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公开(公告)号：KR100746334B1
公开(公告)日：2007-08-03
申请号：KR1020050079620
申请日：2005-08-29
Applicant: 한국과학기술원
IPC: H01L21/60
CPC classification number: H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00
Abstract: 본 발명은 에폭시기가 3개 이상인 다관능성 에폭시 수지를 구성하는 상기 에폭시기와 경화제의 반응을 통해 형성된 3차원 망목구조를 가지는 물성개선층을 포함하는 플립칩 접속용 필름 및 이의 제조방법을 제공한다. 이에 의하면 전기적 접속을 저하함이 없이 기존 대비 열-기계적 물성의 개선이 가능하다.
플립칩, NCF, ACF, 다관능성 에폭시-
2.发明公开접속 범프와 기판도전막 패턴 간의 안정적인 접촉저항을갖는 액정구동회로 칩 접속 범프 구조 설계 및 이방성 전도접착제를 사용한 칩온글라스/칩온플렉스 접속 방법 无效显示驱动IC的设计及其使用静电导电粘合剂的稳定接触电阻COG（玻璃上的芯片）和COF（FLEX）的互连的互连方法
公开(公告)号：KR1020060112521A
公开(公告)日：2006-11-01
申请号：KR1020050035064
申请日：2005-04-27
Applicant: 한국과학기술원
IPC: G02F1/1345
CPC classification number: G02F1/13452 , G02F2201/12 , H01L24/13 , H01L2224/10
Abstract: Design of a liquid crystal driver circuit connection bump structure having a stable contact resistance between a connection bump and a substrate conductive layer pattern and COG (Chip on glass) and COF (Chip on flex) interconnection method using anisotropic conductive adhesive are provided to prevent mounting failure of a liquid crystal driver chip and maintain strong connection for a long time by generating uniform deformation of conductive particles between a connection bump and a substrate conductive layer throughout an entire area of a driver chip when mounting the driver chip on a substrate. Input terminals and output terminals are formed such that respective entire areas of the input terminals and the output terminals formed in a connection bump(102) are equal to each other. The bump sizes of the input terminals and the output terminals formed at the connection bump are different. The output terminal has a staggered bump layout in order to prevent short-circuit between the bumps due to an extremely fine interval.
Abstract translation: 提供了使用各向异性导电粘合剂在连接凸块和基板导电层图案和COG（玻璃上的芯片）和COF（Chip on flex）互连方法之间具有稳定接触电阻的液晶驱动器电路连接凸块结构的设计，以防止安装 液晶驱动器芯片的故障并且通过在将驱动器芯片安装在基板上时在驱动器芯片的整个区域中在连接凸块和基板导电层之间产生导电颗粒的均匀变形而长时间保持强连接。 输入端子和输出端子形成为使得形成在连接凸块（102）中的输入端子和输出端子的相应的整个区域彼此相等。 形成在连接凸块处的输入端子和输出端子的凸块尺寸不同。 输出端子具有交错的凸起布局，以防止由于极细间隔而引起的凸块之间的短路。
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Patent Agency Ranking
公开(公告)号：KR100484449B1
公开(公告)日：2005-04-22
申请号：KR1020020009920
申请日：2002-02-25
Applicant: 한국과학기술원
IPC: C09J9/02
Abstract: 본 발명은 고출력 모듈 접속용 이방성 전도성 접착제 조성물에 관한 것으로,저 전기 저항 도전입자와, 높은 열전도도와 낮은 열팽창계수를 갖는 비도전 입자가 절연수지에 균일하게 첨가됨을 특징으로 하는 고출력 모듈 접속용 접착제 조성물을 개시한다. 상기 구성에 의한 접착제 조성물은 접속저항이 낮고 열전도도가 높으므로 기존의 이방성 전도접착제에 비해 전기적/기계적으로 우수하며 고 임계 전류밀도용 파워모듈의 접속시 매우 우수한 특성을 얻을 수 있다.
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公开(公告)号：KR1020030070394A
公开(公告)日：2003-08-30
申请号：KR1020020009920
申请日：2002-02-25
Applicant: 한국과학기술원
IPC: C09J9/02
Abstract: PURPOSE: An anisotropic conductive adhesive composition for joining a high powder module, and an anisotropic conductive film for joining a flip chip and an anisotropic conductive paste using the adhesive composition are provided, wherein the composition has a low electrical resistance, a high critical current density and excellent mechanical properties. CONSTITUTION: The adhesive composition comprises a low electrical resistance conductive particle and a non-conductive particle having a high thermal conductivity and a low coefficient of thermal expansion uniformly dispersed in an insulating resin. Preferably the conductive particle has a resistivity of 0.1-2 μ·Ohm·cm and is at least one selected from copper or a metal-coated copper; and the non-conductive particle has a thermal conductivity of 150-400 W/m·deg.C and a coefficient of thermal expansion of 2-10 ppm/deg.C, and is at least one selected from the group consisting of SiC, AlN and Al2O3.
Abstract translation: 目的：提供一种用于接合高粉末组件的各向异性导电粘合剂组合物和用于使用粘合剂组合物接合倒装芯片和各向异性导电浆料的各向异性导电膜，其中该组合物具有低电阻，高临界电流密度 和优良的机械性能。 构成：粘合剂组合物包括均匀分散在绝缘树脂中的低电阻导电颗粒和具有高热导率和低热膨胀系数的非导电颗粒。 优选地，导电粒子具有0.1-2μΩ·cm的电阻率，并且是选自铜或金属涂覆的铜中的至少一种; 非导电性粒子的导热系数为150〜400W / m·℃，热膨胀系数为2-10ppm /℃，为SiC， AlN和Al2O3。
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公开(公告)号：KR1020020066514A
公开(公告)日：2002-08-19
申请号：KR1020010006745
申请日：2001-02-12
Applicant: 한국과학기술원
CPC classification number: H01L24/83 , C08L63/00 , C09J7/10 , C09J9/02 , C09J2201/602 , C09J2463/00 , H01L24/28 , H01L2224/2919 , H01L2224/29499 , H01L2224/73204 , H01L2224/8319 , H01L2224/838 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/07811 , H05K3/323 , H05K2201/0209 , H05K2201/0212 , H05K2201/0239 , H05K2201/10674 , H05K2203/0783 , H01L2924/00
Abstract: PURPOSE: A fabrication method of a conductive adhesive is provided to improve dielectric properties of the conductive adhesive by mixing non-conductive grains having a low dielectric constant in an ACA(Anisotropic Conductive Adhesive), and to improve an RF(Radio Frequency) property by reducing electromagnetic coupling. CONSTITUTION: A thermal hardening resin is formed by using resin mixture consisting of bis-phenol A-type epoxy region of solid-phase of 15-25 wt%, bis-phenol F-type epoxy region of liquid-phase of 40-50 wt%, and phenoxy region of solid-phase of 30-40 wt%(S100). A surface treatment is performed so as to prevent a cohesive reaction of conductive and non-conductive particles(S110). The conductive and non-conductive particles are mixed with the thermal hardening resin(S120). A dispersion agent is mixed into the resultant material for preventing the cohesive reaction(S130). A hardening agent of imidazole groups is mixed to the mixture(S140). Then, a vacuum adsorption processing is performed so as to remove particles(S150). Finally, a film-type conductive adhesive is made by doctor blade(S160).
Abstract translation: 目的：提供一种导电粘合剂的制造方法，以通过在ACA（各向异性导电粘合剂）中混合具有低介电常数的不导电颗粒来改善导电粘合剂的介电性能，并通过以下方式提高RF（射频）性能 减少电磁耦合。 构成：通过使用由15-25重量％的固相的双酚A型环氧化合物组成的树脂混合物形成热硬化树脂，液相的双酚F型环氧化物区域为40〜50重量％ ％，固相苯氧基30-40重量％（S100）。 进行表面处理以防止导电性和非导电性粒子的内聚反应（S110）。 导电和非导电颗粒与热硬化树脂混合（S120）。 将分散剂混合到所得材料中以防止内聚反应（S130）。 将咪唑基的硬化剂混合到混合物中（S140）。 然后，进行真空吸附处理以去除颗粒（S150）。 最后，用刮刀制作薄膜型导电粘合剂（S160）。
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公开(公告)号：KR1020070027800A
公开(公告)日：2007-03-12
申请号：KR1020050079620
申请日：2005-08-29
Applicant: 한국과학기술원
IPC: H01L21/60
CPC classification number: H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00
Abstract: A flip chip connecting film is provided to enhance thermal and mechanical characteristics without the degradation of an electrical connection by using a physical property improving layer. A flip chip connecting film includes a physical property improving layer. The physical property improving layer is formed like a three-dimensional network structure. The three-dimensional network structure is obtained by reacting a multi-functional epoxy resin on a hardening agent. The multi-functional epoxy resin contains at least three epoxy radicals. The flip chip connecting film further includes conductive grains.
Abstract translation: 提供了一种倒装芯片连接膜，以通过使用物理性能改进层来增强热和机械特性，而不会降低电连接。 倒装芯片连接膜包括物理性能改进层。 物理性质改善层形成为三维网状结构。 通过使多功能环氧树脂在硬化剂上反应来获得三维网状结构。 多官能环氧树脂含有至少三个环氧基。 倒装芯片连接膜还包括导电颗粒。
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公开(公告)号：KR100398315B1
公开(公告)日：2003-09-19
申请号：KR1020010006745
申请日：2001-02-12
Applicant: 한국과학기술원
CPC classification number: H01L24/83 , C08L63/00 , C09J7/10 , C09J9/02 , C09J2201/602 , C09J2463/00 , H01L24/28 , H01L2224/2919 , H01L2224/29499 , H01L2224/73204 , H01L2224/8319 , H01L2224/838 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/07811 , H05K3/323 , H05K2201/0209 , H05K2201/0212 , H05K2201/0239 , H05K2201/10674 , H05K2203/0783 , H01L2924/00
Abstract: Disclosed is a method for manufacturing a low dielectric constant conductive adhesive that is appropriate for a radio frequency packaging application. This method is characterized by mixing a thermosetting resin with surface-treated conductive particles and non-conductive particles for prevention of agglutination and thereby forming the conductive adhesive. The manufactured conductive adhesive is useful for a bonding material of the radio frequency packaging. According to the present invention, it is possible to obtain a flip chip bonding having superior mechanical and electrical performance compared with the conventional flip chip bonding art. Also, since the adhesive has a low high frequency loss and a low dielectric constant, it is possible to realize a flip chip package having a superior electrical performance. The conductive adhesive is particularly useful for the flip chip packaging of a device having a bandwidth of microwave and millimeter wave.
Abstract translation: 公开了一种适用于射频封装应用的低介电常数导电粘合剂的制造方法。 该方法的特征在于将热固性树脂与经表面处理的导电颗粒和非导电颗粒混合以防止凝集并由此形成导电粘合剂。 所制造的导电粘合剂可用于射频封装的粘合材料。 根据本发明，与传统的倒装芯片键合技术相比，可以获得具有优异的机械和电气性能的倒装芯片键合。 而且，由于粘合剂具有低的高频损耗和低的介电常数，所以可以实现具有优异电性能的倒装芯片封装。 导电粘合剂对于具有微波和毫米波带宽的装置的倒装芯片封装特别有用。
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