：2004-06-22

申请号：US10016614

申请日：2001-10-30

Applicant: Enoch Kim ,  Younan Xia ,  Milan Mrksich ,  Rebecca J. Jackman ,  Xiao-Mei Zhao ,  Stephen P. Smith ,  Mara G. Prentiss ,  George M. Whitesides ,  Christian Marzolin

Inventor： Enoch Kim ,  Younan Xia ,  Milan Mrksich ,  Rebecca J. Jackman ,  Xiao-Mei Zhao ,  Stephen P. Smith ,  Mara G. Prentiss ,  George M. Whitesides ,  Christian Marzolin

IPC: B29C4102

CPC classification number: B81C1/00206 ,  A61K47/6957 ,  B01J19/0046 ,  B01J2219/00382 ,  B01J2219/00416 ,  B01J2219/0043 ,  B01J2219/00466 ,  B01J2219/00605 ,  B01J2219/0061 ,  B01J2219/00612 ,  B01J2219/00619 ,  B01J2219/00626 ,  B01J2219/0063 ,  B01J2219/00637 ,  B01J2219/00648 ,  B01J2219/00659 ,  B01J2219/00713 ,  B29C31/04 ,  B29C33/42 ,  B29C37/0053 ,  B29C39/24 ,  B29C43/021 ,  B29C67/246 ,  B29D11/00346 ,  B29D11/00663 ,  B29K2105/0002 ,  B29L2011/0016 ,  B81B2201/0214 ,  B81C1/00031 ,  B81C99/0085 ,  B81C2201/034 ,  B82Y30/00 ,  C40B60/14 ,  G01N21/7703 ,  G01N2021/7776 ,  G02B6/138 ,  H05K3/0079 ,  H05K3/061

Abstract: Chemically or biochemically active agents or other species are patterned on a substrate surface by providing a micromold having a contoured surface and forming, on a substrate surface, a chemically or biochemically active agent or fluid precursor of a structure. A chemically or biochemically active agent or fluid precursor also can be transferred from indentations in an applicator to a substrate surface. The substrate surface can be planar or non-planar. Fluid precursors of polymeric structures, inorganic ceramics and salts, and the like can be used to form patterned polymeric articles, inorganic salts and ceramics, reactive ion etch masks, etc. at the surface. The articles can be formed in a pattern including a portion having a lateral dimension of less than about 1 millimeter or smaller. The indentation pattern of the applicator can be used to transfer separate, distinct chemically or biochemically active agents or fluid precursors to separate, isolated regions of a substrate surface. Waveguide arrays, combinatorial chemical or biochemical libraries, etc. can be made. Differences in refractive index of waveguide and cladding can be created by subjecting the waveguide and cladding, made of identical prepolymeric material, to different polymerization or cross-linking conditions. Interferometers are defined by coupling arrays of waveguides, where coupling can be controlled by altering the difference in refractive index between cladding and waveguide at any desired location of the array. Alteration and refractive index can be created photochemically, chemically, or the like. Sensors also are disclosed, including biochemical sensors.

Abstract translation: 化学或生物化学活性剂或其它物质通过提供具有轮廓表面的微胶体并在基底表面上形成结构的化学或生物化学活性剂或流体前体而在基底表面上图案化。 化学或生物化学活性剂或流体前体也可以从敷料器中的凹陷转移到基底表面。 衬底表面可以是平面的或非平面的。 聚合物结构，无机陶瓷和盐等的流体前体可用于在表面形成图案化聚合物制品，无机盐和陶瓷，反应离子蚀刻掩模等。 制品可以形成为包括横向尺寸小于约1毫米或更小的部分的图案。 涂抹器的压痕图案可以用于将单独的，不同的化学或生物化学活性剂或流体前体转移到基底表面的分离的，分离的区域。 可以制作波导阵列，组合化学或生物化学库等。 可以通过将由相同的预聚物材料制成的波导和包层进行不同的聚合或交联条件来产生波导和包层的折射率差异。 干涉仪通过耦合波导阵列来定义，其中可以通过改变阵列的任何所需位置处的包层和波导之间的折射率差来控制耦合。 改变和折射率可以通过光化学，化学等方式产生。 还公开了传感器，包括生化传感器。