Abstract:
PURPOSE: A method for forming a trench guard ring of a silicon photomultiplier and the silicon photomultiplier are provided to prevent a dark count phenomenon by suppressing the current leakage between avalanche photodiodes. CONSTITUTION: A P-type epitaxial layer(120) is formed on a silicon substrate(110). A respective P-type conductive layer(130) is formed on the P-type epitaxial layer. An oxide film is formed on the P-type epitaxial layer. A silicon nitride film is formed on the oxide film. A photoresist is spread on the silicon nitride film.
Abstract:
PURPOSE: A silicon photomultiplier with a backward light-receiving structure, a manufacturing method thereof, and a radiation detector using the same are provided to enhance the light detection efficiency of a gamma-ray detector by increasing a fill factor by broadening an active area which reacts to incident visible light. CONSTITUTION: A third insulation layer(183) is formed at the upper part of a second insulation layer(182). An MIM(Metal-Insulator-Metal) capacitor(300) is formed in the third insulation layer. A second line electrode pattern(420) is formed at the upper part of the third insulation layer. The second line electrode pattern interlinks a quenching resistance(200) and the MIM capacitor which are formed in the upper part of a first insulation layer(181). The MIM capacitor absorbs a surplus voltage when avalanche breakdown occurs.
Abstract:
PURPOSE: A silicon photomultiplier with improved photo-detecting efficiency and gamma radiation detector comprising the same are provided to minimize light on a dead region of a visible light generated from a scintillator by multi layer polysilicon resistance. CONSTITUTION: In a device, a metal line(310) is formed in each micro cell(320). A polysilicon resistor(340) for quenching is connected to the metal line. A p+ conductive type is formed in the lowermost layer of the semiconductor substrate. The epitaxial layer of the p- conductive type is formed on the semiconductor substrate of the p+ conductive type. A p-region of the conductive type is doped in the epitaxial layer. The n+ domain of the conductive type is formed on the p region of the conductive type. An insulating layer is formed on the n+ domain of the conductive type and epitaxial layer.