公开(公告)号：KR1020060112521A

公开(公告)日：2006-11-01

申请号：KR1020050035064

申请日：2005-04-27

Applicant: 한국과학기술원

Inventor： 백경욱 ,  권운성 ,  김형준 ,  정창규

IPC: G02F1/1345

CPC classification number: G02F1/13452 ,  G02F2201/12 ,  H01L24/13 ,  H01L2224/10

Abstract: Design of a liquid crystal driver circuit connection bump structure having a stable contact resistance between a connection bump and a substrate conductive layer pattern and COG (Chip on glass) and COF (Chip on flex) interconnection method using anisotropic conductive adhesive are provided to prevent mounting failure of a liquid crystal driver chip and maintain strong connection for a long time by generating uniform deformation of conductive particles between a connection bump and a substrate conductive layer throughout an entire area of a driver chip when mounting the driver chip on a substrate. Input terminals and output terminals are formed such that respective entire areas of the input terminals and the output terminals formed in a connection bump(102) are equal to each other. The bump sizes of the input terminals and the output terminals formed at the connection bump are different. The output terminal has a staggered bump layout in order to prevent short-circuit between the bumps due to an extremely fine interval.

Abstract translation: 提供了使用各向异性导电粘合剂在连接凸块和基板导电层图案和COG（玻璃上的芯片）和COF（Chip on flex）互连方法之间具有稳定接触电阻的液晶驱动器电路连接凸块结构的设计，以防止安装 液晶驱动器芯片的故障并且通过在将驱动器芯片安装在基板上时在驱动器芯片的整个区域中在连接凸块和基板导电层之间产生导电颗粒的均匀变形而长时间保持强连接。 输入端子和输出端子形成为使得形成在连接凸块（102）中的输入端子和输出端子的相应的整个区域彼此相等。 形成在连接凸块处的输入端子和输出端子的凸块尺寸不同。 输出端子具有交错的凸起布局，以防止由于极细间隔而引起的凸块之间的短路。