公开(公告)号：KR100728748B1

公开(公告)日：2007-06-19

申请号：KR1020050122863

申请日：2005-12-14

Applicant: 삼성전기주식회사

Inventor： 조지홍 ,  조한서 ,  안진용 ,  서해남 ,  김병문 ,  조석현 ,  조정우

IPC: H05K3/30 ,  H05K1/18

Abstract: A method for manufacturing an embedded printed circuit board is provided to reduce manufacturing cost by using an insulation tape as a layer of the embedded printed circuit board. A method for manufacturing an embedded printed circuit board includes the steps of: forming a circuit pattern on a surface of a copper clad laminate plate, and forming a reception hole by punching a part(S10); attaching an insulation tape on the surface of the copper clad laminate plate to cover the reception hole(S20); mounting a chip on the insulation tape inside the reception hole(S30); filling an insulation material in the reception hole(S40); laminating the insulation layer to cover the other surface of the copper clad laminate plate(S60); and forming a via-hole and an outer layer circuit which are electrically connected to an electrode of the chip, on the insulation tape(S80).

Abstract translation: 提供一种用于制造嵌入式印刷电路板的方法，以通过使用绝缘带作为嵌入式印刷电路板的层来降低制造成本。 一种用于制造嵌入式印刷电路板的方法包括以下步骤：在覆铜层压板的表面上形成电路图案，并且通过冲压一部分来形成接收孔（S10）; 在覆铜箔层压板的表面贴附绝缘胶带以覆盖接收孔（S20）; 将芯片安装在接收孔内的绝缘带上（S30）; 在接收孔中填充绝缘材料（S40）; 层压绝缘层以覆盖覆铜层压板的另一表面（S60）; 以及在绝缘带上形成电连接到芯片的电极的通孔和外层电路（S80）。