公开(公告)号：DE3576098D1

公开(公告)日：1990-03-29

申请号：DE3576098

申请日：1985-10-15

Applicant: IBM

Inventor： HERRON LESTER WYNN ,  KUMAR ANANDA HOSAKERE

IPC: H01L23/12 ,  C23C10/04 ,  H01L21/388 ,  H01L21/48 ,  H05K1/03 ,  H05K1/09 ,  H05K3/24

Abstract: In a maskless metal cladding process for plating an existing metallurgical pattern (13), a protective layer (16) is utilized to isolate those areas of underlying metallurgy on which additional metal plating is not desired. The layer acts as an isolation barrier to protect the underlying metallurgy from deposition and subsequent diffusion of the heavy metal overlay (17). The composition of the protective layer is selected as one having sufficient mechanical integrity to withstand process handling and support the gold overlay and having the thermal integrity to withstand the high temperatures reached during metal sputtering and diffusion processes. The isolation barrier layer has an organic component as a binder which thermally decomposes, either in a heating step before metal deposition or during the diffusion cycle, leaving no carbonaceous residue but leaving an inert, inorganic standoff to support the metal. After diffusion of the metal, the remaining inorganic standoff layer, overlying metal and any undiffused metal remaining on the non-patterned substrate is easily removed by a standard technique, such as ultrasonics.

公开(公告)号：DE3161547D1

公开(公告)日：1984-01-05

申请号：DE3161547

申请日：1981-06-25

Applicant: IBM

Inventor： DUBETSKY DERRY JAY ,  HERRON LESTER WYNN ,  MASTER RAJ NAVINCHANDRA

IPC: C03C8/16 ,  C03C10/00 ,  C03C10/04 ,  H01L21/48 ,  H01L23/12 ,  H01L23/52 ,  H05K1/03 ,  H05K1/09 ,  H05K3/46 ,  C04B35/64 ,  C04B39/00 ,  H01G4/30

Abstract: Enhanced planarity and dimensional integrity of sintered glass-ceramic structures containing multi-level (e.g. copper) conductor patterns is obtained by a two stage firing of the structure, first between the anneal and softening points of the crystallizable glass particles in the structure, interrupting the firing, superimposing a lightweight platen on the structure, and heating through the coalescing temperature to the crystallization temperature of the glass.