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公开(公告)号：ES2062972T3
公开(公告)日：1995-01-01
申请号：ES87103375
申请日：1987-03-10
Applicant: IBM
Inventor： ANDERSON HERBERT RUDOLF JR , DIVAKARUNI RENUKA SHASTRI , DYNYS JOSEPH MICHAEL , KANDETZKE STEVEN MICHAEL , KIRBY DANIEL PATRICK , MASTER RAJ NAVINCHANDRA , CASEY JON ALFRED
Abstract: The present invention provides a method for producing multilayered ceramic structures having copper-based conductors therein, wherein the onset of sintering of the copper-based conductor can be adjusted to approach or match that of the ceramic portion of the structure. In addition, methods are provided whereby the polymeric binder resin used in formation of the ceramic portion of the structure can be removed or burned-off, using oxygen-containing ambients, wherein the oxygen content is greater than 200 ppm, without oxidation of the copper-based conductors therein.
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公开(公告)号：DE3750684T2
公开(公告)日：1995-05-18
申请号：DE3750684
申请日：1987-03-10
Applicant: IBM
Inventor： ANDERSON HERBERT , DIVAKARUNI RENUKA SHASTRI , DYNYS JOSEPH MICHAEL , KANDETZKE STEVEN MICHAEL , KIRBY DANIEL PATRICK , MASTER RAJ NAVINCHANDRA , CASEY JON ALFRED
Abstract: The present invention provides a method for producing multilayered ceramic structures having copper-based conductors therein, wherein the onset of sintering of the copper-based conductor can be adjusted to approach or match that of the ceramic portion of the structure. In addition, methods are provided whereby the polymeric binder resin used in formation of the ceramic portion of the structure can be removed or burned-off, using oxygen-containing ambients, wherein the oxygen content is greater than 200 ppm, without oxidation of the copper-based conductors therein.
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公开(公告)号：DE3161547D1
公开(公告)日：1984-01-05
申请号：DE3161547
申请日：1981-06-25
Applicant: IBM
Inventor： DUBETSKY DERRY JAY , HERRON LESTER WYNN , MASTER RAJ NAVINCHANDRA
IPC: C03C8/16 , C03C10/00 , C03C10/04 , H01L21/48 , H01L23/12 , H01L23/52 , H05K1/03 , H05K1/09 , H05K3/46 , C04B35/64 , C04B39/00 , H01G4/30
Abstract: Enhanced planarity and dimensional integrity of sintered glass-ceramic structures containing multi-level (e.g. copper) conductor patterns is obtained by a two stage firing of the structure, first between the anneal and softening points of the crystallizable glass particles in the structure, interrupting the firing, superimposing a lightweight platen on the structure, and heating through the coalescing temperature to the crystallization temperature of the glass.
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公开(公告)号：DE3576793D1
公开(公告)日：1990-05-03
申请号：DE3576793
申请日：1985-04-23
Applicant: IBM
Inventor： HERRON LESTER WYNN , MASTER RAJ NAVINCHANDRA , NUFER ROBERT WOLFF
Abstract: In the formation of a glass-ceramic substrate containing multi-layer, interconnected thick-film pattern of metal-based conductors by subjecting glass-ceramic and metal particles to a sintering cycle, sintering of the metal particles at their normal sintering temperature is inhibited by coating the metal particles with an organic material such as polyvinyl butyral, polyvinyl formvar, polyvinyl alcohol, polyacrylonitrile epoxies, urethanes and cross-linked polyvinyl butyral. The organic coating serves as a barrier preventing physical contact between metal particles during the initial phase of the sintering cycle and degrades into a carbonaceous coating followed by volatilization during the intermediate phase of the cycle permitting coalescence of the metal particles into a dense mass along with the coalescence of the glass-ceramic particles. Co-sintering of the metal particles and the glass-ceramic particles with the aid of the organic coating results in a hermectic multi-layer glass ceramic substrate free of dimensional stability problems without deleteriously affecting the electrical conductivity of the metal conductor pattern.
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公开(公告)号：IT1150089B
公开(公告)日：1986-12-10
申请号：IT2040880
申请日：1980-03-07
Applicant: IBM
Inventor： HERRON LESTER WYNN , MASTER RAJ NAVINCHANDRA , TUMMALA RAO RAMAMAHARA
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Patent Agency Ranking
公开(公告)号：IT8020408D0
公开(公告)日：1980-03-07
申请号：IT2040880
申请日：1980-03-07
Applicant: IBM
Inventor： HERRON LESTER WYNN , MASTER RAJ NAVINCHANDRA , TUMMALA RAO RAMAMAHARA
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公开(公告)号：DE3750684D1
公开(公告)日：1994-12-01
申请号：DE3750684
申请日：1987-03-10
Applicant: IBM
Inventor： ANDERSON HERBERT , DIVAKARUNI RENUKA SHASTRI , DYNYS JOSEPH MICHAEL , KANDETZKE STEVEN MICHAEL , KIRBY DANIEL PATRICK , MASTER RAJ NAVINCHANDRA , CASEY JON ALFRED
Abstract: The present invention provides a method for producing multilayered ceramic structures having copper-based conductors therein, wherein the onset of sintering of the copper-based conductor can be adjusted to approach or match that of the ceramic portion of the structure. In addition, methods are provided whereby the polymeric binder resin used in formation of the ceramic portion of the structure can be removed or burned-off, using oxygen-containing ambients, wherein the oxygen content is greater than 200 ppm, without oxidation of the copper-based conductors therein.
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公开(公告)号：DE3279431D1
公开(公告)日：1989-03-09
申请号：DE3279431
申请日：1982-12-20
Applicant: IBM
Inventor： MASTER RAJ NAVINCHANDRA , PITTLER MARVIN STANLEY , TOTTA PAUL ANTHONY , AINSLIE NORMAN GEORGE , PALMATEER PAUL HARRY
Abstract: In the process for joining metallic coated connector pins (20) to a multilayer ceramic substrate (10), contact areas on the substrate are formed by sequential coatings of molybdenum (12) and nickel (14), which are heated to diffuse the nickel. A pure gold paste is applied by screen printing, for example, followed by the step of firing to burn out the paste binder and to sinter the pure gold particles onto a dense low porosity structure. The sintering operation converts the Ni film (14) into a continuous Au-Ni solid solution. During pin braze, Ni-Sn intermetallics are dispersed in a gold rich matrix of the Au-Ni solid solution.
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9.发明专利
公开(公告)号：DE3060057D1
公开(公告)日：1982-01-14
申请号：DE3060057
申请日：1980-01-16
Applicant: IBM
Inventor： HERRON LESTER WYNN , MASTER RAJ NAVINCHANDRA , TUMMALA RAO RAMAMAHARA
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