Abstract:
PROBLEM TO BE SOLVED: To provide a plasma ashing process for reducing the temperature at an impingement portion i.e., center portion, of a baffle plate, while maintaining or enhancing the photoresist removal rate.SOLUTION: The plasma ashing process for removing photoresist material and post etch residues from a substrate including a low k dielectric material comprising carbon, hydrogen, or a combination of carbon and hydrogen comprises: forming a plasma from an essentially oxygen free and nitrogen free gas mixture; flowing the plasma through a baffle plate assembly onto the substrate and removing photoresist material, post etch residues, and volatile byproducts from the substrate; and flowing a cooling gas over the baffle plate during a period of operation in which the plasma is not formed.
Abstract:
PROBLEM TO BE SOLVED: To provide a hybrid deflector for reducing energy contamination in ion implantation, and to provide a deflection method of ion beam. SOLUTION: The hybrid deflector 500 for an ion implantation system is composed of a magnetic deflection module 350 which works to deflect ion beam from a beam axis, an electrostatic deflection module 504 which works to deflect the ion beam from the beam axis, and a controller 304 which, based on one or a plurality of input controlling signals, operates either the magnetic deflection module or the electrostatic deflection module selectively. The deflection method of ion beam includes a step in which one or a plurality of characteristics of beam are identified and a step in which, based on the identification, either of the magnetic deflection module or the electrostatic deflection module are operated selectively. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an ion implantation system utilizing detected ion induced luminescence as feedback. SOLUTION: The ion implantation system comprises a wafer, a spectrometer, a photodetector, and an ion source generator, wherein the ion source generator is configured to implant the wafer with ions, and the photodetector is configured to detect ion induced luminescence both on and off the wafer. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an LINAC improved by utilizing direct digital synthesis (DDS) techniques to obtain precise frequency and phase control and automated electrode voltage phase calibration; and to provide an HE ion implantation system using it. SOLUTION: A DDS controller 130 may be used on an implantation process using a multi-stage linear accelerator to synchronize the frequency and phase of the electric fields to each electrode within each stage of the accelerator. The DDS controller includes digital phase synthesis (DPS) circuits 138 for modulating the phase of the electric field to the electrodes, and a master oscillator that uses digital frequency synthesis or DFS 134 to digitally synthesize a master frequency and a master phase applied to each of the DPS circuits. This method for automatically calibrating phase and amplitude of the RF electrode voltage of each stage is provided as well. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a device where a substrate is uniformly moved and/or rotated relative to an ion beam when the ion beam is scanned to inject an ion into the substrate, and a method of the same. SOLUTION: A rotation subsystem 110 provided at a scanning mechanism 100 includes a first link 115 and a second link 120 connected to a base 105, the first link 115 is rotatably connected to the base 105 through a first joint 125, and rotated around a first axis 127 in a first rotational direction 128. The second link 120 is rotatably connected to the first link 115 through a second joint 130, distant by a predetermined distance L from the first joint 125, and rotated around a second axis 132 in a second rotational direction 133. By moving the first link 115 and the second link 120 by a predetermined distance by the actuation of an end effector 140, ion injection is conducted while the substrate is linearly moved relative to the base 105 (not illustrated). COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
An arc chamber for an ion source defines a chamber volume, and a target material is disposed within the chamber volume. The target material comprises a dopant species and can be contained in a target member. An indirectly heated cathode is positioned within the chamber volume and ionizes a source gas within the chamber volume, defining a plasma having a plasma thermal emission. A target heater selectively heats the target material independently from the plasma thermal emission associated with the plasma. The target heater can be a resistive heating element, inductive heating element, halogen heating element, or a laser configured to selectively heat at least a portion of the target member. The target member can consist of a solid dopant material or can contain a liquid dopant material.
Abstract:
An ion source having a thermionically-emitting cathode coupled to a plasma chamber and is exposed to a plasma chamber environment. A first power supply is coupled to a first filament associated with the thermionically-emitting cathode and is configured to selectively supply a first power to the first filament to heat the first filament to a first temperature and induce a thermionic emission from the thermionically-emitting cathode. A non-thermionically emitting cathode is coupled to the plasma chamber and exposed to the plasma chamber environment. A second power supply supplies a second power to a second filament associated with the non-thermionically emitting cathode and heats the second filament and the non-thermionically emitting cathode to a second temperature while not inducing thermionic emission from the non-thermionically emitting cathode, where condensation within the plasma chamber environment is minimized. A controller can control the first and second power supplies to provide constant power or emission.