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21.发明申请NANO AND MESO SHELL-CORE CONTROL OF PHYSICAL PROPERTIES AND PERFORMANCE OF ELECTRICALLY INSULATING COMPOSITES 审中-公开电绝缘复合材料的物理性能和性能的纳米和外壳外壳控制
公开(公告)号：WO2008042076A2
公开(公告)日：2008-04-10
申请号：PCT/US2007019502
申请日：2007-09-06
Applicant: SIEMENS POWER GENERATION INC , STEVENS GARY , SMITH JAMES D B , WOOD JOHN W
Inventor： STEVENS GARY , SMITH JAMES D B , WOOD JOHN W
CPC classification number: H05K1/0373 , H05K2201/0209 , H05K2201/0224 , H05K2201/0248 , Y10T428/25 , Y10T428/251 , Y10T428/254 , Y10T428/256 , Y10T428/257 , Y10T428/258 , Y10T428/259 , Y10T428/31511 , Y10T428/31993
Abstract: A high thermal conductivity resin that is made up of a host resin matrix (42) and high thermal conductivity fillers (30) that are mixed within the host resin to form a resin mixture. The fillers comprise at least 3-5% by weight of the resin mixture, and the fillers are from an average of 1 -100 nm in at least one dimension, and where the particles are smaller than an average of 1000 nm in the particles' longest dimension. The host resin matrix forms an ordered resin shell (40) around the high thermal conductivity fillers (30), whereby resin molecules are aligned perpendicular to the surface of the high thermal conductivity fillers. An overlap of the ordered resin shells (44) is formed between the high thermal conductivity fillers such that continuous pathways for ordered resin shells are created through the resin mixture.
Abstract translation: 由主体树脂基体（42）和高导热性填料（30）组成的高导热性树脂，其在主体树脂内混合以形成树脂混合物。 所述填料占所述树脂混合物的至少3-5重量％，并且所述填料在至少一个维度上平均为1-100nm，并且其中所述颗粒的平均粒径小于1000nm， 最长的尺寸。 主树脂基质在高热导率填料（30）周围形成有序树脂壳（40），由此树脂分子垂直于高热导率填料表面排列。 在高热导率填料之间形成有序树脂壳（44）的重叠，使得通过树脂混合物形成有序树脂壳的连续路径。
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22.发明申请
公开(公告)号：WO2007130157A1
公开(公告)日：2007-11-15
申请号：PCT/US2007/000085
申请日：2007-01-03
Applicant: SIEMENS POWER GENERATION, INC. , SMITH, James, D.B. , STEVENS, Gary , WOOD, John, W.
Inventor： SMITH, James, D.B. , STEVENS, Gary , WOOD, John, W.
IPC: C08L101/00 , B32B27/04 , H01B3/00
CPC classification number: C08L101/00 , B32B17/04 , B32B19/02 , B32B19/06 , B32B2250/02 , B32B2262/101 , B32B2307/206 , B32B2307/302 , B32B2307/306 , B32B2457/04 , C09D201/00 , Y10T428/24994 , Y10T428/249986 , Y10T428/28 , Y10T442/2418 , Y10T442/2992 , Y10T442/50 , C08L2666/14
Abstract: The present invention provides for a resin mixture that comprises a highly structured resin 40 and a less structured resin 50. The highly structured resin 40 and the less structured resin 50 are mixed to a ratio of between 1:9 and 4:1 by volume, with a more particular ratio of 1:5 to 3:1. The highly structured resin forms ordered micro regions and the ordered micro regions impose order on surrounding less structured resin molecules. The micro regions are essentially groups of the HS resin that will naturally form order structures.
Abstract translation: 本发明提供了一种树脂混合物，其包含高度结构化的树脂40和较少结构的树脂50.高度结构化的树脂40和较少结构的树脂50以1:9至4:1的比例混合， 更特定的比例为1:5至3:1。 高度结构化的树脂形成有序的微区域，并且有序的微区域对周围较少结构化的树脂分子施加秩序。 微区本质上是HS树脂的组成，其自然形成顺序结构。
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公开(公告)号：WO2007114873A1
公开(公告)日：2007-10-11
申请号：PCT/US2007/000081
申请日：2007-01-03
Applicant: SIEMENS POWER GENERATION, INC. , SMITH, James D.B. , STEVENS, Gary , WOOD, John W.
Inventor： SMITH, James D.B. , STEVENS, Gary , WOOD, John W.
CPC classification number: C08G59/4085 , C08L63/00 , Y10T428/249953 , Y10T428/249955 , Y10T428/249959 , Y10T428/26
Abstract: In one application the mix grafted and non grafted invention provides for high thermal conductivity resin that comprises a host resin matrix 32 with a first class of grafted 31 high thermal conductivity particles that are grafted to the host resin matrix. Also a second class of non-grafted 30 high thermal conductivity particles that are not directly grafted the host resin matrix 32. The first class and the second class comprise approximately 2-60% by volume of the high thermal conductivity resin. The first class of grafted particles and the second class of non-grafted particles are high thermal conductivity fillers are from 1-1000 nm in length, and have an aspect ratio of between 3-100.
Abstract translation: 在一个应用中，混合物接枝和非接枝发明提供了高导热性树脂，其包含具有接枝到主体树脂基质上的第一类接枝31高导热性颗粒的主体树脂基质32。 还有第二类非接枝30高导热性颗粒，其不直接接枝主体树脂基体32.第一类和第二类包含约2-60体积％的高导热性树脂。 第一类接枝颗粒和第二类非接枝颗粒是高热导率填料，长度为1-1000nm，纵横比在3-100之间。
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公开(公告)号：WO2007011816A2
公开(公告)日：2007-01-25
申请号：PCT/US2006027555
申请日：2006-07-14
Applicant: ATKA SOFTWARE LLC , STEVENS GARY
Inventor： STEVENS GARY
IPC: G06F12/14
CPC classification number: G06F21/51 , G06F21/56 , G06F21/6281 , G06F2221/2137 , G06F2221/2149
Abstract: A computer security system and method using selective permission or denial of requests to create or modify program file to prevent introduction of malware onto a protected computer system. The selective permission or denial of requests is based on comparison of information regarding the requested action and a list of rules.
Abstract translation: 一种使用选择性许可或拒绝创建或修改程序文件的请求的计算机安全系统和方法，以防止将恶意软件引入受保护的计算机系统。 选择性许可或拒绝请求是基于所请求操作的信息与规则列表的比较。
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公开(公告)号：WO2006002013A1
公开(公告)日：2006-01-05
申请号：PCT/US2005/020561
申请日：2005-06-13
Applicant: SIEMENS POWER GENERATION, INC. , SMITH, James, D. , STEVENS, Gary , WOOD, John, W.
Inventor： SMITH, James, D. , STEVENS, Gary , WOOD, John, W.
IPC: H01B3/04
CPC classification number: H01B3/04 , C03C25/1095 , H01B3/084 , H05K1/0366 , H05K2201/0175 , H05K2201/029 , Y10T156/10 , Y10T442/2033 , Y10T442/2418 , Y10T442/2426 , Y10T442/2475 , Y10T442/2861 , Y10T442/2893 , Y10T442/291 , Y10T442/2918 , Y10T442/2992 , Y10T442/3382 , Y10T442/3935 , Y10T442/3976
Abstract: The present invention facilitates the thermal conductivity of fabrics by surface coating of the fabrics with high thermal conductivity materials (6). The fabrics may be surface coated when they are individual fibers or strands (4), bundles of strands, formed fabric or combinations therefore. A particular type of fibrous matrix used with the present invention is glass. Some fabrics may be a combination of more than one type of material, or may have different materials in alternating layers. HTC coatings of the present invention include diamond like coatings (DLC) and metal oxides, nitrides, carbides and mixed stoichiometric and non-stoichiometric combinations that can be applied to the host matrix.
Abstract translation: 本发明通过用高导热性材料表面涂布织物来促进织物的导热性（6）。 当它们是单独的纤维或股线（4），股线束，成形织物或组合时，织物可以被表面涂覆。 本发明使用的特定类型的纤维基质是玻璃。 一些织物可以是多于一种类型的材料的组合，或者可以在交替层中具有不同的材料。 本发明的HTC涂层包括金刚石涂层（DLC）和金属氧化物，氮化物，碳化物以及可以施加到主体基质上的混合的化学计量和非化学计量组合。
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Patent Agency Ranking
公开(公告)号：WO2008091494A3
公开(公告)日：2008-10-09
申请号：PCT/US2008000309
申请日：2008-01-09
Applicant: SIEMENS POWER GENERATION INC , STEVENS GARY , SMITH JAMES D B , WOOD JOHN W
Inventor： STEVENS GARY , SMITH JAMES D B , WOOD JOHN W
IPC: D21H17/13 , D21H17/62 , H01L21/316 , H02K3/40 , H05K1/03
CPC classification number: H01L21/316 , D21H13/44 , D21H17/13 , D21H17/20 , D21H25/005 , D21H27/00 , H01F27/2871 , H01F41/127 , H02K3/40 , H02K9/22 , H05K1/0373 , H05K2201/0209 , H05K2201/0248 , Y10T428/249953
Abstract: A method for the treatment of micro pores (24) within a mica paper (20) that includes obtaining a silane with a molecular weight of between approximately 15 and 300, and adding the silane to the mica paper (20). Then reacting the silane with the inner surface of the micro pores within the mica paper. After this, a resin is impregnated into the mica paper, and the resin binds to the inner surfaces of the micro pores (24) with the mica paper through the silane.
Abstract translation: 一种处理云母纸（20）内的微孔（24）的方法，该方法包括获得分子量约为15-300的硅烷，并将该硅烷添加到云母纸（20）中。 然后使硅烷与云母纸内微孔的内表面反应。 之后，将树脂浸渍到云母纸中，并且树脂通过硅烷与云母纸结合到微孔（24）的内表面。
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公开(公告)号：WO2008091489A1
公开(公告)日：2008-07-31
申请号：PCT/US2008/000166
申请日：2008-01-03
Applicant: SIEMENS POWER GENERATION, INC. , STEVENS, Gary , SMITH, James D. B. , WOOD, John W. , GROEPPEL, Peter
Inventor： STEVENS, Gary , SMITH, James D. B. , WOOD, John W. , GROEPPEL, Peter
CPC classification number: H01B3/04 , H01B3/025 , Y10T428/24994 , Y10T428/251 , Y10T428/2911 , Y10T442/2418 , Y10T442/2475 , Y10T442/2992 , Y10T442/699
Abstract: An electrical insulation paper that is made of mica flakelets (22), having an average size range of 0.01 to 0.05 mm in their thinnest dimension, hexagonal boron nitride (26), which has an average size range of 10 to 1,000 nm in their longest dimension, and a resin matrix. The mica flakelets and the hexagonal boron nitride are mixed and formed into a paper (17), and the resin is added to the paper after formation, the ratio by weight of the hexagonal boron nitride to the mica flakelets is directly proportional to the average size of the hexagonal boron nitride compared to the average size of the mica flakelets, within an adjustment factor.
Abstract translation: 由云母片（22）制成的电绝缘纸，其最薄尺寸的平均尺寸范围为0.01〜0.05mm，六方氮化硼（26）的平均尺寸范围为10〜1000nm，最长 尺寸和树脂基体。 将云母片和六方氮化硼混合并形成纸（17），并且在形成后将树脂加入到纸中，六方氮化硼与云母片的重量比与平均尺寸成正比 的六角形氮化硼与云母片的平均尺寸相比在调整因子内。
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公开(公告)号：WO2008013570A3
公开(公告)日：2008-04-03
申请号：PCT/US2007000086
申请日：2007-01-03
Applicant: SIEMENS POWER GENERATION INC , SMITH JAMES D B , STEVENS GARY , WOOD JOHN W
Inventor： SMITH JAMES D B , STEVENS GARY , WOOD JOHN W
CPC classification number: B32B29/02 , B32B29/06 , B32B2255/12 , B32B2255/24 , B32B2260/021 , B32B2260/028 , B32B2260/046 , B32B2264/104 , B32B2264/108 , B32B2307/206 , B32B2307/302 , B32B2307/54 , B32B2405/00 , B32B2457/00 , B32B2554/00 , B32B2581/00 , D21H13/44 , D21H17/67 , D21H17/69 , D21H19/64 , D21H21/54 , Y10T428/24793 , Y10T428/24851 , Y10T428/24893 , Y10T442/2418 , Y10T442/2426 , Y10T442/2475 , Y10T442/2992
Abstract: The present invention provides for high thermal conductivity paper that comprises a host matrix (10), and high thermal conductivity materials (12) added to a surface of the host matrix in a specific pattern (12). The high thermal conductivity materials are comprised of one or more of nanofillers, diamond like coatings directly on the host matrix, and diamond like coatings on the nanofillers. In particular embodiments the specific pattern comprises one or more of a grid, edging, banding centering and combinations thereof and the high thermal conductivity materials cover 15-55% of the surface of the host matrix. Multiple surfaces, including sub layers my have patterning.
Abstract translation: 本发明提供高导热率纸，其包含主体基质（10）和以特定图案（12）添加到主体基质表面的高热导率材料（12）。 高导热率材料由一种或多种纳米填料，直接位于主体基质上的类金刚石涂层和纳米填料上的类金刚石涂层组成。 在特定实施例中，特定图案包括网格，边缘，带状居中以及它们的组合中的一个或多个，并且高热导率材料覆盖主体基质表面的15-55％。 多个表面，包括子图层我都有图案。
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公开(公告)号：WO2006002012A1
公开(公告)日：2006-01-05
申请号：PCT/US2005/020560
申请日：2005-06-13
Applicant: SIEMENS POWER GENERATION, INC. , SMITH, James D., B. , STEVENS, Gary , WOOD, John, W. , LUTZ, Andreas
Inventor： SMITH, James D., B. , STEVENS, Gary , WOOD, John, W. , LUTZ, Andreas
IPC: H02K3/30
Abstract: The present invention provides for a method of impregnating a matrix with a high thermal conductivity filled resin (32), which produces a resin impregnated matrix. The high thermal conductivity material (30) comprises 5-60% by volume of the resin (32). This is compressed by approximately 5-30%, and the distances between the high thermal conductivity materials loaded in the resin are reduced, and the resin is then cured.
Abstract translation: 本发明提供了一种用高导热性填充树脂（32）浸渍基质的方法，其产生树脂浸渍基质。 高导热性材料（30）包含5-60体积％的树脂（32）。 这被压缩大约5-30％，并且装载在树脂中的高热导率材料之间的距离减小，然后树脂固化。
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公开(公告)号：WO2006002011A1
公开(公告)日：2006-01-05
申请号：PCT/US2005/020557
申请日：2005-06-13
Applicant: SIEMENS POWER GENERATION, INC. , SMITH, James, D., B. , STEVENS, Gary , WOOD, John W.
Inventor： SMITH, James, D., B. , STEVENS, Gary , WOOD, John W.
IPC: C09C3/06
CPC classification number: H01B3/006 , B82Y30/00 , C01P2004/13 , C01P2004/20 , C01P2004/32 , C01P2004/50 , C01P2004/54 , C01P2004/61 , C01P2004/62 , C01P2004/64 , C09C1/028 , C09C1/043 , C09C1/3054 , C09C1/3661 , C09C1/407 , C09C3/063 , Y10T428/25 , Y10T428/256 , Y10T428/257 , Y10T428/259 , Y10T428/2991 , Y10T428/2998
Abstract: In one embodiment the present invention provides for a diamond like coating on small particles. This comprises small particles (10) in the size range of approximately 1-1000 nm and a diamond like coating on the small particles. The diamond like coating is distributed over approximately 50-100% of the surface of the small particles and the diamond like coating is one micron or less in thickness. These small particles then may be applied to materials such as resins (12) and insulating tapes
Abstract translation: 在一个实施方案中，本发明提供了在小颗粒上的类金刚石涂层。 这包括尺寸范围为约1-1000nm的小颗粒（10）和在小颗粒上的金刚石样涂层。 金刚石状涂层分布在小颗粒表面的大约50-100％之上，并且类似金刚石的涂层的厚度为1微米或更小。 然后，这些小颗粒可以应用于诸如树脂（12）和绝缘带的材料
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