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公开(公告)号：KR1020140084904A
公开(公告)日：2014-07-07
申请号：KR1020120154916
申请日：2012-12-27
Applicant: 전자부품연구원
Inventor： 임영민
CPC classification number: A42B3/30 , A42B3/0406 , H04R1/10
Abstract: A helmet for hearing protection according to an embodiment of the present invention comprises: a plurality of signal receiving microphones installed on a helmet; and a plurality of ear protectors extended from both sides of the helmet to be able to cover ears, and outputting surrounding sound signals received through at least some of the plurality of signal receiving microphones. The helmet for hearing protection according to the present invention provides the surrounding sound signals through the plurality of signal receiving microphones installed at the helmet, so that the work can be safely implemented without a hearing loss in heavy noise environments.
Abstract translation: 根据本发明实施例的用于听力保护的头盔包括：安装在头盔上的多个信号接收麦克风; 以及从头盔的两侧延伸以能够覆盖耳朵并且输出通过多个信号接收麦克风中的至少一些接收的周围声音信号的多个耳朵保护器。 根据本发明的用于听力保护的头盔通过安装在头盔上的多个信号接收麦克风来提供周围的声音信号，使得可以安全地实现工作而在恶劣环境中没有听力损失。
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公开(公告)号：KR101413159B1
公开(公告)日：2014-07-01
申请号：KR1020120154915
申请日：2012-12-27
Applicant: 전자부품연구원
Inventor： 임영민
CPC classification number: G02B26/0833 , G01D5/268 , G02B6/10 , G02B6/3504 , G02B7/1821 , G02B26/02 , H04R23/008
Abstract: The present invention relates to an optical microphone which comprises an optical transmitting unit having a core of a first diameter with a total reflection surface; an optical receiving unit having a core of a second diameter which is larger than the first diameter; and a vibration plate to reflect the light output by the core of the first diameter and transmit the light to the core of the second diameter even if the vibration plate vibrates according to the intensity of external sound. Therefore, the present invention can increase a light reception level by using the sizes of the cores of the optical transmission unit and the optical receiving unit and improve the reception performance by using the modes of the optical transmission unit and the optical receiving unit.
Abstract translation: 本发明涉及一种光学麦克风，其包括具有第一直径的芯和全反射面的光发射单元; 光接收单元，其具有大于第一直径的第二直径的芯; 以及振动板，用于反射由第一直径的芯输出的光，并且即使振动板根据外部声音的强度振动，也将光传输到第二直径的芯。 因此，本发明可以通过使用光传输单元和光接收单元的核心的尺寸来增加光接收电平，并且通过使用光传输单元和光接收单元的模式来提高接收性能。
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公开(公告)号：KR101134978B1
公开(公告)日：2012-04-10
申请号：KR1020090018376
申请日：2009-03-04
Applicant: 전자부품연구원
Inventor： 임영민
Abstract: PURPOSE: A connection structure between an LCD panel board and a main board and a portable device are provided to reduce manufacturing costs for a flexible PCB by providing a connection structure different from a convention structure. CONSTITUTION: A portable apparatus comprises a substrate(100) for an LCD panel and a main board(200). The main board is located under the substrate of the LCD panel. The substrate is slidable on the main board. The substrate comprises a first photo receiver(111). The main board comprises a first optical transmitter-receiver(211) and a main processor.
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公开(公告)号：KR101012327B1
公开(公告)日：2011-02-08
申请号：KR1020080130834
申请日：2008-12-22
Applicant: 전자부품연구원
IPC: H01L31/0232
Abstract: 본 발명은 광전변환모듈에 관한 것이다.
따라서, 본 발명의 광전변환모듈은 광도파로가 매립되어 있는 인쇄회로기판에 광전 변환기를 실장하고, 매립된 광도파로를 인쇄회로기판에 돌출시켜 고정블럭을 통하여 광전 변환기의 광소자와 광 정렬시켜 모듈화함으로써, 광결합이 용이하며, 광결합에 별도의 장치가 필요 없어 소요되는 비용을 줄일 수 있는 장점이 있다.
게다가, 본 발명의 광전변환모듈은 가이드 핀(Guide Pin)을 이용하여 고정블록을 인쇄회로기판에 삽입 및 고정시켜 모듈의 패키징함과 동시에, 광전 변환기와 고정블록의 광 도파로를 간단하게 광 정렬시킬 수 있는 장점이 있다.
광전, 변환, 블록, 인쇄회로기판, 매립, 광도파로, 핀-
公开(公告)号：KR1020100123019A
公开(公告)日：2010-11-24
申请号：KR1020090042002
申请日：2009-05-14
Applicant: 전자부품연구원
Abstract: PURPOSE: A photoelectric conversion module and a LSI package thereof are provided to drastically reduce optical loss by transferring light without a lens and a mirror between an optical device and a light guide waveguide. CONSTITUTION: A penetrated hole(115) is formed in the upper part of a PCB(110) in order to be orthogonal to a light waveguide array(111). A wall pad(114) is formed to correspond to the electrode bump(121a,121b) of an optical device array chip(120) in the side wall of the penetrated hole. The optical device array chip is inserted into the penetrated hole inside the PCB. The optical coupling between the light waveguide array and the optical device is executed by combining the electrode bump of the optical device array chip and the wall pad inside the PCB.
Abstract translation: 目的：提供一种光电转换模块及其LSI封装，通过在光学器件和导光波导之间传输没有透镜和反射镜的光来显着降低光学损耗。 构成：为了与光波导阵列（111）正交，在PCB（110）的上部形成穿透孔（115）。 形成壁焊盘（114），以对应于穿透孔的侧壁中的光学器件阵列芯片（120）的电极凸块（121a，121b）。 光学元件阵列芯片插入到PCB内的穿透孔中。 光波导阵列和光学器件之间的光耦合通过组合光器件阵列芯片的电极凸块和PCB内的壁焊来执行。
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Patent Agency Ranking
公开(公告)号：KR1020100055719A
公开(公告)日：2010-05-27
申请号：KR1020080114575
申请日：2008-11-18
Applicant: 전자부품연구원
IPC: H01L31/0232 , H01L31/02
CPC classification number: H01L31/0232 , H01L31/042 , H05K1/0274
Abstract: PURPOSE: A photoelectric conversion module is provided to reduce manufacturing costs by optically aligning a photoelectric converter and an optical waveguide with an optical alignment block without an auxiliary optical part like a lens or mirror. CONSTITUTION: A photoelectric converter(200) is mounted on the upper side of a printed circuit board. An optical device(210) which emits or receives light and a driving IC chip which drives the optical device are packaged on the photoelectric converter. An optical alignment block is fixed on the upper side of the printed circuit board. An optical waveguide(310) which is optically aligned and the optical device of the photoelectric converter are inserted into the optical wave guide.
Abstract translation: 目的：提供光电转换模块以通过光学对准光学转换器和光波导与光学对准块而不需要诸如透镜或反射镜的辅助光学部件来降低制造成本。 构成：光电转换器（200）安装在印刷电路板的上侧。 发射或接收光的光学装置（210）和驱动光学装置的驱动IC芯片被封装在光电转换器上。 光学对准块固定在印刷电路板的上侧。 将光学对准的光波导（310）和光电转换器的光学装置插入到光波导中。
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公开(公告)号：KR1020080113774A
公开(公告)日：2008-12-31
申请号：KR1020070062663
申请日：2007-06-26
Applicant: 전자부품연구원
IPC: G02B6/43
Abstract: A fabrication method for fiber array device is provided to reduce manufacturing time and cost since there is no need to polish the optical fiber array throughout. A fabrication method for fiber array device is comprised of steps: forming V-shape to mount optical fiber on the top of a substrate of which one side is cut by the angle of Œ5 -15‹ to a horizontal plane; preparing the optical fiber of which end is cut by the angle of Œ5~15‹ to the horizontal plane and mounting it in the groove; injecting the adhesive(140) into the top surface of the substrate; covering a cover(130) on the top of the optical fiber mounted on the top of substrate.
Abstract translation: 提供了一种用于光纤阵列器件的制造方法，以减少制造时间和成本，因为不需要在整个光纤阵列上进行抛光。 纤维阵列器件的制造方法包括以下步骤：形成V形以将光纤安装在其一侧被切割成与水平面成角度-15°-15°的基底的顶部上; 准备将其末端与水平面切割成角度为5〜15°的光纤，并将其安装在槽中; 将粘合剂（140）注入基材的顶表面; 覆盖安装在基板顶部上的光纤的顶部上的盖（130）。
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公开(公告)号：KR100822337B1
公开(公告)日：2008-04-15
申请号：KR1020060072155
申请日：2006-07-31
Applicant: 전자부품연구원
Abstract: 본 발명은 브래그 격자(Bragg grating)를 이용한 광센서 칩 및 그의 제조 방법에 관한 것으로, 기판과; 상기 기판 상부에 형성된 클래드층과; 상기 클래드층 내부에 개재되어 있는 코어층과; 상기 코어층으로 입사되는 광 중 특정 파장을 중심으로 일정 대역의 광을 반사시키고 나머지 광은 통과시키도록, 상기 코어층에 형성되어 있는 브래그 격자패턴으로 구성된다.
또한, 본 발명은 PLC(Planar Lightwave Circuit) 기술을 이용하여 한 웨이퍼 안에다 수십∼수백개의 광센서칩을 동시에 노광시켜 양산해 낼 수 있으므로, 소자의 저가격화를 수행할 수 있는 효과가 있다.
브래그, 격자, 반사, 센서, 칩-
公开(公告)号：KR100810665B1
公开(公告)日：2008-03-07
申请号：KR1020070031872
申请日：2007-03-30
Applicant: 전자부품연구원
Inventor： 임영민
IPC: H01L31/0232 , H01L31/12 , H01L31/09
CPC classification number: G02B6/43 , G02B6/4212 , H01L2224/73204 , H01L2924/00014 , H01L2924/01047 , H05K1/0274 , H05K1/182 , H05K1/183 , H05K2201/10727 , H01L2924/00 , H01L2224/48
Abstract: A photoelectric conversion module and its fabricating method are provided to improve optical coupling efficiency between an optical element and an optical waveguide by connecting an IC board with an optical element array and connecting the optical element array with an optical waveguide array. An IC board(110) is formed on an upper surface of a printed circuit board(100). An optical element array(120,130) is formed on a lateral surface of the IC board. An optical waveguide array(140,150) includes one side formed at the optical element array attached on the IC board. The optical waveguide array is connected optically to the optical element array. A semiconductor chip(160) is formed at an upper part of the IC board. The semiconductor chip includes a driving circuit for driving the optical element array. The optical waveguide array is buried into the printed circuit board. A mounting groove is formed in the printed circuit board. The IC board is mounted in the mounting groove of the printed circuit board.
Abstract translation: 提供光电转换模块及其制造方法，通过将IC板与光学元件阵列连接并将光学元件阵列与光波导阵列连接来提高光学元件和光波导之间的光耦合效率。 IC板（110）形成在印刷电路板（100）的上表面上。 光学元件阵列（120,130）形成在IC板的侧面上。 光波导阵列（140,150）包括形成在安装在IC板上的光学元件阵列的一侧。 光波导阵列光学连接到光学元件阵列。 半导体芯片（160）形成在IC板的上部。 半导体芯片包括用于驱动光学元件阵列的驱动电路。 光波导阵列埋入印刷电路板中。 在印刷电路板中形成安装槽。 IC板安装在印刷电路板的安装槽中。
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公开(公告)号：KR1020080011765A
公开(公告)日：2008-02-11
申请号：KR1020060072155
申请日：2006-07-31
Applicant: 전자부품연구원
Abstract: An optical sensor chip using Bragg grating and a method for manufacturing the same are provided to expose the numerous optical sensor chips in one wafer at the same time by using a PLC(Planar Lightwave Circuit) technology. An optical sensor chip using Bragg grating includes a substrate, a clad layer(200), a core layer(250), and a Bragg grating pattern(251). The clad layer is formed on the substrate. The core layer is incorporated in the clad layer. The Bragg grating pattern is formed in the core layer so as to reflect one light beam having a predetermined band and transmit other light beams among light beams incident in the core layer. The substrate is a silicon substrate. The clad layer is a high-density silica film. The core layer is a germanium oxide film. The core layer is divided into plural core layer areas. The Bragg grating pattern is formed in each of the core layer areas. Optical fibers are optically arranged at one side of the core layer.
Abstract translation: 提供了使用布拉格光栅的光学传感器芯片及其制造方法，以通过使用PLC（平面光波电路）技术同时在一个晶片中露出多个光学传感器芯片。 使用布拉格光栅的光学传感器芯片包括衬底，包覆层（200），芯层（250）和布拉格光栅图案（251）。 覆层在基板上形成。 芯层结合在包覆层中。 在芯层中形成布拉格光栅图案，以便反射具有预定带的一个光束并在入射到芯层中的光束之间传输其他光束。 衬底是硅衬底。 包覆层是高密度二氧化硅膜。 核心层是氧化锗膜。 芯层分为多个芯层区域。 在每个核心层区域中形成布拉格光栅图案。 光纤布置在核心层的一侧。
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