Abstract:
PURPOSE: A method for forming and controlling a thin film of a semiconductor device is provided to predict and control a deposition rate of a thin film, a density and a physical characteristic like an index of refraction, a dielectric constant and electrical resistance by forming the thin film while an ALD(atomic layer deposition) method and a PEALD(plasma enhanced atomic layer deposition) method are alternatively performed in which a repetitive performance rate is controlled. CONSTITUTION: An ALD method is performed on the upper surface of the substrate for only one cycle so as to form a thin film of a basic unit thickness. A PEALD method is performed on the upper surface of the substrate for only one cycle to form a thin film of a basic unit thickness. The ALD method and the PEALD method are alternatively and repeatedly performed to form a thin film of a desired thickness.
Abstract:
PURPOSE: A method for forming a silicon film, a germanium film, and a silicon-germanium film using an atomic layer epitaxy method are provided to form a thin film under a low temperature by using an organic gas as a source gas. CONSTITUTION: SiR4 is injected into a process chamber during a predetermined time(30). The first purge process is performed by injecting a purging gas into the process chamber(31). GeH4 is injected into the process chamber during the predetermined time(32). The second purge process is performed by injecting the purging gas into the process chamber(33). The injection of hydrogen radicals or hydrogen ions is determined according to a composition ratio of silicon-germanium(34). The hydrogen radicals or hydrogen ions are injected into the process chamber(35). The third purge process is performed(36). The thickness of the silicon-germanium is checked(37).
Abstract:
PURPOSE: A method for forming a silicon germanium layer using different kinds of sources according to a composition ratio of germanium is provided to improve a characteristic of the silicon germanium layer by changing easily the composition ratio of the germanium of silicon germanium layer. CONSTITUTION: A forming method of a silicon germanium layer includes a process for forming an Si1-xGex layer on a substrate within a process chamber having temperature of 150 to 400 degrees centigrade by using a unit atomic layer epitaxy method. In the forming process of the Si1-xGex layer, a silicon source is supplied to an upper surface of the substrate. The first purge gas is supplied to the upper surface of the substrate. A germanium source is supplied to the upper surface of the substrate. The second purge gas is supplied to the upper surface of the substrate. A hydrogen radical is supplied to the upper surface of the substrate. The different kinds of sources are supplied according to a value of x of the Si1-xGex layer.
Abstract:
본 발명은 공정 가스 모니터링 장치 및 그를 구비한 플라즈마 공정 설비를 개시한다. 그의 장치는, 가스 유입구, 가스 배출구, 및 윈도우들을 갖는 하우징과, 상기 윈도우들 중 어느 하나에 인접하여 상기 하우징 외부에 배치되고, 상기 가스 유입구 및 상기 가스 배출구 사이에 제공되는 가스에 소스 광을 제공하는 광원과,상기 윈도우들 중 나머지 하나에 인접하여 상기 하우징 외부에 배치되고, 상기 소스 광에 의해 상기 가스로부터 발광되는 형광을 감지하는 센서와, 상기 가스 유입구 및 상기 가스 배출구 사이의 상기 하우징 내에 배치되고, 상기 광원 및 상기 센서 사이의 상기 가스를 가열하여 상기 가스로부터의 상기 형광을 증가시키는 코일을 포함한다..