公开(公告)号：DE60105431T2

公开(公告)日：2005-09-22

申请号：DE60105431

申请日：2001-06-28

Applicant: PRINTAR LTD

Inventor： ZOHAR RON ,  SAGI DAN ,  SADOWSKI BENJAMIN

IPC: B41J2/01 ,  B41J2/165 ,  B41J2/175 ,  B41J2/18 ,  B41J2/185 ,  B41J3/407 ,  H05K3/10 ,  H05K3/12 ,  H05K3/00 ,  B05C5/00 ,  H05K13/04

公开(公告)号：AU2102202A

公开(公告)日：2002-06-18

申请号：AU2102202

申请日：2001-12-04

Applicant: PRINTAR LTD

Inventor： ZOHAR RON ,  MOZEL JACOB ,  SAMUEL JOSHUA

IPC: C09D11/00 ,  C09D11/10 ,  H05K1/02

公开(公告)号：AU6939701A

公开(公告)日：2002-01-08

申请号：AU6939701

申请日：2001-06-28

Applicant: PRINTAR LTD

Inventor： ZOHAR RON ,  SAGI DAN ,  SADOWSKI BENJAMIN

IPC: B41J2/01 ,  B41J2/165 ,  B41J2/175 ,  B41J2/18 ,  B41J2/185 ,  B41J3/407 ,  H05K3/10 ,  H05K3/12 ,  H05K3/00

公开(公告)号：EP1481575A2

公开(公告)日：2004-12-01

申请号：EP03743491.7

申请日：2003-03-03

Applicant: Printar Ltd.

Inventor： ZOHAR, Ron ,  MOZEL, Jacob ,  VILK, Ran

IPC: H05K3/02 ,  H01K3/10 ,  B05D5/12 ,  B05D5/00 ,  B05D3/02 ,  B05D3/00 ,  C08F2/48 ,  C08J7/06

CPC classification number: H05K3/0091 ,  H05K3/28 ,  H05K2201/09736 ,  H05K2201/09881 ,  H05K2203/013 ,  H05K2203/081 ,  H05K2203/1509

Abstract: A method and apparatus for applying ink, according to a soldermask pattern, to a printed circuit board (360) having elevated pads defining pad edges, the method including flooding the printed circuit board (360) with ink such that the ink advances, without climbing onto the elevated pads.

公开(公告)号：EP1300059B1

公开(公告)日：2004-09-08

申请号：EP01947758.7

申请日：2001-06-28

Applicant: Printar Ltd.

Inventor： ZOHAR, Ron ,  SAGI, Dan ,  SADOWSKI, Benjamin

IPC: H05K3/00 ,  H05K13/04 ,  B05C5/00

CPC classification number: H05K3/125 ,  B41J2/01 ,  B41J3/4073 ,  H05K1/0269 ,  H05K2201/09918

公开(公告)号：EP1937785A1

公开(公告)日：2008-07-02

申请号：EP06766243.7

申请日：2006-08-31

Applicant: Printar Ltd.

Inventor： HALAHMI, Izhar ,  LUSKI, Shalom ,  COHEN, Michal

IPC: C09D11/10 ,  H05K3/28

CPC classification number: H05K3/287 ,  C09D11/36 ,  H05K2201/0209 ,  H05K2203/013

Abstract: The present application provides a latent ink-jet ink formulation suitable as solder mask. The composition generally comprises: (a) at least one compound capable of self cross-linking (USM); (b) at least one phenolic resin; (c) at least one solvent; (d)at least one mineral filler; (e) at least one polyol; and (f) at least one photoinitiator.

公开(公告)号：EP1924661A1

公开(公告)日：2008-05-28

申请号：EP06780413.8

申请日：2006-08-17

Applicant: Printar Ltd.

Inventor： HALAHMI, Izhar ,  LUSKI, Shalom ,  COHEN, Michal

IPC: C09D11/10

CPC classification number: C09D11/101 ,  C09D11/103 ,  C09D11/36 ,  H05K1/0266

Abstract: The present invention discloses a latent thermosetting ink formulation for ink jet applications comprising a phenolic resin, an amino resin and a polyol. The formulation is characterized as having a viscosity of lower than 50 Cps at a shear rate of 10 to 100,000 sec-1 at a temperature lower than 100 C and a surface tension lower than 40 dynes/cm.

公开(公告)号：IL156345A

公开(公告)日：2011-10-31

申请号：IL15634503

申请日：2003-06-08

Applicant: MOZEL JACOB ,  ZOHAR RON ,  SAMUEL JOSHUA ,  PRINTAR LTD

Inventor： MOZEL JACOB ,  ZOHAR RON ,  SAMUEL JOSHUA

公开(公告)号：IL189515D0

公开(公告)日：2008-08-07

申请号：IL18951508

申请日：2008-02-14

Applicant: PRINTAR LTD

IPC: C09D20100101

公开(公告)号：DE60105431D1

公开(公告)日：2004-10-14

申请号：DE60105431

申请日：2001-06-28

Applicant: PRINTAR LTD

Inventor： ZOHAR RON ,  SAGI DAN ,  SADOWSKI BENJAMIN

IPC: B41J2/01 ,  B41J2/165 ,  B41J2/175 ,  B41J2/18 ,  B41J2/185 ,  B41J3/407 ,  H05K3/10 ,  H05K3/12 ,  H05K3/00 ,  B05C5/00 ,  H05K13/04