公开(公告)号：US20080206553A1

公开(公告)日：2008-08-28

申请号：US12066340

申请日：2006-08-31

Applicant: Norbert Schneider ,  Gerald Lippert ,  Rene Lochtman ,  Heiko Maas ,  Jurgen Pfister ,  Bettina Sobotka ,  Norbert Wagner

Inventor： Norbert Schneider ,  Gerald Lippert ,  Rene Lochtman ,  Heiko Maas ,  Jurgen Pfister ,  Bettina Sobotka ,  Norbert Wagner

IPC: B32B33/00 ,  C09D5/24 ,  C25D5/54 ,  B05D5/12

CPC classification number: H01B1/22 ,  C09D5/24 ,  H05K1/095 ,  H05K3/246 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0272 ,  H05K2201/0347 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/258

Abstract: The present invention relates to a dispersion for application of a metal layer on a substrate that is not electrically conductive, comprising an organic binder component, a metal component with different metals and/or metal particle shapes, and with a solvent component. The invention moreover relates to a process for preparation of the dispersion, to a process using the dispersion for production of a metal layer, if appropriate structured, and to the resultant substrate surfaces and their use.

Abstract translation: 本发明涉及一种用于在不导电的基底上施加金属层的分散体，其包含有机粘合剂组分，具有不同金属和/或金属颗粒形状的金属组分以及溶剂组分。 本发明还涉及制备分散体的方法，使用该分散体制备金属层的方法，如果合适的结构，以及所得到的基材表面及其用途。

公开(公告)号：US20080143906A1

公开(公告)日：2008-06-19

申请号：US11871767

申请日：2007-10-12

Applicant: Pierre-Marc Allemand ,  Haixia Dai ,  Shuo Na ,  Hash Pakbaz ,  Florian Pschenitzka ,  Xina Quan ,  Jelena Sepa ,  Michael A. Spaid

Inventor： Pierre-Marc Allemand ,  Haixia Dai ,  Shuo Na ,  Hash Pakbaz ,  Florian Pschenitzka ,  Xina Quan ,  Jelena Sepa ,  Michael A. Spaid

IPC: G02F1/136 ,  H05K1/09 ,  H01L31/0224 ,  H01J1/62 ,  H01J17/04 ,  H05K3/00

CPC classification number: H01L31/022425 ,  B82Y10/00 ,  B82Y20/00 ,  B82Y30/00 ,  G02F1/13439 ,  H01B1/02 ,  H01L27/1421 ,  H01L29/0669 ,  H01L29/413 ,  H01L31/022466 ,  H01L31/068 ,  H01L31/0687 ,  H01L31/1884 ,  H01L33/38 ,  H01L33/40 ,  H01L51/0021 ,  H01L51/0048 ,  H01L51/102 ,  H01L51/5206 ,  H01L51/5212 ,  H05K1/095 ,  H05K1/097 ,  H05K3/06 ,  H05K3/245 ,  H05K3/249 ,  H05K9/009 ,  H05K9/0092 ,  H05K2201/0108 ,  H05K2201/0248 ,  H05K2201/0257 ,  H05K2201/026 ,  Y02E10/549 ,  Y02P70/521 ,  Y10S977/95 ,  Y10T29/49155

Abstract: A transparent conductor including a conductive layer coated on a substrate is described. More specifically, the conductive layer comprises a network of nanowires that may be embedded in a matrix. The conductive layer is optically clear, patternable and is suitable as a transparent electrode in visual display devices such as touch screens, liquid crystal displays, plasma display panels and the like.

Abstract translation: 描述了包括涂覆在基板上的导电层的透明导体。 更具体地，导电层包括可嵌入矩阵中的纳米线网络。 导电层是透明的，可图案化的，并且适合作为诸如触摸屏，液晶显示器，等离子显示面板等的视觉显示装置中的透明电极。

公开(公告)号：US07285152B2

公开(公告)日：2007-10-23

申请号：US10782909

申请日：2004-02-23

Applicant: Kohei Shimoda ,  Masatoshi Majima ,  Keiji Koyama ,  Issei Okada ,  Tetsuya Kuwabara

Inventor： Kohei Shimoda ,  Masatoshi Majima ,  Keiji Koyama ,  Issei Okada ,  Tetsuya Kuwabara

IPC: B22F9/24

CPC classification number: H05K3/321 ,  B22F1/0007 ,  B22F1/0022 ,  B22F1/0096 ,  B22F9/24 ,  B22F2998/00 ,  B82Y30/00 ,  C08K3/08 ,  C09D5/24 ,  H01B1/02 ,  H01B1/22 ,  H05K2201/0248 ,  C08L21/00

Abstract: A method of manufacturing the chain-structure metal powder comprises precipitating a metal powder by a reaction performed in an aqueous solution in which nickel ions, complex ions, and titanium ions containing trivalent titanium ions (Ti3+) and tetravalent titanium ions (Ti4+) are present.

Abstract translation: 制造链状结构金属粉末的方法包括通过在其中存在镍离子，配合离子和含有三价钛离子（Ti 3+）和四价钛离子（Ti 4+）的钛离子的水溶液中进行的反应而沉淀金属粉末 。

公开(公告)号：US20070054104A1

公开(公告)日：2007-03-08

申请号：US11388669

申请日：2006-03-23

Applicant: Steven Ittel ,  Jennifer White

Inventor： Steven Ittel ,  Jennifer White

IPC: D04H13/00

CPC classification number: B05D1/06 ,  B82Y10/00 ,  H01B1/22 ,  H05K1/092 ,  H05K1/097 ,  H05K3/1241 ,  H05K2201/0248 ,  H05K2201/026 ,  H05K2203/0126 ,  Y10T428/249924 ,  Y10T428/29

Abstract: Processes for printing conductors, insulators, dielectrics, phosphors, emitters, and other elements containing elongated functional particles aligned along the axis of a spun fiber or film that can be for electronics and display applications are provided. Also provided are viscoelastic compositions used in the processes, and devices made therefrom.

Abstract translation: 提供了用于印刷导体，绝缘体，电介质，磷光体，发射体和其它包含可以用于电子和显示应用的纺丝纤维或薄膜轴线对准的细长功能颗粒的元件。 还提供了用于该方法的粘弹性组合物和由其制备的装置。

公开(公告)号：US20070026221A1

公开(公告)日：2007-02-01

申请号：US11529181

申请日：2006-09-28

Applicant: Gary Stevens ,  James Smith ,  John Wood

Inventor： Gary Stevens ,  James Smith ,  John Wood

IPC: B32B5/14 ,  B32B18/00 ,  G11B11/105

CPC classification number: C09K5/14 ,  H01F27/2871 ,  H01F41/127 ,  H01L21/316 ,  H02K3/40 ,  H02K9/22 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0248 ,  Y10T428/249959 ,  Y10T428/252 ,  Y10T428/26 ,  Y10T428/2916

Abstract: A high thermal conductivity resin that has a host resin matrix, and a high thermal conductivity filler. The high thermal conductivity filler (30) forms a continuous organic-inorganic composite with the host resin matrix. The fillers are from 1-1000 nm in length, and have average aspect ratios of between 3-100. At least a portion of the high thermal conductivity fillers comprise morphologies (31) chosen from one or more of hexagonal, cubic, orthorhombic, rhombohedral, tetragonal, whiskers and tubes. In particular, some of the fillers will aggregate into secondary structures.

Abstract translation: 具有主体树脂基体和高导热性填料的高导热性树脂。 高导热性填料（30）与主体树脂基体形成连续的有机 - 无机复合材料。 填料的长度为1-1000nm，平均纵横比在3-100之间。 高导热性填料的至少一部分包含选自六方晶系，立方晶型，正交型，菱方晶型，四方晶系，晶须和管中的一种或多种的形态（31）。 特别地，一些填料将聚集成二级结构。

公开(公告)号：US20060280873A1

公开(公告)日：2006-12-14

申请号：US11397000

申请日：2006-04-03

Applicant: James Smith ,  Gary Stevens ,  John Wood

Inventor： James Smith ,  Gary Stevens ,  John Wood

IPC: B05D3/02 ,  B05D1/18

CPC classification number: H05K1/0373 ,  C08K3/00 ,  C08K9/00 ,  H01F27/2871 ,  H01F41/127 ,  H01L21/316 ,  H02K3/40 ,  H02K9/22 ,  H05K2201/0209 ,  H05K2201/0248

Abstract: In one embodiment the present invention provides for a method of forming HTC dendritic fillers 40 within a host resin matrix that comprises adding HTC seeds 42 to the host resin matrix. The HTC seeds have been surface functionalized to not substantially react with one another. The seeds then accumulate HTC building blocks 42, and the HTC building blocks have also been surface functionalized to not substantially react with one another. Then assembling the HTC building blocks with the HTC seeds to produce HTC dendritic fillers 40 within the host resin matrix.

Abstract translation: 在一个实施方案中，本发明提供了在主体树脂基质内形成HTC树枝状填料40的方法，其包括将HTC种子42加入到主体树脂基质中。 HTC种子已经被表面官能化以基本上不相互反应。 然后，种子积聚HTC构件块42，并且HTC构建块也被表面功能化以基本上不相互反应。 然后将HTC构建块与HTC种子组装，以在主体树脂基质内产生HTC树枝状填料40。

公开(公告)号：US07034403B2

公开(公告)日：2006-04-25

申请号：US10411163

申请日：2003-04-10

Applicant: Ranjith Divigalpitiya ,  David A. Kanno ,  Patrice Jannic ,  Christophe Arnold ,  Richard Sabatier ,  Glen Connell

Inventor： Ranjith Divigalpitiya ,  David A. Kanno ,  Patrice Jannic ,  Christophe Arnold ,  Richard Sabatier ,  Glen Connell

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L24/29 ,  C08L67/00 ,  C08L77/00 ,  C09J9/02 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/29499 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H01R4/04 ,  H05K3/323 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0281 ,  H01L2924/00

Abstract: An electronic assembly comprising a first electronic element, a second electronic element, and a durably flexible bond therebetween. The bond comprises an anisotropic conductive adhesive that includes elongated electrically conductive particles. The bond provides at least one electrical pathway between the first electronic element and the second electronic element through an elongated contact region. This bond is functionally maintained for at least about 200 flexes.

Abstract translation: 一种电子组件，包括第一电子元件，第二电子元件以及它们之间的耐久性柔性接合。 该键包括包括细长导电颗粒的各向异性导电粘合剂。 该键通过细长的接触区域在第一电子元件和第二电子元件之间提供至少一个电路径。 该键在功能上维持至少约200个弯曲。

公开(公告)号：US06878305B2

公开(公告)日：2005-04-12

申请号：US10696521

申请日：2003-10-28

Applicant: George Hsieh ,  Terrance J. Dishongh ,  Norman J. Armendariz ,  David V. Spaulding

Inventor： George Hsieh ,  Terrance J. Dishongh ,  Norman J. Armendariz ,  David V. Spaulding

IPC: C03C10/02 ,  H05K3/32 ,  B32B31/00 ,  H01L29/43 ,  H01L35/24

CPC classification number: H05K3/321 ,  H05K2201/0248 ,  H05K2201/083 ,  H05K2201/10636 ,  H05K2203/104 ,  Y02P70/611 ,  Y10T428/2852 ,  Y10T428/2896 ,  Y10T428/32

Abstract: Coupling components to an underlying substrate using a composition of a polymer and magnetic material particles. Upon applying the composition between the component and the printed circuit board, the composition may be subjected to a magnetic field to align the magnetic material particles into a conductive path between the component and the underlying substrate. At the same time the polymer-based material may be cured or otherwise solidified to affix the conductive path formed by the magnetic material particles.

Abstract translation: 使用聚合物和磁性材料颗粒的组合物将组分偶联到下面的衬底上。 当在组件和印刷电路板之间施加组合物时，可以对组合物进行磁场以将磁性材料颗粒对准到组件和下层衬底之间的导电路径中。 同时，聚合物基材料可以固化或固化，以固定由磁性材料颗粒形成的导电路径。

公开(公告)号：US20040108133A1

公开(公告)日：2004-06-10

申请号：US10619632

申请日：2003-07-16

Inventor： Takeshi Sano ,  Hirofumi Kobayashi ,  Hideaki Ohkura

IPC: H01L023/48 ,  H05K001/18

CPC classification number: H05K3/325 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/13386 ,  H01L2224/13439 ,  H01L2224/13444 ,  H01L2224/13447 ,  H01L2224/13455 ,  H01L2924/0001 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/4007 ,  H05K2201/0248 ,  H05K2201/0314 ,  H05K2201/0367 ,  H01L2924/00014 ,  H01L2924/0542 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05147

Abstract: An electronic device includes an electronic part including at least one first electrode, a substrate including at least one second electrode, and at least one bump formed on the at least one first electrode and formed from an elastic conductive resin including a resin having rubbery elasticity, and an acicular conductive filler including a surface layer coated with one of gold, silver, nickel, and copper. The at least one first electrode and the at least one second electrode are electrically connected to each other by mechanically contacting the at least one bump with the at least one second electrode.

Abstract translation: 电子设备包括电子部件，其包括至少一个第一电极，包括至少一个第二电极的基板和形成在所述至少一个第一电极上的至少一个凸块，并由包括具有橡胶弹性的树脂的弹性导电树脂形成， 以及包括涂覆有金，银，镍和铜之一的表面层的针状导电填料。 所述至少一个第一电极和所述至少一个第二电极通过使所述至少一个凸块与所述至少一个第二电极机械接触而彼此电连接。

公开(公告)号：US20040087173A1

公开(公告)日：2004-05-06

申请号：US10696521

申请日：2003-10-28

Inventor： George Hsieh ,  Terrance J. Dishongh ,  Norman J. Armendariz ,  David V. Spaulding

IPC: H01L021/302 ,  H01L021/461

CPC classification number: H05K3/321 ,  H05K2201/0248 ,  H05K2201/083 ,  H05K2201/10636 ,  H05K2203/104 ,  Y02P70/611 ,  Y10T428/2852 ,  Y10T428/2896 ,  Y10T428/32

Abstract: Coupling components to an underlying substrate using a composition of a polymer and magnetic material particles. Upon applying the composition between the component and the printed circuit board, the composition may be subjected to a magnetic field to align the magnetic material particles into a conductive path between the component and the underlying substrate. At the same time the polymer-based material may be cured or otherwise solidified to affix the conductive path formed by the magnetic material particles.