LOW SURFACE ENERGY ADHESIVE
    21.
    发明申请
    LOW SURFACE ENERGY ADHESIVE 有权
    低表面能量粘合剂

    公开(公告)号:US20160108295A1

    公开(公告)日:2016-04-21

    申请号:US14979713

    申请日:2015-12-28

    Abstract: Adhesives suitable for use with low surface energy materials are described. The adhesive contain an acrylic copolymer, a high glass transition temperature tackifier and a low glass transition temperature tackifier. The acrylic copolymer is the reaction product of a first alkyl(meth)acrylate having at least 5 carbon atoms in the alkyl group, a second alkyl(meth)acrylate having 1 to 4 carbon atoms in the alkyl group, and a vinyl carboxylic acid. Both tackifiers have a Tg greater than the Tg of the acrylic copolymer. The high glass transition temperature tackifier has a Tg of at least 20° C. and the low glass transition temperature tackifier has a Tg of less than 0° C.

    Abstract translation: 描述适用于低表面能材料的粘合剂。 粘合剂含有丙烯酸共聚物,高玻璃化转变温度增粘剂和低玻璃化转变温度增粘剂。 丙烯酸共聚物是烷基中具有至少5个碳原子的(甲基)丙烯酸烷基酯的第一烷基酯,烷基中的具有1至4个碳原子的第(甲基)丙烯酸烷基酯和乙烯基羧酸的反应产物。 两种增粘剂的Tg都大于丙烯酸共聚物的Tg。 高玻璃化转变温度增粘剂的Tg至少为20℃,低玻璃化转变温度增粘剂的Tg小于0℃。

    PRESSURE-SENSITIVE ADHESIVE COMPOSITIONS FOR ELECTRONIC BONDING APPLICATIONS

    公开(公告)号:US20210102094A1

    公开(公告)日:2021-04-08

    申请号:US15733468

    申请日:2019-02-08

    Abstract: The present disclosure relates to a curable pressure sensitive adhesive composition comprising: a) a butyl rubber component in an amount greater than 40 wt %; b) a tackifier in an amount greater than 1 wt %; c) a multifunctional crosslinking agent comprising at least two nitroso functional groups; and d) optionally, a hydrocarbon plasticizer; wherein the weight percentages are based on the total weight of the curable pressure sensitive adhesive composition. In another aspect, the present disclosure is directed to a method for protecting an electronic device or an electronic component from moisture and air permeation, wherein the method comprises the step of using a pressure sensitive adhesive composition as described above. According to still another aspect, the present disclosure is directed to the use of a pressure sensitive adhesive composition as described above for manufacturing an electronic device.

Patent Agency Ranking