公开(公告)号：NO20030255D0

公开(公告)日：2003-01-17

申请号：NO20030255

申请日：2003-01-17

Applicant: DEGUSSA

Inventor： HIMMELMANN MARTIN ,  BARTZ WILFRIED ,  BAUMANN FRANZ-ERICH ,  FARGES OLIVIER

IPC: C08G69/40 ,  C08L23/08 ,  C08L33/06 ,  C08L33/24 ,  C08L77/00 ,  C08L77/06 ,  C08L

Abstract: A molding composition comprises (wt.%): (A) a polyetheramide (99.9-95) based on a linear 6-12C aliphatic diamine, a linear 6-12C aliphatic or aromatic dicarboxylic acid and a primary amine-terminated polyetherdiamine with at least3C per ether oxygen atom; and (B) a copolymer (0.1-5) containing acid anhydride or epoxide units (0.8-20). A molding composition comprises (wt.%): (A) a polyetheramide (99.9-95) based on a linear 6-12C aliphatic diamine, a linear 6-12C aliphatic or aromatic dicarboxylic acid and a primary amine-terminated polyetherdiamine with at least3C per ether oxygen atom; and (B) a copolymer (0.1-5) containing: (i) acrylate units of formula (I) (0-85); (ii) imide units of formula (II) (0-80); (iii) acrylic acid units of formula (III) (0-15); (iv) acid anhydride or epoxide units of formula (IVA) or (IVB) respectively (0.8-20); and (v) 0-95% hydrocarbon units of formula (V) (0-95). Alkyl = 1-6C alkyl; R1 - R7 = H, CnH2n+1 or phenyl; m = 0 or 1; and n = 1-6.

公开(公告)号：DE10064333A1

公开(公告)日：2002-06-27

申请号：DE10064333

申请日：2000-12-21

Applicant: DEGUSSA

Inventor： SCHMITZ GUIDO ,  HAEGER HARALD ,  RIES HANS ,  BARTZ WILFRIED

IPC: B32B27/08 ,  B32B27/28 ,  B32B27/34 ,  C08L77/00 ,  C08L77/02 ,  C08L77/06 ,  B32B27/30 ,  B32B1/08 ,  B32B1/02 ,  F16L9/12

Abstract: A layered composite which includes the following layers (I) and (II), wherein layer (I) includes (a) from 0 to 80 part by weight of at least one particular polyamide; (b) from 0 to 100 parts by weight of at least one polyamine-polyamide copolymer; and (c) from 0 to 80 parts by weight of at least one particular polyamide which is different from (a), wherein various monomer units are present in at least 20 parts by weight of the entirety of (a) and (b) and various other monomer units are present in at least 20 parts by weight of the entirety of (b) and (c); and layer (II) includes at least one ethylene-vinyl alcohol copolymer.

公开(公告)号：AU9730501A

公开(公告)日：2002-06-27

申请号：AU9730501

申请日：2001-12-18

Applicant: DEGUSSA

Inventor： HIMMELMANN MARTIN ,  RICHTER RALF ,  HAEGER HARALD ,  OENBRINK GEORG ,  SCHMITZ GUIDO ,  BAUMANN FRANS-ERICH ,  BARTZ WILFRIED

IPC: C08J5/00 ,  C08G69/00 ,  C08G73/02 ,  C08L77/02 ,  C08L77/06 ,  C08L79/02 ,  C08G73/00 ,  C08G69/14 ,  C08G69/10 ,  C08G69/26

Abstract: A molding composition of at least 50% by weight of a polyamine-polyamide copolymer obtained from 0.05 to 2.5% by weight of a polyamine having at least 4 nitrogen atoms and having a viscosity of at least 5 000 Pa.s at 250° C. and at a shear rate of 0.1 l/s, and having a viscosity ratio of at least 7 at 250° C., when the melt viscosities at shear rates of 0.1 l/s and 100 l/s are compared with one another, has high melt stiffness and is easy to cut, and performs well in blow molding.

公开(公告)号：AU9722901A

公开(公告)日：2002-06-27

申请号：AU9722901

申请日：2001-12-13

Applicant: DEGUSSA

Inventor： BARTZ WILFRIED ,  HAGER HARALD ,  SCHMITZ GUIDO ,  RIES HANS

IPC: B32B27/08 ,  B32B27/28 ,  B32B27/34 ,  C08L77/00 ,  C08L77/02 ,  C08L77/06

Abstract: A layered composite which includes the following layers (I) and (II), wherein layer (I) includes (a) from 0 to 80 part by weight of at least one particular polyamide; (b) from 0 to 100 parts by weight of at least one polyamine-polyamide copolymer; and (c) from 0 to 80 parts by weight of at least one particular polyamide which is different from (a), wherein various monomer units are present in at least 20 parts by weight of the entirety of (a) and (b) and various other monomer units are present in at least 20 parts by weight of the entirety of (b) and (c); and layer (II) includes at least one ethylene-vinyl alcohol copolymer.

公开(公告)号：BR0100937A

公开(公告)日：2002-02-13

申请号：BR0100937

申请日：2001-03-08

Applicant: DEGUSSA

Inventor： BARTZ WILFRIED ,  BAUMANN FRANZ-ERICH ,  SCHMITZ GUIDO ,  OENBRINK GEORG ,  HAEGER HARALD

IPC: B60S5/02 ,  B60K15/01 ,  B60K15/03 ,  C08J5/00 ,  C08L23/08 ,  C08L53/02 ,  C08L77/00 ,  C08L77/02 ,  C08L77/06 ,  F16K27/00 ,  B32B27/34

Abstract: Polyamide molding composition containing an impact modifier and a functionalized olefin-acrylic polymer comprises a polyamide having an excess of terminal amino groups over terminal carboxy groups. Molding composition comprises: (A) 60-96.5 wt.% of a polyamide having an excess of terminal amino groups over terminal carboxy groups; (B) 3-39.5 wt.% of an anhydride-functional impact modifier selected from ethylene/ alpha -olefin copolymers and styrene-ethylenebutylene-styrene block copolymers; and (C) 0.5-20 wt.% of a copolymer comprising: (a) 20-94.5 wt.% 2-12C alpha -olefin units; (b) 5-79.5 wt.% (meth)acrylic acid, (meth)acrylate salt, 1-12C alcohol (meth)acrylate, (meth)acrylonitrile and/or (meth)acrylamide units; and (c) 0.5-50 wt.% olefinically unsaturated epoxide, carboxylic anhydride, carboximide, oxazoline or oxazinone units.

公开(公告)号：DE10030716A1

公开(公告)日：2002-01-03

申请号：DE10030716

申请日：2000-06-23

Applicant: DEGUSSA

Inventor： HAEGER HARALD ,  SCHMITZ GUIDO ,  BAUMANN FRANZ-ERICH ,  BARTZ WILFRIED ,  OENBRINK GEORG

IPC: B60S5/02 ,  B60K15/01 ,  B60K15/03 ,  C08J5/00 ,  C08L23/08 ,  C08L53/02 ,  C08L77/00 ,  C08L77/02 ,  C08L77/06 ,  F16K27/00 ,  C08L25/08 ,  C08L55/02 ,  B32B1/08 ,  H01B1/20

Abstract: Polyamide molding composition containing an impact modifier and a functionalized olefin-acrylic polymer comprises a polyamide having an excess of terminal amino groups over terminal carboxy groups. Molding composition comprises: (A) 60-96.5 wt.% of a polyamide having an excess of terminal amino groups over terminal carboxy groups; (B) 3-39.5 wt.% of an anhydride-functional impact modifier selected from ethylene/ alpha -olefin copolymers and styrene-ethylenebutylene-styrene block copolymers; and (C) 0.5-20 wt.% of a copolymer comprising: (a) 20-94.5 wt.% 2-12C alpha -olefin units; (b) 5-79.5 wt.% (meth)acrylic acid, (meth)acrylate salt, 1-12C alcohol (meth)acrylate, (meth)acrylonitrile and/or (meth)acrylamide units; and (c) 0.5-50 wt.% olefinically unsaturated epoxide, carboxylic anhydride, carboximide, oxazoline or oxazinone units.

公开(公告)号：NO20016312D0

公开(公告)日：2001-12-21

申请号：NO20016312

申请日：2001-12-21

Applicant: DEGUSSA

Inventor： BARTZ WILFRIED ,  SCHMITZ GUIDO ,  HAEGER HARALD ,  RIES HANS

IPC: B32B27/08 ,  B32B27/28 ,  B32B27/34 ,  C08L77/00 ,  C08L77/02 ,  C08L77/06 ,  B32B

Abstract: A layered composite which includes the following layers (I) and (II), wherein layer (I) includes (a) from 0 to 80 part by weight of at least one particular polyamide; (b) from 0 to 100 parts by weight of at least one polyamine-polyamide copolymer; and (c) from 0 to 80 parts by weight of at least one particular polyamide which is different from (a), wherein various monomer units are present in at least 20 parts by weight of the entirety of (a) and (b) and various other monomer units are present in at least 20 parts by weight of the entirety of (b) and (c); and layer (II) includes at least one ethylene-vinyl alcohol copolymer.

公开(公告)号：CA2477487C

公开(公告)日：2012-10-02

申请号：CA2477487

申请日：2004-08-16

Applicant: DEGUSSA

Inventor： WURSCHE ROLAND ,  DOWE ANDREAS ,  BAUMANN FRANZ-ERICH ,  BARTZ WILFRIED ,  HIMMELMANN MARTIN ,  GOERING RAINER

IPC: C08G69/48 ,  C08J7/14 ,  C08G69/02 ,  C08G69/04 ,  C08G69/16 ,  C08G69/18 ,  C08G69/28 ,  C08G73/02 ,  C08J3/20 ,  C08K5/098 ,  C08K5/109 ,  C08K5/49 ,  C08L77/00 ,  C08L77/02

Abstract: Disclosed is a process for increasing a molecular weight of polyamide, which comprises: (A) providing polyamide or a molding composition containing the polyamide and at least one other ingredient, wherein the polyamide contains from 5 to 500 ppm of phosphorous in the form of an acidic compound resulting from a catalyst employed in preparation of the polyamide; and (B) heating the polyamide or the molding composition in the presence of (i) a compound having at least two carbonate units and (ii) a salt of a weak acid in an amount of from 0.001 to 10% by weight based on the polyamide, under conditions effective to increase the molecular weight of the polyamide. By this process, the molecular weight of a wide variety of polyamides may be increased.

公开(公告)号：AT377629T

公开(公告)日：2007-11-15

申请号：AT01110643

申请日：2001-05-02

Applicant: EVONIK DEGUSSA GMBH

Inventor： HAEGER HARALD ,  SCHMITZ GUIDO ,  BAUMANN FRANZ-ERICH ,  BARTZ WILFRIED ,  OENBRINK GEORG

IPC: B60S5/02 ,  C08L77/00 ,  B60K15/01 ,  B60K15/03 ,  C08J5/00 ,  C08L23/08 ,  C08L53/02 ,  C08L77/02 ,  C08L77/06 ,  F16K27/00

Abstract: Polyamide molding composition containing an impact modifier and a functionalized olefin-acrylic polymer comprises a polyamide having an excess of terminal amino groups over terminal carboxy groups. Molding composition comprises: (A) 60-96.5 wt.% of a polyamide having an excess of terminal amino groups over terminal carboxy groups; (B) 3-39.5 wt.% of an anhydride-functional impact modifier selected from ethylene/ alpha -olefin copolymers and styrene-ethylenebutylene-styrene block copolymers; and (C) 0.5-20 wt.% of a copolymer comprising: (a) 20-94.5 wt.% 2-12C alpha -olefin units; (b) 5-79.5 wt.% (meth)acrylic acid, (meth)acrylate salt, 1-12C alcohol (meth)acrylate, (meth)acrylonitrile and/or (meth)acrylamide units; and (c) 0.5-50 wt.% olefinically unsaturated epoxide, carboxylic anhydride, carboximide, oxazoline or oxazinone units.

公开(公告)号：DE10337707A1

公开(公告)日：2005-04-07

申请号：DE10337707

申请日：2003-08-16

Applicant: DEGUSSA

Inventor： WURSCHE ROLAND ,  DOWE ANDREAS ,  BAUMANN FRANZ-ERICH ,  BARTZ WILFRIED ,  HIMMELMANN MARTIN ,  GOERING RAINER

IPC: C08J7/14 ,  C08G69/04 ,  C08G69/16 ,  C08G69/18 ,  C08G69/28 ,  C08G69/48 ,  C08G73/02 ,  C08J3/20 ,  C08K5/098 ,  C08K5/109 ,  C08L77/00 ,  C08L77/02 ,  C08G69/46 ,  C08J5/18 ,  B32B27/34

Abstract: Condensation (M1) of polyamide or polyamide molding composition involves adding a compound (a) having at least two carbonate units (0.005 - 10 wt.%), and a salt of a weak acid (0.001 - 10 wt.%) to the polyamide or polyamide composition comprising phosphorus (5 - 500 parts per million (ppm)) in the form of an acidic compound. An independent claim is included for preparation (M2) of a polyamide molding or film involving: producing polyamide or polyamide composition by (M1); and injection molding, extruding, co-extruding, blow molding, suction blow molding, 3D blow molding or thermoforming the polyamide or polyamide composition to produce a molding or a film.