Abstract:
대형 액정 디스플레이 (100) 는, 액정 패널 (1) 의 이면 측에 배치된 도광판 (3) 을 가지고 있다. 도광판 (3) 의 표면은 평면이고, 이면은 오목 곡면으로 되어 있다. 또, 열음극형 형광 램프 (2a, 2b) 에 대향하는 도광판 (3) 의 상하 단면은, 이들 램프를 향하여 돌출된 볼록상이 되어 있다. 형광 램프로부터의 백색광은, 직접 혹은 리플렉터 (4a, 4b) 에 반사되어 도광판의 상하 단면에 입사되어, 도광판의 내부를 그 표리면에서 반사시키면서 진행된다. 도광판의 표면에서는, 도광부 (5) 에 의해 백색광의 일부가 액정 패널 (1) 의 이면으로 조사된다.
Abstract:
Disclosed is a structural member for a plasma treatment system, which is excellent in film-forming properties, durability and reliability. The structural member comprises a substrate and a ceramic film provided on the substrate, wherein the ceramic film has a purity of 98% or higher. In the ceramic film, a particle constituting the film has a particle diameter of 50 nm or smaller, and the amount of moisture released from the film is 1019 molecules/cm2 or less. ® KIPO & WIPO 2009
Abstract translation:公开了一种等离子体处理系统的结构构件,其成膜性,耐久性和可靠性优异。 该结构部件包括基板和设置在基板上的陶瓷膜,其中陶瓷膜的纯度为98%以上。 在陶瓷膜中,构成膜的粒子的粒径为50nm以下,从膜剥离的水分量为1019个/ cm 2以下。 ®KIPO&WIPO 2009
Abstract:
A plasma processing apparatus including antenna is provided to prevent a discharge error and to generate uniform and stable plasma by not generating a gap between a metal electrode and dielectric cover. A plasma processing apparatus processes an object using plasma generated by exciting a gas with an electromagnetic wave, and includes a treatment receptacle, an electromagnetic wave source, a conductor rod, a dielectric plate(305), and a metal electrode(310). The electromagnetic wave source outputs an electromagnetic wave. The conductor rod transmits the electromagnetic wave outputted from the electromagnetic wave source. A penetration hole(305a) is formed on the dielectric plate which emits the electromagnetic wave transmitted from the conductor rod. The metal electrode is connected to the conductor rod through the penetration hole formed in the dielectric plate. An open surface of the metal electrode is covered with the dielectric cover(320).
Abstract:
In order to obtain substantially identical operation speed of a p-type MOS transistor and n-type MOS transistor constituting the CMOS circuit, the n-type MOS transistor has a three-dimensional structure having channel regions on both of the (100) surface and the (110) surface and the p-type MOS transistor has a planer structure having a channel region only on the (110) surface. Furthermore, the circuit is configured so that the areas of the channel regions and the gate insulation films of the both transistors are identical to each other. Thus, it is possible to obtain identical area of the gate insulation film and the like and the gate capacity.
Abstract:
This invention provides a shower plate (31) for plasma treatment formed of a plurality of pipings. The shower plate comprises piping (31A3) comprising a porous material member (44), which is disposed along the piping and has a predetermined porosity to a raw material gas and is convexed to the outside, and a metallic member (41) which is disposed so as to face the porous material member (44) and, together with the porous material member (44), constitutes a raw material gas flow passage (43). According to the above constitution, a nozzle structure, which can release the raw material gas in a divergent form, can be realized.
Abstract:
Provided are a film forming apparatus by which an expensive organic EL material can be used without wasting it and an organic EL film can be uniformly formed over a long period of time, and a jig for such film forming device. A single material container section is provided with a plurality of blow out containers. A switching device is provided for switching a piping system, which vaporizes the organic EL material in the material container section and supplies each blow out container with the vaporized material with a carrier gas, to a piping system of other blow out container. The use efficiency of the organic EL material is improved by supplying the blow out containers with the organic EL material from the single material container section by switching.
Abstract:
Provided are an evaporating jig by which a thin film, especially an organic EL film, can be uniformly formed over a long time, and a film forming apparatus including the evaporating jig. The evaporating jig is provided with an evaporating pan, having a bottom plane and side planes arranged to stand from the bottom plane, for defining a material containing space opened inside the side planes; and partitioning plates for partitioning the material containing space into a plurality of partial spaces. The partitioning plates are provided with locking pieces having a height which permits the partial spaces to be continuous on a bottom plane side of the evaporating pan.
Abstract:
Multifunction production equipment enabling a plurality of processes in which deposition of reaction products on the inner wall of the processing chamber of equipment for producing a semiconductor or a flat-plate display, metal contamination due to corrosion of the inner wall, or the like, and fluctuation of the process due to discharged gas are suppressed, and a protective film structure for use therein. On the surface of a metal material, a first coating layer having an oxide coating of 1 V thick or less formed as an underlying layer by direct oxidation of a parent material, and a second coating layer of about 200mum thick are formed. With such an arrangement, corrosion resistance against irradiation with ions or radicals can be imparted to a second layer protective film, and the effect of a protective layer for preventing corrosion of the surface of parent metal caused by diffusing molecules or ions into the second layer protective film can be imparted to the first layer oxide film. Consequently, contamination of the substrate with metals generated from each metal member and the inner surface of the process chamber is reduced, and stripping of the second layer protective film due to lowering in adhesion of the second layer protective film due to corrosion of the interface between the parent material and the second layer protective film can be suppressed. ® KIPO & WIPO 2008
Abstract:
At least a part of an element isolating region other than a gate insulating film (silicon dioxide film), an interlayer insulating film and a protection insulating film is formed of a carbon fluoride (CFx, 0.3
Abstract:
A resin pipe and a resin material are provided to obtain a required amount of dissolved oxygen, oxygen permeability coefficient, and a flexural modulus. A resin pipe has an oxygen permeability coefficient of 5x10^6 (molecules.cm/cm^2 .sec.Pa) or less, and a flexural modulus of 1800 Mpa or less. The resin pipe contains a fluorine resin. The resin pipe includes a PFA(tetrafluoroethylene-perfluoroalkylvinylether copolymer) pipe(12) forming an inner layer and a nylon pipe(14) forming an outer layer. The PFA pipe and the nylon pipe are coupled with each other through a bonding layer(16).