Abstract:
The present invention generally relates to an architecture for isolating an RF MEMS device from a substrate and driving circuit, series and shunt DVC die architectures, and smaller MEMS arrays for high frequency communications. The semiconductor device has one or more cells with a plurality of MEMS devices therein. The MEMS device operates by applying an electrical bias to either a pull-up electrode or a pull-down electrode to move a switching element of the MEMS device between a first position spaced a first distance from an RF electrode and a second position spaced a second distance different than the first distance from the RF electrode. The pull-up and/or pull-off electrode may be coupled to a resistor to isolate the MEMS device from the substrate.
Abstract:
The present invention generally relates to small antennas suitable for mobile devices operating in the high frequency and radio frequency bands in the range 100 MHz to 5 GHz. The antennas may be coupled to a DVC such as a MEMS DVC. The antenna may be coupled to a printed circuit board disposed inside of the mobile device, such as a mobile phone or smart phone.
Abstract:
The present invention generally relates to a MEMS DVC utilizing one or more MIM capacitors. The MIM capacitor may be disposed between the MEMS device and the RF pad or the MIM capacitor may be integrated into the MEMS device itself. The MIM capacitor ensures that a low resistance for the MEMS DVC is achieved.
Abstract:
The present disclosure generally relates to a MEMS DVC utilizing one or more MIM capacitors located in the anchor of the DVC and an Ohmic contact located on the RF-electrode. The MIM capacitor in combination with the ohmic MEMS device ensures that a stable capacitance for the MEMS DVC is achieved with applied RF power.
Abstract:
The present disclosure generally relates to a device having a variable frequency filter that rejects harmonics generated by a variable reactance device. The variable frequency filter may be coupled to the antenna and the variable reactance device. The filter includes a variable capacitor and an inductor coupled together as a resonant circuit. The filter may be used in cellular technology to prevent harmonic frequencies that are created by another variable reactance device from reaching the antenna of the cellular device. Furthermore, the filter can reflect any receiving frequencies from the antenna and prevent the receiving frequencies from passing through.
Abstract:
Utilizing a variable capacitor for RF and microwave applications provides for multiple levels of intra-cavity routing that advantageously reduce capacitive coupling. The variable capacitor includes a bond pad that has a plurality of cells electrically coupled thereto. Each of the plurality of cells has a plurality of MEMS devices therein. The MEMS devices share a common RF electrode, one or more ground electrodes and one or more control electrodes. The RF electrode, ground electrodes and control electrodes are all arranged parallel to each other within the cells. The RF electrode is electrically connected to the one or more bond pads using a different level of electrical routing metal.