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公开(公告)号：KR100822337B1
公开(公告)日：2008-04-15
申请号：KR1020060072155
申请日：2006-07-31
Applicant: 전자부품연구원
Abstract: 본 발명은 브래그 격자(Bragg grating)를 이용한 광센서 칩 및 그의 제조 방법에 관한 것으로, 기판과; 상기 기판 상부에 형성된 클래드층과; 상기 클래드층 내부에 개재되어 있는 코어층과; 상기 코어층으로 입사되는 광 중 특정 파장을 중심으로 일정 대역의 광을 반사시키고 나머지 광은 통과시키도록, 상기 코어층에 형성되어 있는 브래그 격자패턴으로 구성된다.
또한, 본 발명은 PLC(Planar Lightwave Circuit) 기술을 이용하여 한 웨이퍼 안에다 수십∼수백개의 광센서칩을 동시에 노광시켜 양산해 낼 수 있으므로, 소자의 저가격화를 수행할 수 있는 효과가 있다.
브래그, 격자, 반사, 센서, 칩-
公开(公告)号：KR1020080011765A
公开(公告)日：2008-02-11
申请号：KR1020060072155
申请日：2006-07-31
Applicant: 전자부품연구원
Abstract: An optical sensor chip using Bragg grating and a method for manufacturing the same are provided to expose the numerous optical sensor chips in one wafer at the same time by using a PLC(Planar Lightwave Circuit) technology. An optical sensor chip using Bragg grating includes a substrate, a clad layer(200), a core layer(250), and a Bragg grating pattern(251). The clad layer is formed on the substrate. The core layer is incorporated in the clad layer. The Bragg grating pattern is formed in the core layer so as to reflect one light beam having a predetermined band and transmit other light beams among light beams incident in the core layer. The substrate is a silicon substrate. The clad layer is a high-density silica film. The core layer is a germanium oxide film. The core layer is divided into plural core layer areas. The Bragg grating pattern is formed in each of the core layer areas. Optical fibers are optically arranged at one side of the core layer.
Abstract translation: 提供了使用布拉格光栅的光学传感器芯片及其制造方法，以通过使用PLC（平面光波电路）技术同时在一个晶片中露出多个光学传感器芯片。 使用布拉格光栅的光学传感器芯片包括衬底，包覆层（200），芯层（250）和布拉格光栅图案（251）。 覆层在基板上形成。 芯层结合在包覆层中。 在芯层中形成布拉格光栅图案，以便反射具有预定带的一个光束并在入射到芯层中的光束之间传输其他光束。 衬底是硅衬底。 包覆层是高密度二氧化硅膜。 核心层是氧化锗膜。 芯层分为多个芯层区域。 在每个核心层区域中形成布拉格光栅图案。 光纤布置在核心层的一侧。
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公开(公告)号：KR100776974B1
公开(公告)日：2007-11-21
申请号：KR1020060070260
申请日：2006-07-26
Applicant: 전자부품연구원
CPC classification number: H04L27/36 , H04L1/0071 , H04L27/20
Abstract: A modulator is provided to increase a data transfer rate per unit bandwidth while maintaining a final modulated signal in a constant amplitude, by interleaving an output of constant-amplitude orthogonal modulation. A CACB(Constant Amplitude Coded Bi-orthogonal) modulating part(400) receives user data to perform constant amplitude coded bi-orthogonal modulation. An interleaving part(500) combines the outputs of the CACB modulator to make the outputs odd redundancy. A Q^2PSK(Quadrature-Quadrature Amplitude Phase Shift Keying) modulating part(600) modulates the output of the interleaving part with bi-orthogonal phase shift.
Abstract translation: 提供调制器以通过交织恒定幅度正交调制的输出来增加每单位带宽的数据传输速率，同时保持恒定幅度的最终调制信号。 CACB（恒定幅度编码双正交）调制部分（400）接收用户数据以执行恒定幅度编码的双正交调制。 交织部分（500）组合CACB调制器的输出以使输出奇数冗余。 Q ^ 2PSK（正交 - 正交幅度相移键控）调制部分（600）利用双正交相移调制交错部分的输出。
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公开(公告)号：KR100566015B1
公开(公告)日：2006-03-30
申请号：KR1020030092846
申请日：2003-12-18
Applicant: 전자부품연구원
IPC: G02B6/26
Abstract: 본 발명은 광통신용 광학 부품 패키징 방법에 관한 것으로, 광학부품을 패키징시 솔더링 영역을 국부적인 고주파 가열 또는 적외선 파장대의 광을 조사하여 솔더링함으로써, 패키징을 자동화할 수 있고, 가격 경쟁력 및 품질의 균일성을 얻을 수 있으며, 솔더링 영역을 제외한 영역에 대한 열변형을 최소화할 수 있으므로 고신뢰성을 갖는 부품을 패키징할 수 있는 효과가 있다.
더불어, UBM층을 형성한 후 솔더링함으로써, 열팽창계수에 따른 열변형을 최소화할 수 있어, 정렬위치의 틀어짐에 따른 광손실을 줄일 수 있는 효과가 있다.
광학, 부품, 패키징, UBM층, 솔더, 고주파, 적외선-
公开(公告)号：KR1020050061053A
公开(公告)日：2005-06-22
申请号：KR1020030092846
申请日：2003-12-18
Applicant: 전자부품연구원
IPC: G02B6/26
Abstract: 본 발명은 광통신용 광학 부품 패키징 방법에 관한 것으로, 광학부품을 패키징시 솔더링 영역을 국부적인 고주파 가열 또는 적외선 파장대의 광을 조사하여 솔더링함으로써, 패키징을 자동화할 수 있고, 가격 경쟁력 및 품질의 균일성을 얻을 수 있으며, 솔더링 영역을 제외한 영역에 대한 열변형을 최소화할 수 있으므로 고신뢰성을 갖는 부품을 패키징할 수 있는 효과가 있다.
더불어, UBM층을 형성한 후 솔더링함으로써, 열팽창계수에 따른 열변형을 최소화할 수 있어, 정렬위치의 틀어짐에 따른 광손실을 줄일 수 있는 효과가 있다.-
Patent Agency Ranking6.发明公开
公开(公告)号：KR1020040095843A
公开(公告)日：2004-11-16
申请号：KR1020030026835
申请日：2003-04-28
Applicant: 전자부품연구원
IPC: H04L27/34
Abstract: PURPOSE: A constant amplitude binary orthogonal modulator/demodulator is provided to reduce the power consumption of a communication system by performing a constant amplitude binary orthogonal modulation process for transmission data. CONSTITUTION: A serial/parallel converter(200) is used for converting serial data to a data bit, a group of data bits, and a plurality of groups of data bits according to a data rate control signal. A constant amplitude encoder(210) is used for generating parity bits of each group by combining the plural groups of data bits. An orthogonal code generator(220) is used for generating different groups of orthogonal codes. A plurality of binary orthogonal modulators(230,240,250,260) are used for selecting one orthogonal code from each group and performing a binary orthogonal modulation process. A parallel adder(270) is used for adding output signals of the plural binary orthogonal modulators in parallel.
Abstract translation: 目的：提供恒定幅度二进制正交调制器/解调器，通过对传输数据执行恒定幅度二进制正交调制处理，以减少通信系统的功耗。 构成：串行/并行转换器（200）用于根据数据速率控制信号将串行数据转换为数据位，一组数据位和多组数据位。 常数幅度编码器（210）用于通过组合多组数据位来产生每组的奇偶校验位。 正交码发生器（220）用于产生不同的正交码组。 多个二进制正交调制器（230,240,250,260）用于从每个组中选择一个正交码并执行二进制正交调制过程。 并行加法器（270）用于并行地添加多个二进制正交调制器的输出信号。
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公开(公告)号：KR1020040067707A
公开(公告)日：2004-07-30
申请号：KR1020030004940
申请日：2003-01-24
Applicant: 전자부품연구원
IPC: H04J13/12
CPC classification number: H04J13/004 , H04J13/0077 , H04L1/0041 , H04L1/0061
Abstract: PURPOSE: An envelope binary orthogonal modulation and demodulation system is provided to execute envelope binary orthogonal modulation for data so as to transmit the data at a mass data rate and a variable data rate. CONSTITUTION: An envelope binary orthogonal modulator consists of a serial/parallel converter(200), an envelope encoder(210), an orthogonal code generator(220), a plurality of binary orthogonal modulation parts(230,240,250,260), and a parallel combiner(270). The serial/parallel converter(200) converts in-phase or orthogonal phase serial data, separated from a signal splitter, into a data bit(b1), a group of data bits(b0-b2), or many groups of data bits((b0-b2),(b3-b5)(b6-b8)) according to a data rate control signal. The envelope encoder(210) combines many groups of data bits((b0-b2),(b3-b5)(b6-b8)) converted at the serial/parallel converter(200) respectively and generates a plurality of parity bits(r0,r1,r2). The orthogonal code generator(220) generates many groups of orthogonal codes((c0-c3)(c4-c7)(c8-c11)(c12-c15)). The binary orthogonal modulation parts(230,240,250,260) select their respective orthogonal codes among the orthogonal codes((c0-c3)(c4-c7)(c8-c11)(c12-c15)) according to many groups of data bits((b0-b2),(b3-b5)(b6-b8)) and the parity bits(r0,r1,r2) and adjust the codes. The parallel combiner(270) sums up the orthogonal codes, outputted from the binary orthogonal modulation parts(230,240,250,260), in parallel and generates envelope binary orthogonal modulation data.
Abstract translation: 目的：提供包络二进制正交调制和解调系统，对数据执行包络二进制正交调制，以便以大量数据速率和可变数据速率传输数据。 构成：包络二进制正交调制器由串并行转换器（200），包络编码器（210），正交码发生器（220），多个二进制正交调制部分（230,240,250,260）和并行组合器（270）组成 ）。 串行/并行转换器（200）将从信号分离器分离的同相或正交相位串行数据转换为数据位（b1），一组数据位（b0-b2）或许多数据位组 （b0-b2），（b3-b5）（b6-b8））。 包络编码器（210）分别组合在串行/并行转换器（200）处转换的许多数据位组（（b0-b2），（b3-b5）（b6-b8）），并产生多个奇偶校验位（r0 ，R1，R2）。 正交码产生器（220）产生许多正交码组（（c0-c3）（c4-c7）（c8-c11）（c12-c15））。 二进制正交调制部分（230,240,250,260）根据多组数据位（（b0-c3）（c4-c7）（c8-c11）（c12-c15））选择它们各自的正交码 b2），（b3-b5）（b6-b8））和奇偶校验位（r0，r1，r2）并调整代码。 并行组合器（270）并行地对从二进制正交调制部（230,240,250,260）输出的正交码求和，生成包络二进制正交调制数据。
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公开(公告)号：KR1020040022909A
公开(公告)日：2004-03-18
申请号：KR1020020054499
申请日：2002-09-10
Applicant: 전자부품연구원
IPC: G02B6/42
Abstract: PURPOSE: An optical communication element package and a method for manufacturing the same are provided to minimize the loss change due to the thermal deformation in response to the asymmetric structure and the loss change in response to the temperature characteristics evaluation during the welding. CONSTITUTION: An optical communication element package includes a pair of collimators(201,202), an external housing(204), a filter(209), an epoxy and a spherical filter holder(206). The spherical filter holder(206) aligns the filter(209) with the pair of collimators(201,202). And, the external housing(204) supports and aligns the spherical filter holder(206).
Abstract translation: 目的：提供一种光通信元件封装及其制造方法，以使由不对称结构引起的热变形引起的损耗变化最小化，并且响应于焊接期间的温度特性评估而导致的损耗变化。 构成：光通信元件封装包括一对准直器（201,202），外壳（204），过滤器（209），环氧树脂和球形过滤器保持器（206）。 球形过滤器保持器（206）使过滤器（209）与一对准直器（201,202）对准。 并且，外壳（204）支撑并对准球形过滤器支架（206）。
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公开(公告)号：KR100310138B1
公开(公告)日：2001-12-28
申请号：KR1019980019014
申请日：1998-05-26
Applicant: 전자부품연구원
IPC: G02B6/293
Abstract: PURPOSE: An apparatus for separating and uniting optical signals is provided to increase an isolation and reduce an insertion loss of optical signals by improving transmissivity and reflexibility an apparatus for separating and uniting bidirectional optical signals. CONSTITUTION: The first lens(21) is connected with the first optical fiber(11). A dual non-reflective film(211) is coated on the first face of the first lens(21). The second lens(22) is connected with the first lens(21) in a line. A wavelength separating filter(31) is inserted between the first lens(21) and the second lens(22). The first optical fiber grating(61) is connected with the second lens(22). The second optical fiber(12) is connected with the first optical fiber(61). A signal non-reflective film is coated on the first face of the second lens(22). The first and the second lens(21,22) are used for converting incident rays from the first to the third optical fibers(11-13) to parallel light or focusing incident rays from the wavelength separating filter(31).
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公开(公告)号：KR100266038B1
公开(公告)日：2000-09-15
申请号：KR1019970068055
申请日：1997-12-12
Applicant: 전자부품연구원
IPC: G02B5/20
Abstract: PURPOSE: A signal processing filter for an optical communication and a method for manufacturing the same are provided to constantly maintain a wavelength transmission property and a reflection property of a signal interference thin film filter allowing to add and divide wavelength signals. CONSTITUTION: In a signal processing filter, a signal interference device is consisted of a plurality of titanium dioxide layers and a plurality of silicon dioxide layers. The titanium dioxide layers are consisted of 15 layers and the silicon dioxide layers are consisted of 14 layers totally. The titanium dioxide layers being 7-th layer and 9-th layer from a substrate have 1/2 thicknesses of those of the different layers. The silicon dioxide layer being 8-th layer from the substrate has 1/1.05 thickness of those of the different layers.
Abstract translation: 目的：提供一种用于光通信的信号处理滤波器及其制造方法，以恒定地保持波长信号的波长传播特性和信号干涉薄膜滤波器的反射特性。 构成：在信号处理滤波器中，信号干扰装置由多个二氧化钛层和多个二氧化硅层构成。 二氧化钛层由15层构成，二氧化硅层共14层。 来自基板的第七层和第九层的二氧化钛层具有不同层的1/2厚度。 来自基板的第8层的二氧化硅层的厚度为不同层的1/105厚度。
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