公开(公告)号：US20090286055A1

公开(公告)日：2009-11-19

申请号：US12092738

申请日：2006-11-08

Applicant: Behnam Pourdeyhimi ,  Edward Grant ,  H. Troy Nagle ,  Carey Reid Merritt ,  Burcak Karaguzel ,  Tae-Ho Kang ,  John Michael Wilson

Inventor： Behnam Pourdeyhimi ,  Edward Grant ,  H. Troy Nagle ,  Carey Reid Merritt ,  Burcak Karaguzel ,  Tae-Ho Kang ,  John Michael Wilson

IPC: B32B3/00 ,  B32B38/14

CPC classification number: H05K1/0393 ,  H01B5/14 ,  H05K1/028 ,  H05K1/03 ,  H05K1/038 ,  H05K3/125 ,  H05K3/281 ,  H05K2201/0293 ,  H05K2203/013 ,  Y10T428/24851

Abstract: Methods and devices for providing flexible electronics are described. In an exemplary embodiment of the present invention, a conductive ink is applied to a nonwoven substrate. More particularly, the exemplary embodiment provides a nonwoven substrate with a general depth in the z-direction and a conductive ink carried by the nonwoven substrate on the surface of the substrate and at least partially but no more than 50% within the nonwoven substrate in the z-direction.

Abstract translation: 描述了用于提供柔性电子装置的方法和装置。 在本发明的示例性实施例中，将导电油墨施加到非织造基底上。 更具体地，示例性实施例提供了在z方向上具有一般深度的非织造基底和由非织造基底承载在基底表面上的导电油墨，并且在非织造基底中的至少部分但不超过50％ z方向。

公开(公告)号：US20070160810A1

公开(公告)日：2007-07-12

申请号：US10586341

申请日：2005-01-13

Applicant: Fumihiro Hayashi ,  Yasuhito Masuda ,  Yasuhiro Okuda

Inventor： Fumihiro Hayashi ,  Yasuhito Masuda ,  Yasuhiro Okuda

IPC: B32B3/12 ,  B32B27/12 ,  B32B3/26

CPC classification number: B24C3/322 ,  B24C1/04 ,  B24C11/00 ,  C23C18/1605 ,  C23C18/1644 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/30 ,  H05K1/0284 ,  H05K3/107 ,  H05K3/182 ,  H05K3/184 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0293 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2203/025 ,  H05K2203/0565 ,  Y10T428/24479 ,  Y10T428/24496 ,  Y10T428/24612 ,  Y10T428/249953 ,  Y10T428/249987 ,  Y10T442/674

Abstract: An object of the present invention is to provide a method for manufacturing a porous material in which complicated and fine through portions, recessed portions, and the like have been patterned. It is to provide a patterned porous molded product or nonwoven fabric, in which a plated layer has been selectively formed on the surfaces of the through portions and the recessed portions. With the invention, a mask having through portions in a pattern is placed on at least one side of the porous molded product or the nonwoven fabric. A fluid or a fluid containing abrasive grains is sprayed from above the mask, thereby to form through portions or recessed portions, or both of them, to which the opening shape of each through portion of the mask has been transferred, in the porous molded product or the nonwoven fabric. The invention provides a porous molded product or a nonwoven fabric in which a plated layer has been selectively formed on the surfaces of the through portions or the recessed portions, or both of these, an electric circuit component, or the like.

Abstract translation: 本发明的一个目的是提供一种多孔材料的制造方法，其中图形化了复杂而精细的通过部分，凹陷部分等。 提供一种图案化的多孔模制产品或非织造织物，其中已经在通孔部分和凹进部分的表面上选择性地形成镀层。 通过本发明，将具有图案部分的面罩放置在多孔成型品或无纺布的至少一侧。 含有磨粒的流体或流体从掩模上方喷射，从而形成通过部分或凹陷部分或两者，其中通过掩模的每个通过部分的开口形状被转移到多孔模制产品中 或无纺布。 本发明提供一种多孔成型体或非织造布，其中，在贯通部或凹部的表面，或这两者，电路部件等的表面上选择性地形成镀层。

公开(公告)号：US20070149001A1

公开(公告)日：2007-06-28

申请号：US11316473

申请日：2005-12-22

Applicant: Harshad Uka

Inventor： Harshad Uka

IPC: H05K1/00 ,  H01B13/00 ,  C23F1/00 ,  C23C26/00 ,  H05K3/00 ,  B05D5/12

CPC classification number: C23C26/00 ,  C23C28/00 ,  H05K1/0366 ,  H05K1/0393 ,  H05K3/002 ,  H05K3/0055 ,  H05K3/181 ,  H05K3/386 ,  H05K3/387 ,  H05K3/388 ,  H05K2201/0116 ,  H05K2201/029 ,  H05K2201/0293

Abstract: A flexible circuit and a method of fabricating the flexible circuit is provided wherein adhesive is flowed into the interstices of a fabric. The adhesive is then cured to a “B” stage and a conductive foil is bonded to the adhesive on one or both sides of the fabric. Thereafter, the adhesive may be fully cured. A conductive pattern may then be etched into the conductive foil via print and etch techniques. The conductive pattern may be protected with a cover layer. For example, the cover layer may be a base layer with adhesive flowed in its pores and fully cured. The adhesive may be effectively formulated to withstand stresses between the adhesive and the conductive pattern such that bending and flexing the flexible circuit or subjecting the flexible circuit to thermal stresses does not delaminate the bond between the adhesive and the conductive pattern. The adhesive resists delamination from the fabric because the adhesive has been flowed into the fabric's interstices and cured.

Abstract translation: 提供柔性电路和制造柔性电路的方法，其中粘合剂流入织物的间隙中。 然后将粘合剂固化到“B”阶段，并且将导电箔粘合到织物的一侧或两侧上的粘合剂上。 此后，粘合剂可以完全固化。 然后可以通过印刷和蚀刻技术将导电图案蚀刻到导电箔中。 导电图案可以用覆盖层保护。 例如，覆盖层可以是具有粘合剂在其孔中流动并完全固化的基底层。 可以有效地配制粘合剂以承受粘合剂和导电图案之间的应力，使得弯曲和弯曲柔性电路或使柔性电路经受热应力不会使粘合剂和导电图案之间的结合分层。 由于粘合剂已经流入织物的间隙并固化，所以粘合剂抵抗了织物的分层。

公开(公告)号：US20050136233A1

公开(公告)日：2005-06-23

申请号：US11050264

申请日：2005-02-03

Applicant: Michael Samuels ,  Subhotosh Khan ,  Mikhail Levit

Inventor： Michael Samuels ,  Subhotosh Khan ,  Mikhail Levit

IPC: D04H1/00 ,  D04H13/00 ,  H05K1/03 ,  B32B27/04 ,  B32B27/12

CPC classification number: H05K1/0366 ,  B32B5/022 ,  B32B5/145 ,  B32B5/26 ,  B32B2255/02 ,  B32B2255/26 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/02 ,  B32B2262/0269 ,  B32B2262/101 ,  B32B2264/0221 ,  B32B2307/306 ,  B32B2307/308 ,  B32B2307/54 ,  B32B2307/718 ,  B32B2307/7265 ,  B32B2457/08 ,  D21H27/30 ,  H05K1/036 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T428/24942 ,  Y10T442/2066 ,  Y10T442/2484 ,  Y10T442/2861

Abstract: A sheet comprising thermoplastic polymer (TP) and short high tensile modulus fibers, in which the concentration of TP in the middle of the sheet is higher than at the surface of the sheet, useful for making prepregs with a thermoset resin.

公开(公告)号：US20050014035A1

公开(公告)日：2005-01-20

申请号：US10890329

申请日：2004-07-12

Applicant: Yasushi Nakagiri ,  Shinobu Masuda ,  Shozo Ochi ,  Satoru Tomekawa

Inventor： Yasushi Nakagiri ,  Shinobu Masuda ,  Shozo Ochi ,  Satoru Tomekawa

IPC: C08J5/04 ,  D04H1/42 ,  D04H13/00 ,  H05K1/03 ,  H05K3/40 ,  H05K3/46 ,  C04B35/64 ,  B28B1/00 ,  B28B3/00 ,  B28B5/00 ,  B32B3/00 ,  B32B5/02 ,  B32B9/00 ,  C04B33/32 ,  C04B33/36 ,  D04H1/00 ,  D04H3/00 ,  D04H5/00 ,  H01R12/04 ,  H05K1/11

CPC classification number: H05K1/0366 ,  C08J5/046 ,  D04H1/4318 ,  D04H1/64 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/015 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T442/20

Abstract: A prepreg for a printed wiring board includes fluorocarbon fibers as a reinforcing material, and the reinforcing material is impregnated with a resin. The fluorocarbon fibers include short fibers having a branch structure. The reinforcing material includes a nonwoven fabric formed by interlacing the fluorocarbon fibers in the thickness direction. The proportion of the fluorocarbon fibers among the fibers constituting the nonwoven fabric ranges from 50 wt % to 100 wt %, and the remaining fibers are synthetic fibers or inorganic fibers. The nonwoven fabric is heat-treated at 330° C. to 390° C., then annealed at 200° C. to 270° C., and impregnated with the resin. This prepreg can used to provide a printed wiring board with low Interstitial Via Hole connection resistance and high connection stability and a method for manufacturing the printed wiring board.

Abstract translation: 用于印刷线路板的预浸料包括作为增强材料的氟碳纤维，并且增强材料用树脂浸渍。 氟碳纤维包括具有分支结构的短纤维。 增强材料包括通过使碳氟化合物纤维沿厚度方向交织而形成的无纺布。 构成无纺布的纤维中的氟碳纤维的比例为50重量％〜100重量％，剩余的纤维为合成纤维或无机纤维。 无纺布在330℃至390℃下热处理，然后在200℃下退火至270℃，并用树脂浸渍。 该预浸料可用于提供具有低间隙通孔连接电阻和高连接稳定性的印刷线路板以及印刷线路板的制造方法。

公开(公告)号：US06838401B1

公开(公告)日：2005-01-04

申请号：US10343605

申请日：2000-08-04

Applicant: Sadamitsu Murayama ,  Michikage Matsui ,  Masanori Wada ,  Shigeru Ishihara

Inventor： Sadamitsu Murayama ,  Michikage Matsui ,  Masanori Wada ,  Shigeru Ishihara

IPC: D21H13/26 ,  D04H1/42 ,  D04H1/4334 ,  D04H1/4342 ,  D04H1/54 ,  D04H1/549 ,  D04H1/58 ,  D04H1/64 ,  D21H13/24 ,  H05K1/03 ,  D02G3/00 ,  D21H13/00

CPC classification number: D04H1/4334 ,  D04H1/4342 ,  D04H1/549 ,  D04H1/64 ,  D21H13/24 ,  D21H13/26 ,  H05K1/0366 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T428/249921 ,  Y10T428/249924 ,  Y10T428/2904 ,  Y10T428/2969 ,  Y10T442/609 ,  Y10T442/61 ,  Y10T442/611 ,  Y10T442/69

Abstract: A heat-resistant fiber paper sheet which is formed from staple fibers made from a heat-resistant organic polymer, undrawn or low ratio drawn para-aromatic polyamide staple fibers, and an organic resin binder and/or fibrids comprising a heat-resistant organic polymer as main components, wherein the amount of said staple fibers is 45 to 97 percent by weight based on the total amount of said heat-resistant fiber paper sheet; the total amount of said organic resin binder and/or said fibrids is 3 to 55 percent by weight based on the total amount of said heat-resistant fiber paper sheet; and said organic resin binder is cured, and/or said undrawn or low ratio drawn para-aromatic polyamide staple fibers and said fibrids are partially softened, deformed and/or melted to exhibit the actions of binders. The obtained heat-resistant fiber paper sheet has excellent heat resistance, excellent heat dimensional stability, excellent plybond strength, an excellent electric insulating property in a high humidity, and the like, has good resin impregnability in spite of having a high bulk density, and is especially suitable for use as a substrate for electric insulating materials or as a substrate for laminates used for electric circuits.

Abstract translation: 由耐热有机聚合物，未拉伸或低比例拉伸的对 - 芳族聚酰胺短纤维制成的短纤维形成的耐热纤维纸片和包含耐热有机聚合物的有机树脂粘合剂和/或纤条体 作为主要成分，其中所述短纤维的量相对于所述耐热性纤维纸的总量为45〜97重量％ 所述有机树脂粘合剂和/或所述纤条体的总量相对于所述耐热纤维纸的总量为3〜55重量％ 并且所述有机树脂粘合剂固化，和/或所述未拉伸或低比例拉伸的对位芳族聚酰胺短纤维和所述纤维状物部分软化，变形和/或熔融以显示粘合剂的作用。 获得的耐热纤维纸片具有优异的耐热性，优异的热尺寸稳定性，优异的聚苯乙烯强度，高湿度下的优异的电绝缘性等，尽管具有高的堆积密度，但具有良好的树脂浸渍性，以及 特别适合用作电绝缘材料的基材或用作电路用层压体的基材。

公开(公告)号：US20040132372A1

公开(公告)日：2004-07-08

申请号：US10736928

申请日：2003-12-15

Inventor： Michael R. Samuels ,  Subhotosh Khan ,  Mikhail R. Levit

IPC: B32B003/00

CPC classification number: B32B27/12 ,  B32B15/04 ,  H05K1/0366 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T442/60

Abstract: A solid sheet which contains an nonwoven fabric made from short high tensile modulus fibers and a thermoplastic polymer having a low moisture absorption matrix resin that is useful as a substrate for circuit boards.

Abstract translation: 包含由短的高拉伸模量纤维制成的无纺布的固体片材和具有低吸湿基质树脂的热塑性聚合物，其可用作电路板的基底。

公开(公告)号：US20030157858A1

公开(公告)日：2003-08-21

申请号：US10378917

申请日：2003-03-05

Applicant: OJI PAPER CO., LTD.

Inventor： Hiroyoshi Ueno ,  Yoshihisa Koto ,  Isao Ichioka ,  Takekazu Adachi ,  Mamoru Murata ,  Hirokazu Hiraoka ,  Manabu Ochida ,  Masayuki Noda

IPC: B32B021/02

CPC classification number: B32B5/26 ,  B32B5/022 ,  B32B15/14 ,  B32B15/20 ,  B32B37/00 ,  B32B37/10 ,  B32B38/0036 ,  B32B38/16 ,  B32B38/164 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2305/28 ,  B32B2309/02 ,  B32B2311/12 ,  B32B2398/10 ,  B32B2457/08 ,  D21H13/26 ,  D21H17/52 ,  D21H21/18 ,  D21H25/06 ,  D21H27/30 ,  H05K1/0366 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2203/1105 ,  Y10T428/249925 ,  Y10T428/249998 ,  Y10T428/31725 ,  Y10T428/31728 ,  Y10T442/20 ,  Y10T442/2951 ,  Y10T442/60 ,  Y10T442/696 ,  Y10T442/697 ,  Y10T442/699

Abstract: The present invention is to provide a base material for a laminate having a high strength, reduced thickness, and light weight. In the present invention, a base material is prepared by incorporating a thermosetting resin binder into a non-woven fabric of para-aramid fibers prepared by a wet type paper making, and then heating a plurality of the resultant non-woven fabric sheets under pressure. The non-woven fabric sheet comprises 95 to 70 mass % of the para-aramid fibers and 5 to 30 mass % of the thermosetting resin binder.

Abstract translation: 本发明提供一种具有高强度，低厚度和轻质量的层压体的基材。 在本发明中，通过将热固性树脂粘合剂结合到通过湿式造纸制备的对位芳族聚酰胺纤维的无纺织物中，然后在压力下加热多个所得的无纺布片材来制备基材 。 无纺布片包含95〜70质量％的对位芳族聚酰胺纤维和5〜30质量％的热固性树脂粘合剂。

公开(公告)号：US20030113522A1

公开(公告)日：2003-06-19

申请号：US10221730

申请日：2002-10-09

Inventor： Toshihiro Nishii

IPC: B32B003/00

CPC classification number: H05K3/4688 ,  H05K1/0366 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0278 ,  H05K2201/029 ,  H05K2201/0293 ,  H05K2201/10378 ,  Y10T428/24917

Abstract: A method of manufacturing a circuit board comprising: an inner layer board laminating step for laminating inner layer board material and one or more metal sheet(s) for inner layer; an inner layer circuit forming step for forming circuits of the metal sheet to make an inner layer circuit board; a multi-layer laminating step for laminating one or more metal sheet(s) for multi-layer, one or more multi-layer board material(s) and one or more inner layer circuit board(s); and a multi-layer circuit forming step for forming circuits of the metal sheet for the multi-layer, wherein the inner layer board material and the multi-layer board material are different in material composition from each other. According to the present invention, it is possible to stabilize the quality of interstitial connection of the inner layer circuit board and to improve the mechanical strength such as the adhesive strength of an outer layer circuit.

Abstract translation: 一种制造电路板的方法，包括：内层板层压步骤，用于层压内层板材料和一层或多层用于内层的金属板; 内层电路形成步骤，用于形成金属片的电路以制成内层电路板; 多层层压步骤，用于层叠用于多层，一个或多个多层板材料和一个或多个内层电路板的一个或多个金属板; 以及用于形成用于多层的金属板的电路的多层电路形成步骤，其中内层板材料和多层板材料的材料组成彼此不同。 根据本发明，可以稳定内层电路板的间隙连接的质量，并提高诸如外层电路的粘合强度的机械强度。

公开(公告)号：US06566288B2

公开(公告)日：2003-05-20

申请号：US09777748

申请日：2001-02-06

Applicant: Shigeru Kurumatani ,  Hirokazu Hiraoka ,  Masayuki Noda ,  Tomoyuki Terao ,  Setsuo Toyoshima ,  Yoshihisa Kato ,  Hiroyoshi Ueno

Inventor： Shigeru Kurumatani ,  Hirokazu Hiraoka ,  Masayuki Noda ,  Tomoyuki Terao ,  Setsuo Toyoshima ,  Yoshihisa Kato ,  Hiroyoshi Ueno

IPC: D04H140

CPC classification number: B32B5/26 ,  B32B5/022 ,  B32B15/14 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2457/08 ,  C08J5/04 ,  D21H13/26 ,  D21H17/52 ,  H01L23/145 ,  H01L2924/0002 ,  H05K1/0366 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T442/2475 ,  Y10T442/60 ,  Y10T442/692 ,  Y10T442/696 ,  Y10T442/697 ,  H01L2924/00

Abstract: A non-woven fabric comprising a principal component of para-aramid fiber chops bonded with each other by a binder, the para-aramid fiber chops having a mixture of (a) poly-p-phenylene-3,4′-diphenylether-terephthalamide fibers and (b) poly-p-phenylene-terephthalamide fibers and having a blend ratio by weight of (a)/(b)=10/90˜90/10 and preferably (a)/(b)=30/70˜70/30.