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公开(公告)号：US06887624B2
公开(公告)日：2005-05-03
申请号：US09962173
申请日：2001-09-25
Applicant: Hanne Anna Katharina Blau , Pui-Yan Lin , José Manuel Rodriguez-Parada
Inventor： Hanne Anna Katharina Blau , Pui-Yan Lin , José Manuel Rodriguez-Parada
Abstract: Disclosed are compositions prepared by free-radical-driven grafting onto hydrocarbons or hydrocarbon ethers of olefinically unsaturated fluorocarbons containing sulfonyl fluoride, fluorosulfonate, fluorosulfonimide, or fluorosulfonyl methide groups, wherein the grafting step is followed by a hydrolysis step in the case of sulfonyl fluoride.
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公开(公告)号：US08163381B2
公开(公告)日：2012-04-24
申请号：US12256665
申请日：2008-10-23
Applicant: Pui-Yan Lin , Govindasamy Paramasivam Rajendran , George Elias Zahr
Inventor： Pui-Yan Lin , Govindasamy Paramasivam Rajendran , George Elias Zahr
IPC: H05K1/02
CPC classification number: H01L23/49894 , H01L2924/0002 , H01L2924/3011 , H05K1/0271 , H05K3/108 , H05K3/4661 , H05K2201/0209 , H05K2201/0269 , H05K2201/068 , Y10T29/49126 , Y10T29/49156 , Y10T29/49165 , Y10T428/24917 , Y10T428/25 , Y10T428/2998 , Y10T428/31515 , Y10T428/31518 , Y10T428/31529 , H01L2924/00
Abstract: Provided, are multi-layer chip carriers comprising an asymmetric cross-linked polymeric dielectric film, and processes for making the chip carriers.
Abstract translation: 提供了包括不对称交联聚合物电介质膜的多层芯片载体，以及用于制造芯片载体的工艺。
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公开(公告)号：US07265181B2
公开(公告)日：2007-09-04
申请号：US11177752
申请日：2005-07-08
Applicant: Pui-Yan Lin , George Elias Zahr , Govindasamy Paramasivam Rajendran
Inventor： Pui-Yan Lin , George Elias Zahr , Govindasamy Paramasivam Rajendran
IPC: C08F8/32
CPC classification number: C08G73/1014
Abstract: Provided according to the invention are cross-linked polymers comprising an anhydride or partially hydrolyzed anhydride functionalized polymer having oligomeric polyimide cross-links, providing a polymeric composite on a molecular scale, and shaped articles made therefrom. In some embodiments the shaped articles are particularly well suited for electronics applications. The shaped articles are characterized by low CTE (coefficient of thermal expansion), low dielectric constant (Dk), low dissipation factor (Df), high strength, high modulus and high toughness.
Abstract translation: 根据本发明提供的是包含酸酐或部分水解的酸酐官能化聚合物的交联聚合物，其具有低聚聚酰亚胺交联，提供分子尺度的聚合复合物，以及由其制成的成型制品。 在一些实施例中，成形制品特别适用于电子应用。 成型制品的特点是低CTE（热膨胀系数），低介电常数（Dk），低耗散因数（Df），高强度，高模量和高韧性。
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公开(公告)号：US5245897A
公开(公告)日：1993-09-21
申请号：US797324
申请日：1991-11-25
Applicant: Paul J. Arnold , Robert L. Brown , Joseph J. Duffy , Pui-Yan Lin , Robert A. Marin
Inventor： Paul J. Arnold , Robert L. Brown , Joseph J. Duffy , Pui-Yan Lin , Robert A. Marin
CPC classification number: B32B37/10 , B31D3/0223 , B31F1/305 , Y10S83/929 , Y10T83/0453 , Y10T83/0605 , Y10T83/463 , Y10T83/654
Abstract: The present invention is directed to an apparatus for advancing the leading edge of a corrugated web for positioning the web for a secondary operation, such as a cutting operation to cut a discrete sheet from the web. The web has a plurality of alternating peaks and valleys. The apparatus comprises an endless loop conveyor including a plurality of spaced support bars for contacting the valleys of the web. At least one vacuum source holds the web against the support bars. A motor and a distributed control system repeatedly advance the conveyor and the leading edge of the web from the entrance end to the exit end of the conveyor. A rotary encoder and a sensor sense the presence of a support bar near the position for applying the cutting operation. The vacuum source is de-activated, and at least one pressure source is activated to remove the cut sheet from the support bars. The de-activation of the vacuum source and the activation of the pressure source are done progressively from one end of the conveyor to the other to progressively remove the cut sheet from the conveyor.
Abstract translation: 本发明涉及一种用于使波纹幅的前缘前进的装置，用于将幅材定位用于二次操作，例如从幅材切割离散片材的切割操作。 网具有多个交替的峰和谷。 该装置包括一个环形输送机，该输送机包括多个间隔开的支撑杆，用于接触幅材的谷部。 至少一个真空源将纸幅保持抵靠支撑杆。 电动机和分布式控制系统将输送机和纸幅的前缘从输送机的入口端到出口端重复地推进。 旋转编码器和传感器感测在施加切割操作的位置附近存在支撑杆。 真空源被去激活，并且至少一个压力源被激活以从支撑杆上移除切割的片材。 真空源的去激活和压力源的激活是从输送机的一端到另一端逐渐地从输送机中逐渐去除的。
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公开(公告)号：US08484839B2
公开(公告)日：2013-07-16
申请号：US13427184
申请日：2012-03-22
Applicant: Pui-Yan Lin , Govindasamy Paramasivam Rajendran , George Elias Zahr
Inventor： Pui-Yan Lin , Govindasamy Paramasivam Rajendran , George Elias Zahr
CPC classification number: H01L23/49894 , H01L2924/0002 , H01L2924/3011 , H05K1/0271 , H05K3/108 , H05K3/4661 , H05K2201/0209 , H05K2201/0269 , H05K2201/068 , Y10T29/49126 , Y10T29/49156 , Y10T29/49165 , Y10T428/24917 , Y10T428/25 , Y10T428/2998 , Y10T428/31515 , Y10T428/31518 , Y10T428/31529 , H01L2924/00
Abstract: Provided are processes for making multi-layer chip carriers comprising an asymmetric cross-linked polymeric dielectric film.
Abstract translation: 提供了制造包含不对称交联聚合物电介质膜的多层芯片载体的方法。
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Patent Agency Ranking
26.发明申请COATED ARTICLE COMPRISING CURABLE EPOXY COMPOSITION WITH QUATERNARY AMMONIUM BICARBONATE CURING CATALYST, AND METHOD FOR PREPARING 审中-公开包含可固化环氧组合物的季铵二甲基硫酸铵固化催化剂的涂覆制品及其制备方法公开(公告)号：US20130157058A1
公开(公告)日：2013-06-20
申请号：US13327793
申请日：2011-12-16
Applicant: PUI-YAN LIN
Inventor： PUI-YAN LIN
CPC classification number: C08G59/686 , B05D2504/00 , B32B15/088 , B32B2255/10 , B32B2255/24 , B32B2457/08 , C08J7/047 , C08J2379/08 , C08J2463/02 , C09D163/00 , H05K1/0393 , H05K3/281 , Y10T428/31511
Abstract: Quaternary ammonium bicarbonates are suitable for use as latent catalysts in curable epoxy compositions. The curable compositions prepared therefrom are used to prepare coated substrates, and to produce conformally sealed printed wiring boards and flexible circuits. Method for preparation and curing are also provided. Of particular utility are compositions comprising benzyltrimethyl ammonium bicarbonate. The curable epoxy composition is coated onto a substrate such as a film or sheet, to form a coated article. The cure of the epoxy can be advanced after coating.
Abstract translation: 季铵碳酸氢盐适用于可固化环氧组合物中的潜在催化剂。 由其制备的可固化组合物用于制备涂覆的基材，并制造保形密封的印刷线路板和柔性电路。 还提供了制备和固化的方法。 特别有用的是包含苄基三甲基碳酸氢铵的组合物。 将可固化环氧组合物涂覆在诸如膜或片材的基材上以形成涂布制品。 环氧树脂的固化可以在涂覆后进行。
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27.发明申请FILM PREPARED FROM A CASTING COMPOSITION COMPRISING A POLYMER AND SURFACE MODIFIED HEXAGONAL BORON NITRIDE PARTICLES 失效由包含聚合物和表面改性的六角形硼酸盐颗粒的铸造组合物制备的膜公开(公告)号：US20100291365A1
公开(公告)日：2010-11-18
申请号：US12465090
申请日：2009-05-13
Applicant: Pui-Yan Lin , Govindasamy Paramasivan Rajendran , George Elias Zahr
Inventor： Pui-Yan Lin , Govindasamy Paramasivan Rajendran , George Elias Zahr
CPC classification number: C08K9/04 , B32B5/147 , B32B7/12 , B32B15/08 , B32B15/092 , B32B15/18 , B32B15/20 , B32B27/08 , B32B27/18 , B32B27/26 , B32B27/281 , B32B27/304 , B32B27/32 , B32B27/36 , B32B27/365 , B32B27/38 , B32B2264/10 , B32B2307/206 , B32B2307/302 , B32B2307/538 , B32B2379/00 , B32B2457/08 , C08J5/18 , C08J2363/00 , C08J2379/08 , H05K1/0373 , H05K1/0393 , H05K2201/0245
Abstract: Provided is a film having a thickness of less than 500 μm comprising a polymer and a plurality of surface-modified hexagonal boron nitride particles dispersed therewithin. The polymers can be polyimide or epoxy. A process for preparing the film by casting is provided.
Abstract translation: 提供具有小于500μm的厚度的膜，其包含聚合物和分散在其中的多个表面改性的六方氮化硼颗粒。 聚合物可以是聚酰亚胺或环氧树脂。 提供了一种通过铸造制备薄膜的方法。
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公开(公告)号：US20100065314A1
公开(公告)日：2010-03-18
申请号：US12256665
申请日：2008-10-23
Applicant: Pui-Yan Lin , Govindasamy Paramasivam Rajendran , George Elias Zahr
Inventor： Pui-Yan Lin , Govindasamy Paramasivam Rajendran , George Elias Zahr
CPC classification number: H01L23/49894 , H01L2924/0002 , H01L2924/3011 , H05K1/0271 , H05K3/108 , H05K3/4661 , H05K2201/0209 , H05K2201/0269 , H05K2201/068 , Y10T29/49126 , Y10T29/49156 , Y10T29/49165 , Y10T428/24917 , Y10T428/25 , Y10T428/2998 , Y10T428/31515 , Y10T428/31518 , Y10T428/31529 , H01L2924/00
Abstract: Provided, are multi-layer chip carriers comprising an asymmetric cross-linked polymeric dielectric film, and processes for making the chip carriers.
Abstract translation: 提供了包括不对称交联聚合物电介质膜的多层芯片载体，以及用于制造芯片载体的工艺。
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公开(公告)号：US20090110909A1
公开(公告)日：2009-04-30
申请号：US12256662
申请日：2008-10-23
Applicant: Jeffrey Glenn Innocenzo , Pui-Yan Lin , Richard C. Oliver , Govindasamy Paramasivam Rajendran , George Elias Zahr
Inventor： Jeffrey Glenn Innocenzo , Pui-Yan Lin , Richard C. Oliver , Govindasamy Paramasivam Rajendran , George Elias Zahr
CPC classification number: H05K3/4673 , H05K3/4652 , H05K3/4655 , H05K3/4661 , H05K2201/0209 , H05K2201/0269 , H05K2201/0358 , H05K2201/068 , Y10T428/25 , Y10T428/31511
Abstract: Cross-linked polymeric films suitable for use as a dielectric build-up layer in multi-layer chip carriers are provided. The films are suitable for use in any application using films that are dimensionally stable to temperature changes.
Abstract translation: 提供了适合用作多层芯片载体中的电介质堆积层的交联聚合物膜。 这些薄膜适用于使用尺寸稳定于温度变化的薄膜的任何应用。
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公开(公告)号：US20070231581A1
公开(公告)日：2007-10-04
申请号：US11732319
申请日：2007-04-03
Applicant: Pui-Yan Lin , Govindasamy Rajendran , George Zahr
Inventor： Pui-Yan Lin , Govindasamy Rajendran , George Zahr
IPC: B32B27/38 , B32B15/092 , C08L63/00 , B32B27/18
CPC classification number: C08G59/4223 , C08G59/3218 , H05K3/4661 , H05K3/4676 , Y10T428/31511 , Y10T428/31529
Abstract: Epoxy compositions that exhibit low viscosity in the uncured state and low coefficient of thermal expansion in the cured state are provided. The compositions are well-suited for use as dielectrics in electronics applications such as in multi-layer printed circuit boards, integrated circuit (IC) chip substrates, also known as IC chip carriers, and IC chip package interposers.
Abstract translation: 提供在固化状态下显示低粘度和固化状态下的低热膨胀系数的环氧组合物。 该组合物非常适合用作电子应用中的电介质，例如多层印刷电路板，也称为IC芯片载体的集成电路（IC）芯片基板和IC芯片封装内插器。
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