公开(公告)号：WO2018134286A1

公开(公告)日：2018-07-26

申请号：PCT/EP2018/051162

申请日：2018-01-18

Applicant: ASML NETHERLANDS B.V. ,  HERMES MICROVISION, INC.

Inventor： FANG, Wei ,  ZHANG, Haili ,  CHEN, Zhichao ,  JIN, Shengcheng

IPC: G03F7/20 ,  G05B19/418 ,  G06T7/00 ,  G01N21/956

Abstract: A defect pattern grouping method is disclosed. The defect pattern grouping method comprises obtaining a first polygon that represents a first defect from an image of a sample, comparing the first polygon with a set of one or more representative polygons of a defect-pattern collection, and grouping the first polygon with any one or more representative polygons identified based on the comparison.

公开(公告)号：WO2018134158A1

公开(公告)日：2018-07-26

申请号：PCT/EP2018/050903

申请日：2018-01-15

Applicant: ASML NETHERLANDS B.V. ,  HERMES MICROVISION, INC.

Inventor： FANG, Wei ,  TEH, Cho ,  JIAN, Robeter ,  WANG, Yi-Ying ,  CHEN, Shih-Tsung ,  LIAO, Jian-Min ,  LI, Chuan ,  GUO, Zhaohui ,  HUANG, Pang-Hsuan ,  LAI, Shao-Wei ,  HSU, Shih-Tsung

IPC: G05B19/418

Abstract: A server for knowledge recommendation for defect review. The server includes a processor electronically coupled to an electronic storage device storing a plurality of knowledge files related to wafer defects. The processor is configured to execute a set of instruction to cause the server to: receive a request for knowledge recommendation for inspecting an inspection image from a defect classification server; search for a knowledge file in the electronic storage device that matches the inspection image; and transmit the search result to the defect classification server.

公开(公告)号：WO2022207181A1

公开(公告)日：2022-10-06

申请号：PCT/EP2022/053896

申请日：2022-02-17

Applicant: ASML NETHERLANDS B.V.

Inventor： LEI, Hairong ,  FANG, Wei ,  FU, Yung Wen

IPC: G06T7/00

Abstract: An improved method of defect classification is disclosed. An improve method comprises obtaining an inspection image, obtaining layout data associated with the image, obtaining a probability map derived from the layout data, wherein the probability map identifies a probability of a first type of defect occurring in a region of the layout data, identifying a defect in the inspection image occurring at a first location, and classifying the defect based on the probability map and the first location.

公开(公告)号：WO2022078740A1

公开(公告)日：2022-04-21

申请号：PCT/EP2021/076446

申请日：2021-09-27

Applicant: ASML NETHERLANDS B.V.

Inventor： LEI, Hairong ,  FANG, Wei

IPC: G06T5/00 ,  G06T5/50

Abstract: Described herein is a method, and system for training a deblurring model and deblurring an image (e.g., SEM image) of a patterned substrate using the deblurring model and depth data associated with multiple layers of the patterned substrate. The method includes obtaining, via a simulator using a target pattern as input, a simulated image of the substrate, the target pattern comprising a first target feature to be formed on a first layer, and a second target feature to be formed on a second layer located below the first layer; determining, based on depth data associated with multiple layers of the substrate, edge range data for features of the substrate; and adjusting, using the simulated image and the edge range data associated with the target pattern as training data, parameters of a base model to generate the deblurring model to a deblur image of a captured image.

公开(公告)号：WO2021160436A1

公开(公告)日：2021-08-19

申请号：PCT/EP2021/051897

申请日：2021-01-27

Applicant: ASML NETHERLANDS B.V.

Inventor： PU, Lingling ,  FANG, Wei

IPC: G06T5/00 ,  G06T5/50 ,  G06T7/00

Abstract: An improved apparatus and method for extracting pattern contour information from an inspection image in a multiple charged-particle beam inspection system are disclosed. An improved method for extracting pattern contour information from an inspection image comprises identifying, from an inspection image obtained from a charged-particle beam inspection system, a first pattern and a second pattern that partially overlap in the inspection image. The method also comprises generating a first separation image by removing an image area corresponding to the second pattern from the inspection image. The first separation image includes the first pattern of which a first part is removed when removing the image area corresponding to the second pattern. The method also comprises updating the first separation image to include image data representing the removed first part of the first pattern based on a first reference image corresponding to the first pattern.

公开(公告)号：WO2021123075A1

公开(公告)日：2021-06-24

申请号：PCT/EP2020/086903

申请日：2020-12-17

Applicant: ASML NETHERLANDS B.V.

Inventor： FANG, Wei ,  ZHOU, Zhengwei ,  PU, Lingling

IPC: H01J37/02 ,  H01J37/26 ,  H01J37/317 ,  H01J2237/0435 ,  H01J2237/2817 ,  H01J2237/31774 ,  H01J37/3177

Abstract: A system and method for defect inspection using voltage contrast in a charged particle system are provided. Some embodiments of the system and method include positioning the stage at a first position to enable a first beam of the plurality of beams to scan a first surface area of the wafer at a first time to generate a first image associated with the first surface area; positioning the stage at a second position to enable a second beam of the plurality of beams to scan the first surface area at a second time to generate a second image associated with the first surface area; and comparing the first image with the second image to enable detecting whether a defect is identified in the first surface area of the wafer.

公开(公告)号：WO2021028366A1

公开(公告)日：2021-02-18

申请号：PCT/EP2020/072332

申请日：2020-08-08

Applicant: ASML NETHERLANDS B.V.

Inventor： FANG, Wei ,  PU, Lingling ,  WANG, Bo ,  DONG, Zhonghua ,  WANG, Yongxin

IPC: H01J37/22

Abstract: An improved apparatus and method for enhancing an image, and more particularly an apparatus and method for enhancing an image through cross-talk cancellation in a multiple charged- particle beam inspection are disclosed. An improved method for enhancing an image includes acquiring a first image signal of a plurality of image signals from a detector of a multi-beam inspection system. The first image signal corresponds to a detected signal from a first region of the detector on which electrons of a first secondary electron beam and of a second secondary electron beam are incident. The method includes reducing, from the first image signal, cross-talk contamination originating from the second secondary electron beam using a relationship between the first image signal and beam intensities associated with the first secondary electron beam and the second secondary electron beam. The method further includes generating a first image corresponding to first secondary electron beam after reduction.

公开(公告)号：WO2021018643A1

公开(公告)日：2021-02-04

申请号：PCT/EP2020/070395

申请日：2020-07-18

Applicant: ASML NETHERLANDS B.V.

Inventor： FANG, Wei ,  REN, Weiming ,  CHEN, Zhong-wei

IPC: H01J37/28

Abstract: Inspection systems and methods are disclosed. An inspection system may include a first energy source configured to provide a first landing energy beam and a second energy source configured to provide a second landing energy beam. The inspection system may also include a beam controller configured to selectively deliver one of the first and second landing energy beams towards a same field of view, and to switch between delivery of the first and second landing energy beams according to a mode of operation of the inspection system.

公开(公告)号：WO2020141072A1

公开(公告)日：2020-07-09

申请号：PCT/EP2019/085720

申请日：2019-12-17

Applicant: ASML NETHERLANDS B.V.

Inventor： ZHOU, Wentian ,  YU, Liangjiang ,  WANG, Teng ,  PU, Lingling ,  FANG, Wei

IPC: G06K9/03 ,  G06K9/62

Abstract: Disclosed herein is a method of automatically obtaining training images to train a machine learning model that improves image quality. The method may comprise analyzing a plurality of patterns of data relating to a layout of a product to identify a plurality of training locations on a sample of the product to use in relation to training the machine learning model. The method may comprise obtaining a first image having a first quality for each of the plurality of training locations, and obtaining a second image having a second quality for each of the plurality of training locations, the second quality being higher than the first quality. The method may comprise using the first image and the second image to train the machine learning model.

公开(公告)号：WO2020058142A1

公开(公告)日：2020-03-26

申请号：PCT/EP2019/074585

申请日：2019-09-13

Applicant: ASML NETHERLANDS B.V.

Inventor： MA, Long ,  JEN, Chih-Yu ,  DONG, Zhonghua ,  ZHANG, Peilei ,  FANG, Wei ,  LI, Chuan

IPC: H01J37/28

Abstract: An improved charged particle beam inspection apparatus, and more particularly, a particle beam apparatus for inspecting a wafer including an improved scanning mechanism for detecting fast- charging defects is disclosed. An improved charged particle beam inspection apparatus may include a charged particle beam source that delivers charged particles to an area of the wafer and scans the area. The improved charged particle beam apparatus may further include a controller including a circuitry to produce multiple images of the area over a time sequence, which are compared to detect fast- charging defects.