-
公开(公告)号：KR1020140021890A
公开(公告)日：2014-02-21
申请号：KR1020120088340
申请日：2012-08-13
Applicant: 삼성전기주식회사
Abstract: A prove module for a conductive test according to the present invention comprises: a base plate; a plurality of mounting units on the base plate; prove pins mounted on the side of the mounting units; and connectors for connecting electrically to the external testing device and the probe pins through the mounting plate and the mounting units, wherein the mounting units are formed in a step different from each other.
Abstract translation: 根据本发明的用于导电测试的证明模块包括：基板; 基板上的多个安装单元; 证明安装在安装单元一侧的销钉; 以及用于通过安装板和安装单元电连接到外部测试装置和探针的连接器，其中安装单元以彼此不同的台阶形成。
-
公开(公告)号：KR101287668B1
公开(公告)日：2013-07-24
申请号：KR1020110074595
申请日：2011-07-27
Applicant: 삼성전기주식회사
Abstract: 본 발명은 본 발명은: 피검체인 인쇄회로기판을 전기 검사하는 전기 검사 장치로서, 상기 인쇄회로기판의 검사를 위한 검사 신호를 출력하는 중계 기판; 상기 중계 기판과 전기적으로 연결되며, 상기 인쇄회로기판에 형성된 복수의 외부접속수단의 돌출 높이 차이에 대응하여 길이 차이를 갖는 복수의 검사 핀; 및 상기 복수의 검사 핀의 단부를 둘러싸는 복수의 관통홀이 형성되며, 상기 복수의 검사 핀의 각 단부가 적어도 하나 이상의 도전성 범프와 적어도 하나 이상의 도전성 패드로 구성된 상기 복수의 외부접속수단에 접속하여 상기 인쇄회로기판을 전기 검사시 상기 복수의 검사 핀의 단부를 지지하는 서포터 플레이트;를 포함하는 전기 검사 장치를 제공한다.
본 발명에 따르면, 인쇄회로기판 전기 검사시 복수의 검사 핀이 솔더 범프 및 전기 패드 등 인쇄회로기판의 외부접속수단에 균일한 압력으로 접촉 가능함으로써 제품검사의 과검을 방지하여 인쇄회로기판의 검사 신뢰성 향상 및 수율을 향상시키며 복수의 검사 핀의 수명 향상 등 전기 검사 장치의 내구성 및 성능을 향상할 수 있다.-
公开(公告)号：KR101074406B1
公开(公告)日：2011-10-17
申请号：KR1020090104770
申请日：2009-11-02
Applicant: 삼성전기주식회사
IPC: G02B6/13
CPC classification number: G02B6/1221 , G02B6/138
Abstract: 광기판및 그제조방법이개시된다. 배선홈이형성된베이스기판을제공하는단계, 배선홈에제1클래드물질을충전하여, 제1클래드층을형성하는단계, 베이스기판에배선홈에상응하는제1관통홀이형성된중간절연층을적층하는단계, 제1클래드층상에코어부를형성하는단계, 중간절연층에제1관통홀에상응하는제2관통홀이형성된커버절연층을적층하는단계, 제2관통홀에제2클래드물질을충전하여코어부를커버하는제2클래드층을형성하는단계를포함하는광기판제조방법은, 코어부및 클래드층을형성할홈 형상의영역에만코어물질및 클래드물질을충전함으로써코어물질및 클래드물질의낭비를방지할수 있고, 홈형상에코어물질및 클래드물질을충전하여코어부및 클래드층을형성함으로써코어부및 클래드층의두께를용이하게조절할수 있다.
Abstract translation: 公开了一种导光板及其制造方法。 提供了在其上通过填充一个包层材料第一形成的布线槽的基底基板，所述第一包层，以形成层，通孔第一层叠的中间绝缘层上形成对应于在基底基板的布线用槽到布线槽 包括：一个第一包层，其包括所述方法：形成在第一层叠通过覆盖绝缘层孔中的第二步骤的芯分别对应于形成有通孔的中间绝缘层中，第二电荷上的通孔的第二覆层材料 接收器板的制造方法包括：形成其部分覆盖所述芯，所述芯部和包覆层由充电唯一芯材料和包层材料区域的第二包层的工序中的槽状的，以形成所述芯材和包层材料的浪费 并且，通过用芯材和包层材料填充凹槽形状以形成芯部分和包层，可以容易地调节芯部分和包层的厚度。
-
公开(公告)号：KR1020110053000A
公开(公告)日：2011-05-19
申请号：KR1020090109778
申请日：2009-11-13
Applicant: 삼성전기주식회사
IPC: G02B6/13
CPC classification number: G02B6/4214 , B32B37/02 , B32B38/10 , B32B2038/0092 , B32B2457/08 , B32B2457/14 , G02B6/428 , G02B6/43 , Y10T156/1002
Abstract: PURPOSE: An optical wiring board and manufacturing method thereof are provided to inexpensively form a mirror on a light waveguide and form an electrode pad on a flat surface opposite to the mirror, thereby easily mounting a photoelectric device. CONSTITUTION: A method for manufacturing an optical substrate comprises the following steps. A mirror groove is formed on one side of an optical waveguide layer. A first insulating layer is laminated on one side of the optical waveguide. A penetration hole connected with the mirror groove is formed on the first insulating layer. A base substrate includes the first insulating layer(S110). A metal mirror layer is connected from the mirror groove to the inner wall of the penetration hole(S120). An electrode pad corresponds to the metal mirror layer(S130).
Abstract translation: 目的：提供一种光布线板及其制造方法，在光波导上廉价地形成反射镜，并在与反射镜相反的平面上形成电极焊盘，从而容易地安装光电器件。 构成：制造光学衬底的方法包括以下步骤。 在光波导层的一侧形成镜面凹槽。 在光波导的一侧层叠第一绝缘层。 在第一绝缘层上形成与反射镜槽连接的贯通孔。 基底基板包括第一绝缘层（S110）。 金属镜层从反射镜槽连接到穿透孔的内壁（S120）。 电极垫对应于金属镜面层（S130）。
-
公开(公告)号：KR1020110046714A
公开(公告)日：2011-05-06
申请号：KR1020090103321
申请日：2009-10-29
Applicant: 삼성전기주식회사
CPC classification number: H01L2224/48091 , H01L2924/00014
Abstract: PURPOSE: An LED package and manufacturing method thereof are provided to form a heat emitting unit and a circuit unit on one metal substrate to simplify the structure of the LED package, thereby saving costs. CONSTITUTION: A metal substrate includes a circuit unit(A) and a heat emitting unit(B) which are separated by a slot(110). An insulating layer(120) is formed on the metal substrate including the slot. An LED chip(140) is mounted on the heat emitting unit of the metal substrate opened to the insulating layer. A pair of wires(150) electrically connect the LED chip with a heat emitting unit and a circuit unit of the metal substrate. A transparent resin(160) is formed on the metal substrate to cover the LED chip and the wire.
Abstract translation: 目的：提供一种LED封装及其制造方法，以在一个金属基板上形成发热单元和电路单元，以简化LED封装的结构，从而节省成本。 构成：金属基板包括由槽（110）分开的电路单元（A）和发热单元（B）。 在包括槽的金属基板上形成绝缘层（120）。 LED芯片（140）安装在向绝缘层开放的金属基板的发热单元上。 一对电线（150）将LED芯片与金属基板的发热单元和电路单元电连接。 在金属基板上形成透明树脂（160）以覆盖LED芯片和导线。
-
Patent Agency Ranking
公开(公告)号：KR1020110010013A
公开(公告)日：2011-01-31
申请号：KR1020090067510
申请日：2009-07-23
Applicant: 삼성전기주식회사
IPC: G02B6/12
CPC classification number: G02B6/43 , B32B2307/51 , B32B2457/08 , C07D301/06 , G02B6/138 , H05K1/0274 , H05K1/028 , H05K3/281 , H05K3/4635 , H05K2203/063 , Y10T29/49126 , Y10T156/10
Abstract: PURPOSE: A printed circuit board for an optical wave guide and a manufacturing method thereof are provided to minimize the influence of stress applied to a circuit pattern. CONSTITUTION: An optical waveguide(60) is formed on the upper center of a base board(10) and includes a lower clad(60a), a core(60b), and an upper clad(60c). The core is formed on the upper center of the lower clad. The lower clad surrounds the upper side and lateral side of the core. A lateral substrate(80) is formed on the base substrate and includes a penetration hole(50) through which an optical waveguide passes and a first circuit pattern.
Abstract translation: 目的：提供一种用于光波导的印刷电路板及其制造方法以最小化施加于电路图案的应力的影响。 构成：在基板（10）的上部中心形成有光波导（60），其包括下部包层（60a），芯部（60b）和上部包层（60c）。 芯部形成在下部包层的上部中心。 下包层围绕着芯的上侧和外侧。 侧基板（80）形成在基底基板上，并且包括光波导通过的穿透孔（50）和第一电路图案。
-
公开(公告)号：KR1020100133767A
公开(公告)日：2010-12-22
申请号：KR1020090052475
申请日：2009-06-12
Applicant: 삼성전기주식회사
CPC classification number: G02B6/138
Abstract: PURPOSE: A printed circuit board and a manufacturing method thereof are provided to remarkably reduce the amount of a core material and a clad material which are used for the formation of an optical waveguide. CONSTITUTION: An insulating layer(500) includes a laminated penetrated hole on a lower substrate(100). An optical waveguide is formed between the inner wall of the penetrate hole at an interval. An adhesive layer(700) is filled in the interval.
Abstract translation: 目的：提供印刷电路板及其制造方法，以显着地减少用于形成光波导的芯材和包覆材料的量。 构成：绝缘层（500）在下基板（100）上包括层叠的穿透孔。 在穿孔的内壁间隔地形成光波导。 在该间隔中填充粘合剂层（700）。
-
公开(公告)号：KR1020100125647A
公开(公告)日：2010-12-01
申请号：KR1020090044458
申请日：2009-05-21
Applicant: 삼성전기주식회사
Abstract: PURPOSE: A method for inspecting a substrate with an optical waveguide layer is provided to efficiently determine the fault of a substrate without damage to the substrate formed with an optical waveguide layer. CONSTITUTION: A method for inspecting a substrate(100) with an optical waveguide layer(110) comprises following steps. The image of an optical waveguide layer is obtained. The deformity of the optical waveguide layer is digitalized from the image. The transmission loss of the optical waveguide layer is calculated according to the value. The transmission loss and standard value are compared.
Abstract translation: 目的：提供一种用于检测具有光波导层的基板的方法，以有效地确定基板的故障而不损坏形成有光波导层的基板。 构成：用光波导层（110）检查基板（100）的方法包括以下步骤。 获得光波导层的图像。 光波导层的畸变从图像数字化。 光波导层的传输损耗根据该值计算。 比较传输损耗和标准值。
-
公开(公告)号：KR1020090008631A
公开(公告)日：2009-01-22
申请号：KR1020070071720
申请日：2007-07-18
Applicant: 삼성전기주식회사
IPC: G02B6/42
Abstract: A flexible substrate and a substrate module using the same are provided to improve combination reliability between a flexible substrate and a mainboard by arranging an optical device such as a light receiving element and an emitting device to the mainboard. A substrate module comprises a flexible substrate(21) connecting a first substrate, and a second substrate, and first and second substrates. All kinds of the electric components are positioned in the first and second substrates. A circuit pattern which electrically connects the electric components is formed in the first and second substrates. In the first and the second substrates, first and second substrate connectors are combined respectively in order to connect the first and second substrates. In the flexible substrate, flexible substrate connectors(215a,215b) are combined. In the flexible substrate, a circuit pattern for connecting electric signals is formed and an optical waveguide for transmitting the optical signal is included. The optical waveguide is composed of an optical guide waveguide core and optical waveguide clad coating the optical guide waveguide core. In the single-side of the optical guide clad, an insulating layer is laminated.
Abstract translation: 提供了柔性基板和使用其的基板模块，以通过将诸如光接收元件和发射装置的光学装置布置到主板来提高柔性基板和主板之间的组合可靠性。 衬底模块包括连接第一衬底和第二衬底以及第一和第二衬底的柔性衬底（21）。 各种电气部件位于第一和第二基板中。 在第一和第二基板中形成电连接电气部件的电路图形。 在第一和第二基板中，分别组合第一和第二基板连接器以连接第一和第二基板。 在柔性基板中，组合柔性基板连接器（215a，215b）。 在柔性基板中，形成用于连接电信号的电路图案，并且包括用于发送光信号的光波导。 光波导由光导波导芯和光波导包覆光导波导芯组成。 在光导包层的单侧，层压绝缘层。
-
公开(公告)号：KR1020080015288A
公开(公告)日：2008-02-19
申请号：KR1020060076807
申请日：2006-08-14
Applicant: 삼성전기주식회사
IPC: H05K1/02
CPC classification number: G02B6/43 , G02B6/4214 , H05K1/0274
Abstract: An optical printed circuit board and its fabricating method are provided to improve optical interconnection by reducing a gap between a clad layer and a photo diode of a transmission chip or VCSEL(Vertical-Cavity Surface-Emitting Laser) of a receiving chip. A method for fabricating an optical printed circuit board comprises the steps of: forming holes on a metal foil; laminating a lower clad layer(15) for filling the holes, wherein the lower clad layer has an optical interconnection bump(17); forming the optical interconnection bump by laminating the lower clad layer; laminating a core layer(19) on the low clad layer, wherein the core layer is positioned inside an upper clad layer(29); forming first and second reflective layers(21,23) in the core layer corresponding to each position of the holes; laminating the upper clad layer on the lower clad layer; and forming a circuit pattern(27) on the metal foil.
Abstract translation: 提供一种光学印刷电路板及其制造方法，通过减小接收芯片的透射芯片或VCSEL（垂直腔表面发射激光器）的覆盖层和光电二极管之间的间隙来改善光互连。 一种用于制造光学印刷电路板的方法包括以下步骤：在金属箔上形成孔; 层叠用于填充孔的下包层（15），其中下包层具有光互连凸块（17）; 通过层叠下包层来形成光互连凸块; 在所述低包覆层上层叠芯层（19），其中所述芯层位于上覆层（29）的内部; 在对应于孔的每个位置的芯层中形成第一和第二反射层（21,23）; 在下包层上层叠上覆层; 以及在所述金属箔上形成电路图案（27）。
-
-
-
-
-
-
-
-
-
Search Results
110
records
(took 0.03 seconds)
