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公开(公告)号：WO2007011816A2
公开(公告)日：2007-01-25
申请号：PCT/US2006027555
申请日：2006-07-14
Applicant: ATKA SOFTWARE LLC , STEVENS GARY
Inventor： STEVENS GARY
IPC: G06F12/14
CPC classification number: G06F21/51 , G06F21/56 , G06F21/6281 , G06F2221/2137 , G06F2221/2149
Abstract: A computer security system and method using selective permission or denial of requests to create or modify program file to prevent introduction of malware onto a protected computer system. The selective permission or denial of requests is based on comparison of information regarding the requested action and a list of rules.
Abstract translation: 一种使用选择性许可或拒绝创建或修改程序文件的请求的计算机安全系统和方法，以防止将恶意软件引入受保护的计算机系统。 选择性许可或拒绝请求是基于所请求操作的信息与规则列表的比较。
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公开(公告)号：WO2005123867A2
公开(公告)日：2005-12-29
申请号：PCT/US2005021116
申请日：2005-06-15
Applicant: SIEMENS WESTINGHOUSE POWER , SMITH JAMES DAVID BLACKHALL , STEVENS GARY , WOOD JOHN WILLIAM
Inventor： SMITH JAMES DAVID BLACKHALL , STEVENS GARY , WOOD JOHN WILLIAM
CPC classification number: C08J5/10 , C08K3/14 , C08K3/22 , C08K2201/016 , D21H27/00 , Y10T442/20 , Y10T442/2992 , Y10T442/50
Abstract: In one embodiment the present invention provides for a high thermal conductivity resin that comprises a host resin matrix 32 and a high thermal conductivity filler 30. The high thermal conductivity filler forms a continuous organic-inorganic composite with the host resin matrix, and the high thermal conductivity fillers are from 1-1000 nm in length and have an aspect ratio of between 3-100.
Abstract translation: 在一个实施方案中，本发明提供了一种高导热性树脂，其包含主体树脂基质32和高导热性填料30.高导热性填料与主体树脂基体形成连续的有机 - 无机复合物，并且高热 导电填料的长度为1-1000nm，纵横比在3-100之间。
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Patent Agency Ranking3.发明申请
公开(公告)号：WO2005123825A3
公开(公告)日：2006-05-04
申请号：PCT/US2005021115
申请日：2005-06-15
Applicant: SIEMENS POWER GENERATION INC , SMITH JAMES DAVID BLACKHALL , STEVENS GARY , WOOD JOHN WILLIAM
Inventor： SMITH JAMES DAVID BLACKHALL , STEVENS GARY , WOOD JOHN WILLIAM
IPC: C08L101/00 , C08K3/00 , C08K3/14 , C08K3/22 , C08K3/28 , C08K7/00 , C08K9/04 , C08L63/00 , H01B3/00
CPC classification number: C08J5/10 , C08J5/24 , C08K3/14 , C08K3/18 , C08K3/22 , C08K3/28 , C08K9/04 , C08K2201/016 , D21H17/33 , D21H17/67 , Y10T428/24994 , Y10T428/31511 , C08L63/00
Abstract: In one embodiment the present invention provides for high thermal conductivity materials (30) that have surface functional groups grafted thereto. These grafted surface functional groups then form a continuous bond with a host resin matrix (32) that the high thermal conductivity materials (30) are added to.
Abstract translation: 在一个实施方案中，本发明提供具有接枝到其上的表面官能团的高导热性材料（30）。 这些接枝的表面官能团随后与主要树脂基体（32）形成连续的结合，该主体树脂基质（32）被加入到高导热性材料（30）中。
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4.发明申请NANO AND MESO SHELL-CORE CONTROL OF PHYSICAL PROPERTIES AND PERFORMANCE OF ELECTRICALLY INSULATING COMPOSITES 审中-公开电绝缘复合材料的物理性能和性能的纳米和外壳外壳控制
公开(公告)号：WO2008042076A2
公开(公告)日：2008-04-10
申请号：PCT/US2007019502
申请日：2007-09-06
Applicant: SIEMENS POWER GENERATION INC , STEVENS GARY , SMITH JAMES D B , WOOD JOHN W
Inventor： STEVENS GARY , SMITH JAMES D B , WOOD JOHN W
CPC classification number: H05K1/0373 , H05K2201/0209 , H05K2201/0224 , H05K2201/0248 , Y10T428/25 , Y10T428/251 , Y10T428/254 , Y10T428/256 , Y10T428/257 , Y10T428/258 , Y10T428/259 , Y10T428/31511 , Y10T428/31993
Abstract: A high thermal conductivity resin that is made up of a host resin matrix (42) and high thermal conductivity fillers (30) that are mixed within the host resin to form a resin mixture. The fillers comprise at least 3-5% by weight of the resin mixture, and the fillers are from an average of 1 -100 nm in at least one dimension, and where the particles are smaller than an average of 1000 nm in the particles' longest dimension. The host resin matrix forms an ordered resin shell (40) around the high thermal conductivity fillers (30), whereby resin molecules are aligned perpendicular to the surface of the high thermal conductivity fillers. An overlap of the ordered resin shells (44) is formed between the high thermal conductivity fillers such that continuous pathways for ordered resin shells are created through the resin mixture.
Abstract translation: 由主体树脂基体（42）和高导热性填料（30）组成的高导热性树脂，其在主体树脂内混合以形成树脂混合物。 所述填料占所述树脂混合物的至少3-5重量％，并且所述填料在至少一个维度上平均为1-100nm，并且其中所述颗粒的平均粒径小于1000nm， 最长的尺寸。 主树脂基质在高热导率填料（30）周围形成有序树脂壳（40），由此树脂分子垂直于高热导率填料表面排列。 在高热导率填料之间形成有序树脂壳（44）的重叠，使得通过树脂混合物形成有序树脂壳的连续路径。
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公开(公告)号：WO2006002010A3
公开(公告)日：2006-02-09
申请号：PCT/US2005020556
申请日：2005-06-13
Applicant: SIEMENS POWER GENERATION INC , SMITH JAMES D B , STEVENS GARY , WOOD JOHN W
Inventor： SMITH JAMES D B , STEVENS GARY , WOOD JOHN W
IPC: B32B1/00 , H01B17/00 , H01F27/22 , H01F27/32 , H02K3/30 , H02K3/34 , H02K9/22 , H01B3/00 , H01B19/04 , H01F5/06 , H01F41/12
CPC classification number: H02K3/30 , H01F27/22 , H01F27/323 , H02K3/34 , H02K9/22 , Y10T428/265
Abstract: In one embodiment the present invention improves the heat flow from an electrically insulated object 13 by providing an enhanced conduit at the interface between the layers of insulating tape 16. The tape 16 has been surface coated with a high thermal conductivity (HTC) material, so that the interface between the layers of tape 23 provides a pathway for the heat to reach the environment 24. The radiation of heat through the tape layers is also increased by the surface coatings
Abstract translation: 在一个实施例中，本发明通过在绝缘带16之间的界面处提供增强的导管来改善来自电绝缘物体13的热流。带16已经被表面涂覆有高导热性（HTC）材料，因此 胶带层23之间的界面提供了一种使热量达到环境24的途径。通过胶带层的热辐射也通过表面涂层
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公开(公告)号：WO2008091494A3
公开(公告)日：2008-10-09
申请号：PCT/US2008000309
申请日：2008-01-09
Applicant: SIEMENS POWER GENERATION INC , STEVENS GARY , SMITH JAMES D B , WOOD JOHN W
Inventor： STEVENS GARY , SMITH JAMES D B , WOOD JOHN W
IPC: D21H17/13 , D21H17/62 , H01L21/316 , H02K3/40 , H05K1/03
CPC classification number: H01L21/316 , D21H13/44 , D21H17/13 , D21H17/20 , D21H25/005 , D21H27/00 , H01F27/2871 , H01F41/127 , H02K3/40 , H02K9/22 , H05K1/0373 , H05K2201/0209 , H05K2201/0248 , Y10T428/249953
Abstract: A method for the treatment of micro pores (24) within a mica paper (20) that includes obtaining a silane with a molecular weight of between approximately 15 and 300, and adding the silane to the mica paper (20). Then reacting the silane with the inner surface of the micro pores within the mica paper. After this, a resin is impregnated into the mica paper, and the resin binds to the inner surfaces of the micro pores (24) with the mica paper through the silane.
Abstract translation: 一种处理云母纸（20）内的微孔（24）的方法，该方法包括获得分子量约为15-300的硅烷，并将该硅烷添加到云母纸（20）中。 然后使硅烷与云母纸内微孔的内表面反应。 之后，将树脂浸渍到云母纸中，并且树脂通过硅烷与云母纸结合到微孔（24）的内表面。
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公开(公告)号：WO2008013570A3
公开(公告)日：2008-04-03
申请号：PCT/US2007000086
申请日：2007-01-03
Applicant: SIEMENS POWER GENERATION INC , SMITH JAMES D B , STEVENS GARY , WOOD JOHN W
Inventor： SMITH JAMES D B , STEVENS GARY , WOOD JOHN W
CPC classification number: B32B29/02 , B32B29/06 , B32B2255/12 , B32B2255/24 , B32B2260/021 , B32B2260/028 , B32B2260/046 , B32B2264/104 , B32B2264/108 , B32B2307/206 , B32B2307/302 , B32B2307/54 , B32B2405/00 , B32B2457/00 , B32B2554/00 , B32B2581/00 , D21H13/44 , D21H17/67 , D21H17/69 , D21H19/64 , D21H21/54 , Y10T428/24793 , Y10T428/24851 , Y10T428/24893 , Y10T442/2418 , Y10T442/2426 , Y10T442/2475 , Y10T442/2992
Abstract: The present invention provides for high thermal conductivity paper that comprises a host matrix (10), and high thermal conductivity materials (12) added to a surface of the host matrix in a specific pattern (12). The high thermal conductivity materials are comprised of one or more of nanofillers, diamond like coatings directly on the host matrix, and diamond like coatings on the nanofillers. In particular embodiments the specific pattern comprises one or more of a grid, edging, banding centering and combinations thereof and the high thermal conductivity materials cover 15-55% of the surface of the host matrix. Multiple surfaces, including sub layers my have patterning.
Abstract translation: 本发明提供高导热率纸，其包含主体基质（10）和以特定图案（12）添加到主体基质表面的高热导率材料（12）。 高导热率材料由一种或多种纳米填料，直接位于主体基质上的类金刚石涂层和纳米填料上的类金刚石涂层组成。 在特定实施例中，特定图案包括网格，边缘，带状居中以及它们的组合中的一个或多个，并且高热导率材料覆盖主体基质表面的15-55％。 多个表面，包括子图层我都有图案。
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