21.
    发明专利
    未知

    公开(公告)号:DE3485331D1

    公开(公告)日:1992-01-23

    申请号:DE3485331

    申请日:1984-04-09

    Applicant: BASF AG

    Abstract: Compsns. (I) contains A) 60-95 pts.wt. at least one crystalline thermoplastic polyamide, B) 5-40 pts.wt. at least one rubber-elastic polymerisate without hard external shell, prepd. by emulsion polymerisation, having particle size distribution substantially governed by polymerisation process and particle size under 2 microns, dispersed in, and predominantly insol. in A), where sum of A) + B) = 100 pts.wt., opt. C) up to 100 pts.wt. glass fibres or other reinforcing filler, and opt. D) effective amts. of conventional auxiliary agents. Pref. A) is linear, with m.pt. above 200 deg.C and relative viscosity (1% in conc. H2SO4 at 23 deg.C) 2.5-4.0, partic. poly(hexamethylene adipamide) or polycaprolactam. B) is at least partially crosslinked and has glass transition temp. below -20 deg.C; has on surface of particle mol. gps. causing adhesion to mols. of A), partic. COOH, carboxylic ester, or carboxylic amide gps.

    24.
    发明专利
    未知

    公开(公告)号:DE3644668A1

    公开(公告)日:1988-07-14

    申请号:DE3644668

    申请日:1986-12-30

    Applicant: BASF AG

    Abstract: Thermoplastic molding materials contain, as essential components, (A) from 40 to 95% by weight of a nylon and (B) from 5 to 60% by weight of a noncrosslinked copolymer based on (a) from 55 to 79.5% by weight of ethylene, (b) from 20 to 40% by weight of one or more primary or secondary C2-C8-alkyl esters of acrylic acid or methacrylic acid, (c) from 0.49 to 8% by weight of a monomer having an acid functional group or a latent acid functional group, or of an epoxy-containing monomer of an ethylenically unsaturated monocarboxylic acid, and (d) from 0.01 to 2% by weight of an ethylenically unsaturated dicarboxylic acid or of an anhydride of such an acid.

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