公开(公告)号：JP2005116797A

公开(公告)日：2005-04-28

申请号：JP2003349495

申请日：2003-10-08

Applicant: Daishinku Corp ,  Kyocera Corp ,  京セラ株式会社 ,  株式会社大真空

Inventor： KISHIMOTO KOICHI ,  IIZUKA MINORU ,  ITO YOSHIAKI

IPC: H01L23/10 ,  H03H9/02 ,  H03H9/10

Abstract: PROBLEM TO BE SOLVED: To ensure the reliability of a hermetically sealing joining between a package base and a cap, also to have a hermetically sealing structure corresponding to an environmental problem, and further to suppress a production cost.
SOLUTION: A quartz resonator A is constituted of a quartz resonation plate 1, a package base 2 to which the quartz resonation plate 1 is mounted, and a cap 3 which is joined to the package base 2 for hermetically sealing the quartz resonation plate 1 mounted on the package base 2. The package base 2 is constituted of a bottom surface 21, and a frame 22 made of ceramics provided on an outer circumference of the bottom surface 21. A glass layer 41 is formed on an end surface 221 of the frame 22. A glass material 42 is formed on a lower surface of the cap 3. The glass layer 41 and the glass material 42 are arranged to contain a bismuthic material which is lead-free and halogen-free, and these are fused by heating up to a specific temperature, thereby hermetically joining the package base 2 to the cap 3 by this fusion.
COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：为了确保封装基座和盖子之间的密封接合的可靠性，还具有对应于环境问题的气密密封结构，并且进一步抑制生产成本。 解决方案：石英谐振器A由石英谐振板1，安装石英谐振板1的封装基座2和与封装基座2接合以将气相密封石英谐振的盖3 板1安装在封装基座2上。封装基座2由底面21和设置在底面21的外周上的由陶瓷制成的框架22​​构成。玻璃层41形成在端面221上 玻璃材料42形成在盖3的下表面上。玻璃层41和玻璃材料42被布置成包含无铅和无卤的铋材料，并且它们被熔融 通过加热到特定温度，从而通过该熔融将封装基底2气密地接合到盖3。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2003311425A

公开(公告)日：2003-11-05

申请号：JP2002114752

申请日：2002-04-17

Applicant: Daishinku Corp ,  株式会社大真空

Inventor： HARUTA AKIRA ,  OKUDA ICHIRO ,  IIZUKA MINORU ,  ISHIHARA HIROMASA

IPC: B23K11/00 ,  B23K11/06 ,  B23K11/34

Abstract: PROBLEM TO BE SOLVED: To substantially shorten required process time per work in applying seam welding to a base and a cap with the cap mounted on the base.
SOLUTION: A second pallet 41B is overlaid on a first pallet 41A at the lower side placing in a matrix shape a plurality of accommodation spaces prior to tack welding. The base B and the cap C are accommodated over the accommodation spaces of both the pallets 41A, 41B. A welding electrode 11 for tacking is inserted in the electrode insertion spaces E2, E2 of the second pallet 41B to bring the welding electrode 11 for tacking into contact with the cap C. The cap C is tack-welded to the base B. The second pallet 41B is then detached from the first pallet 41A. The entire periphery of the cap C is seam- welded to the base B in a state that the upper edge of the cap C is upwardly positioned rather than the upper surface of the first pallet 41A and with an electrode for seam welding brought into contact with the upper edge of the cap.
COPYRIGHT: (C)2004,JPO

Abstract translation: 要解决的问题：为了大幅缩短在将基座和盖安装在基座上的盖上进行缝焊工作所需的加工时间。 解决方案：第二托盘41B重叠在下侧的第一托盘41A上，在定位焊之前以矩阵形状放置多个容纳空间。 基座B和盖C被容纳在两个托盘41A，41B的容置空间中。 用于固定的焊接电极11插入第二托板41B的电极插入空间E2，E2中，以使焊接电极11与盖C接触。盖C与基座B粘接。第二 然后将托盘41B从第一托盘41A分离。 盖C的整个周边在盖C的上边缘向上定位而不是第一托盘41A的上表面的状态下被焊接到基部B，并且用于缝焊的电极与 帽的上边缘。 版权所有（C）2004，JPO

公开(公告)号：JP2002043884A

公开(公告)日：2002-02-08

申请号：JP2000227914

申请日：2000-07-27

Applicant: DAISHINKU CORP

Inventor： IIZUKA MINORU

IPC: H03B5/32 ,  H03H9/02 ,  H03H9/10

Abstract: PROBLEM TO BE SOLVED: To provide a piezoelectric vibrating device, capable of being further miniaturized, while keeping storage space for a piezoelectric diaphragm, improving reliability in airtight sealing and reducing production costs. SOLUTION: A surface-mounted crystal vibrator is composed of a ceramic package 1, having a recessed part with an opening upper part, a crystal diaphragm 2 of a piezoelectric element to be housed in the relevant package and a metal lid 2 bonded to the opening part of the package. The outer size of the metal lid 2 is set equal with the outer peripheral size of a metal ring, and a silver solder layer 21 is formed on the lower surface of the metal lid. In a state of overlapping and aligning the metal ring 12 and the silver solder layer 21 of the metal lid, seam welding is conducted.

公开(公告)号：JP2002026679A

公开(公告)日：2002-01-25

申请号：JP2000201990

申请日：2000-07-04

Applicant: DAISHINKU CORP

Inventor： IIZUKA MINORU

IPC: H01L23/02 ,  H01L23/10 ,  H03H9/02

Abstract: PROBLEM TO BE SOLVED: To provide a package for a piezoelectric vibration device that can countermeasure an EMI (electromagnetic interference) at a low cost and be made shorter and thinner so as to ensure a wider element containing area. SOLUTION: In the package for the piezoelectric vibration device formed by air-tightly joining a ceramic substrate 10 having a dam part at its outer circumference with a metallic cover 2 whose shape corresponds to the dam part, a metallized layer 11 is formed on the upper face of the dam part of the ceramic substrate inwardly from an outer circumferential edge of the metallic cover, the metallized layer is electrically connected to an earth terminal and the substrate and the metallic cover 2 are joined with a low melting point glass material G while the metallic cover is pressed into contact with the metallized layer.

公开(公告)号：JPH11354660A

公开(公告)日：1999-12-24

申请号：JP17392198

申请日：1998-06-04

Applicant: DAISHINKU CORP

Inventor： IIZUKA MINORU ,  TANIMOTO YASUHIRO

IPC: H01L23/02 ,  H03H3/02 ,  H03H9/02 ,  H03H9/10

Abstract: PROBLEM TO BE SOLVED: To provide a package for electronic part, and a production method thereof, in which a ceramic package for containing an electronic element and a cover can be jointed at a specified position without requiring any positioning jig and can be hermetically sealed surely. SOLUTION: A surface mounted type crystal oscillator basically comprises a recessed ceramic package 1 opening upward, an electronic element, i.e., a crystal oscillator 3 to be contained therein, and a metal cover 2 being jointed to a protrusion around the opening of the package 1. After the metal cover 2 is positioned fixedly with respect to the ceramic package 1 by ultrasonic welding, periphery of the major surface of the metal cover 2 is welded by means of an electron beam and sealed hermetically.

公开(公告)号：JPH11135659A

公开(公告)日：1999-05-21

申请号：JP31122497

申请日：1997-10-27

Applicant: DAISHINKU CORP

Inventor： IIZUKA MINORU

IPC: H01L23/02 ,  H03H9/02 ,  H03H9/19

Abstract: PROBLEM TO BE SOLVED: To provide a package for electronic device employing a highly reliable lamination technology in which airtightness is not deteriorated, even it the size is reduced. SOLUTION: This package for electronic device comprises a ceramic package 1 having a recessed containing part opening upward, an electronic element, i.e., a quartz diaphragm 3, contained in the package, and a metallic cover 2 bonded to the opening of the package. Electrode pads 14, 15 are formed at a part on the bottom face of the containing part in the ceramic package. The electrode pads 14, 15 are arranged, such that the upper surface thereof is flush with the bottom face of the containing part and connected electrically with lead-out electrodes 16, 17 formed on the bottom face on the outside of the package.

公开(公告)号：JP2014078740A

公开(公告)日：2014-05-01

申请号：JP2013258609

申请日：2013-12-13

Applicant: Daishinku Corp ,  株式会社大真空

Inventor： IIZUKA MINORU ,  KISHIMOTO KOICHI ,  SHIBUYA KOZO ,  NAKANISHI KENTARO

IPC: H01L23/04 ,  H01L23/08 ,  H03H9/02

CPC classification number: H01L23/49838 ,  H01L23/053 ,  H01L23/49822 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/16195 ,  H03H9/1021 ,  H05K1/0243 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10727 ,  Y02P70/613 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a method for improving the reliability of mounting joint between a package for an electronic component and a circuit board.SOLUTION: A shortest gap dimension from a plan view electrodeless region side edge of a first terminal electrode 12 in a short side direction of a bottom surface of a base 1 to plan view edges of wiring pads 41, 24, and a shortest gap dimension from a plan view electrodeless region side edge of a second terminal electrode 13 in a short side direction of the bottom surface of the base 1 to plan view edges of wiring pads 41, 24, are same size and are represented by the shortest gap dimension G1. A shortest gap dimension from a plan view electrodeless region side edge of the first terminal electrode 12 in a long side direction of the bottom surface of the base 1 to plan view edges of wiring pads 41, 24, and a shortest gap dimension from a plan view electrodeless region side edge of the second terminal electrode 13 in a long side direction of the bottom surface of the base 1 to plan view edges of wiring pads 41, 24, are same size and are represented by the shortest gap dimension G3. The shortest gap dimension G1 and the shortest gap dimension G3 are same size.

Abstract translation: 要解决的问题：提供一种用于提高用于电子部件的封装和电路板之间的安装接头的可靠性的方法。解决方案：从第一端子电极12的平面图无电极区域侧边缘的最短间隙尺寸 基底1的底面的短边方向，使布线垫41,42的平面观察边缘和从第二端子电极13的平面图无电极区域侧边缘到底面的短边方向的最短间隔尺寸 基板1的平面视图边缘的尺寸相同，由最短间隙尺寸G1表示。 在基座1的底面的长边方向上从第一端子电极12的平面图无电极区域侧边缘到布线衬垫41,42的平面图的边缘的最短间隙尺寸，以及来自平面图的最短间隙尺寸 在基座1的底面的长边方向上观察第二端子电极13的无电极区域侧边缘，使布线焊盘41,42的平面观察边缘相同，并由最短间隙尺寸G3表示。 最短间隙尺寸G1和最短间隙尺寸G3相同尺寸。

公开(公告)号：JP2008160332A

公开(公告)日：2008-07-10

申请号：JP2006345149

申请日：2006-12-22

Applicant: Daishinku Corp ,  株式会社大真空

Inventor： MURAKAMI TATSUYA ,  IIZUKA MINORU

IPC: H03H9/05 ,  H01L23/02 ,  H01L23/04 ,  H03H9/02

Abstract: PROBLEM TO BE SOLVED: To provide a new chip-type piezoelectric vibration device capable of surely holding a piezoelectric vibration element and performing airtight sealing even when it is super-miniaturized or a frequency is increased.
SOLUTION: On a crystal diaphragm 1, a thin part 1a is formed at a center part, a thick part 1b is formed around it, and an inverse mesa (both side concave) configuration is provided as a whole. Excitation electrodes 11 and 12 are formed facing each other on the front and back of the thin part 1a and the excitation electrodes are pulled out to the thick part 1b by respective pull-out electrodes 11a and 12a. The thin part of the crystal diaphragm 1 is airtightly sealed by lid bodies 21 and 22. The pull-out electrodes 11a and 12a are extended to the side faces (end faces) 1c of the short side of the crystal diaphragm 1, and terminal parts 31 and 32 are respectively joined to both side faces 1c.
COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 解决的问题：提供一种能够可靠地保持压电振动元件并且即使在超小型化或频率增加时也进行气密密封的新的芯片式压电振动器件。 解决方案：在晶体振动膜1上，在中心部形成有薄壁部1a，在其周围形成有厚壁部1b，整体上设置有逆台面（双面凹形）。 激励电极11和12在薄部分1a的前后形成为彼此相对，并且激励电极通过相应的拉出电极11a和12a被拉出到厚部分1b。 晶体膜1的薄部被盖体21和22气密地密封。拉出电极11a和12a延伸到晶体振动膜1的短边的侧面（端面）1c，端子部 31和32分别连接到两个侧面1c。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2007274307A

公开(公告)日：2007-10-18

申请号：JP2006096890

申请日：2006-03-31

Applicant: Daishinku Corp ,  株式会社大真空

Inventor： IIZUKA MINORU ,  SHIBUYA KOZO

IPC: H03H3/02 ,  H01L23/02 ,  H01L23/10

Abstract: PROBLEM TO BE SOLVED: To restrain manufacturing cost with an airtight sealing configuration that copies with environmental problems.
SOLUTION: A junction region 33 joined to a cap 4 is set onto a base 3. A jointing material 7 is fused for formation in the junction region 33 on the base 3 (formation process). After the formation process, a crystal vibrating piece 2 is arranged at a prescribed position on the base 3, and a conductive adhesive 8 is used for holding the crystal vibrating piece 2 on the base 3 (holding process). After the holding process, the base 3 is jointed to the cap 4 via the jointing material 7 (jointing process). In the jointing process, the junction region 33 of the base 3 is directed downward, the base 3 is brought closer to the cap 4 from upper portion, the cap 4 is jointed to the base 3 by the jointing material 7, and an internal space 6 of a package 5 is formed airtight for sealing the internal space 6.
COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：用环境问题复制的气密密封结构来限制制造成本。 解决方案：将接合到盖4的接合区域33设置在基座3上。接合材料7被熔合以形成在基座3上的接合区域33中（形成过程）。 在形成处理之后，在基座3上的规定位置配置水晶振动片2，将导电性粘合剂8用于将晶体振动片2保持在基体3上（保持工序）。 在保持过程之后，基部3经由接合材料7（接合工序）与盖4接合。 在接合过程中，基部3的接合区域33向下指向，基部3从上部更靠近盖4，盖4通过接合材料7接合到基部3，并且内部空间 包装5的6形成为密封密封内部空间6。版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2003158211A

公开(公告)日：2003-05-30

申请号：JP2001353860

申请日：2001-11-19

Applicant: DAISHINKU CORP

Inventor： IIZUKA MINORU ,  OGASAWARA YOSHIKIYO

IPC: B32B15/01 ,  H01L23/10 ,  H03H3/02 ,  H03H9/02 ,  H03H9/05 ,  H03H9/10

Abstract: PROBLEM TO BE SOLVED: To provide a package for an electronic component in which the size can be reduced while the containing space of an electronic element is assured, reliability of a hermetic seal is improved, and a manufacturing cost can be reduced, and to provide a piezoelectric vibration device using the same. SOLUTION: The piezoelectric vibration device comprises a ceramic package 1 having a recess opened at an upper part, a quartz vibration plate 3 of a piezoelectric vibration plate contained in the package, and a metallic cover 2 connected to the opening of the package. The device further comprises a copper layer 22 and a silver brazing material layer 23 sequentially formed at the lower surface of the metallic cover, that is, the ceramic package side. The cover 2 is connected to the package 1 by seam-welding.