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公开(公告)号:JP2002134926A
公开(公告)日:2002-05-10
申请号:JP2001193284
申请日:2001-06-26
Applicant: IBM
Inventor: DANIEL GEORGE BERGER , FAROOQ SHAJI , HERRON LESTER WYNN , HUMENIK JAMES N , KNICKERBOCKER JOHN ULRICH , PASCO ROBERT WILLIAM , PERRY CHARLES H , SACHDEV KRISHNA G
Abstract: PROBLEM TO BE SOLVED: To provide an organic inorganic compound electronic substrate which can be manufactured at a low cost, a compound electronic substrate wherein relative permitivity, impedance, CTE, double refraction and mutual connection stress are low, and package card reliability is high, a compound electronic substrate wherein Tg is high and thermal stability is superior, and a compound electronic substrate having low hygroscopicity. SOLUTION: A compound electronic and/or optical substrate contains polymer material and ceramic material, and has relative permitivity lower than 4 and coefficient of thermal expansion of 8-14 ppm/ deg.C at 100 deg.C. This compound substrate is composed of polymer material containing ceramic filler material or ceramic material containing polymer filler material.
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公开(公告)号:BR8504923A
公开(公告)日:1986-07-22
申请号:BR8504923
申请日:1985-10-07
Applicant: IBM
Inventor: HERRON LESTER WYNN , KUMAR ANANDA HOSAKERE
Abstract: In a maskless metal cladding process for plating an existing metallurgical pattern (13), a protective layer (16) is utilized to isolate those areas of underlying metallurgy on which additional metal plating is not desired. The layer acts as an isolation barrier to protect the underlying metallurgy from deposition and subsequent diffusion of the heavy metal overlay (17). The composition of the protective layer is selected as one having sufficient mechanical integrity to withstand process handling and support the gold overlay and having the thermal integrity to withstand the high temperatures reached during metal sputtering and diffusion processes. The isolation barrier layer has an organic component as a binder which thermally decomposes, either in a heating step before metal deposition or during the diffusion cycle, leaving no carbonaceous residue but leaving an inert, inorganic standoff to support the metal. After diffusion of the metal, the remaining inorganic standoff layer, overlying metal and any undiffused metal remaining on the non-patterned substrate is easily removed by a standard technique, such as ultrasonics.
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公开(公告)号:DE3787993D1
公开(公告)日:1993-12-09
申请号:DE3787993
申请日:1987-04-22
Applicant: IBM
Inventor: FLAITZ PHILIP LEE , FLANAGAN ARLYNE MARIE , HARVILCHUCK JOSEPH MATTHEW , HERRON LESTER WYNN , KNICKERBOCKER JOHN ULRICH , NUFER ROBERT WOLFF , PERRY CHARLES HAMPTON , REDDY SRINIVASA N
IPC: C04B35/638 , C04B35/64 , H01L21/48
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公开(公告)号:DK495885D0
公开(公告)日:1985-10-29
申请号:DK495885
申请日:1985-10-29
Applicant: IBM
Inventor: HERRON LESTER WYNN , KUMAR ANANDA HOSAKERE
Abstract: In a maskless metal cladding process for plating an existing metallurgical pattern (13), a protective layer (16) is utilized to isolate those areas of underlying metallurgy on which additional metal plating is not desired. The layer acts as an isolation barrier to protect the underlying metallurgy from deposition and subsequent diffusion of the heavy metal overlay (17). The composition of the protective layer is selected as one having sufficient mechanical integrity to withstand process handling and support the gold overlay and having the thermal integrity to withstand the high temperatures reached during metal sputtering and diffusion processes. The isolation barrier layer has an organic component as a binder which thermally decomposes, either in a heating step before metal deposition or during the diffusion cycle, leaving no carbonaceous residue but leaving an inert, inorganic standoff to support the metal. After diffusion of the metal, the remaining inorganic standoff layer, overlying metal and any undiffused metal remaining on the non-patterned substrate is easily removed by a standard technique, such as ultrasonics.
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公开(公告)号:MY139408A
公开(公告)日:2009-09-30
申请号:MYPI0501939
申请日:1995-12-01
Applicant: IBM , CARBORUNDUM CO
Inventor: CASEY JON ALFRED , SHINDE SUBHASH LAXMAN , VALLABHANENI RAO VENKATESWARA , YOUNGMAN ROBERT A , HERRON LESTER WYNN , CORDERO CARLA NATALIA , FASANO BENJAMIN VITO , GOLAND DAVID BRIAN , HANNON ROBERT , HARRIS JONATHAN H , JOHNSON GREGORY MARVIN , PATEL NIRANJAN MOHANLAL , REITTER ANDREW MICHAEL
IPC: B22F3/00 , B22F7/02 , B32B18/00 , C04B35/581 , C04B37/02 , C04B41/51 , C04B41/52 , C04B41/88 , C04B41/89 , C22C29/16 , H01L21/48 , H01L23/373 , H05K1/03 , H05K3/24 , H05K3/40 , H05K3/46
Abstract: DISCLOSED IS AN ALUMINUM NITRIDE BODY HAVING GRADED METALLURGY AND A METHOD FOR MAKING SUCH A BODY. THE ALUMINUM NITRIDE BODY HAS AT LEAST ONE VIA AND INCLUDES A FIRST LAYER IN DIRECT CONTACT WITH THE ALUMINUM NITRIDE BODY AND A SECOND LAYER IN DIRECT CONTACT WITH, AND THAT COMPLETELY ENCAPSULATES, THE FIRST LAYER. THE FIRST LAYER INCLUDES 30 TO 60 VOLUME PERCENT ALUMINUM NITRIDE AND 40 TO 70 VOLUME PERCENT TUNGSTEN AND/OR MOLYBDENUM WHILE THE SECOND LAYER INCLUDES 90 TO 100 VOLUME PERCENT OF TUNGSTEN AND/OR MOLYBDENUM AND 0 TO 10 VOLUME PERCENT OF ALUMINUM NITRIDE.
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公开(公告)号:DE68915354T2
公开(公告)日:1994-11-24
申请号:DE68915354
申请日:1989-06-08
Applicant: IBM
Inventor: HERRON LESTER WYNN , KNICKERBOCKER SARAH HUFFSMITH , KUMAR ANANDA HOSAKERE , NMN NATARAJAN GOVINDARAJAN , REDDY SRINIVASA S N
IPC: C04B35/64 , B32B18/00 , C04B35/634 , C04B35/638 , H01L21/48 , H05K3/46 , C04B35/00
Abstract: There is disclosed the enhancement of the removal of carbon from multilayer ceramic substrate laminate during the sintering thereof. A multilayer ceramic substrate laminate having metallic lines and vias is provided with a reducible metal oxide in close proximity to the substrate laminate. The multilayer ceramic substrate laminate contains a polymeric binder which upon heating depolymerizes into carbon. The substrate laminate is sintered in an atmosphere which is reducing with respect to the reducible metal oxide and which is oxidizing with respect to the carbon.
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公开(公告)号:AU4791285A
公开(公告)日:1986-05-08
申请号:AU4791285
申请日:1985-09-26
Applicant: IBM
Inventor: HERRON LESTER WYNN , KUMAR ANANDA HOSAKERE , NUFER ROBERT WOLFF
Abstract: In a maskless metal cladding process for plating an existing metallurgical pattern (13), a protective layer (16) is utilized to isolate those areas of underlying metallurgy on which additional metal plating is not desired. The layer acts as an isolation barrier to protect the underlying metallurgy from deposition and subsequent diffusion of the heavy metal overlay (17). The composition of the protective layer is selected as one having sufficient mechanical integrity to withstand process handling and support the gold overlay and having the thermal integrity to withstand the high temperatures reached during metal sputtering and diffusion processes. The isolation barrier layer has an organic component as a binder which thermally decomposes, either in a heating step before metal deposition or during the diffusion cycle, leaving no carbonaceous residue but leaving an inert, inorganic standoff to support the metal. After diffusion of the metal, the remaining inorganic standoff layer, overlying metal and any undiffused metal remaining on the non-patterned substrate is easily removed by a standard technique, such as ultrasonics.
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公开(公告)号:DK495885A
公开(公告)日:1986-05-01
申请号:DK495885
申请日:1985-10-29
Applicant: IBM
Inventor: HERRON LESTER WYNN , KUMAR ANANDA HOSAKERE
Abstract: In a maskless metal cladding process for plating an existing metallurgical pattern (13), a protective layer (16) is utilized to isolate those areas of underlying metallurgy on which additional metal plating is not desired. The layer acts as an isolation barrier to protect the underlying metallurgy from deposition and subsequent diffusion of the heavy metal overlay (17). The composition of the protective layer is selected as one having sufficient mechanical integrity to withstand process handling and support the gold overlay and having the thermal integrity to withstand the high temperatures reached during metal sputtering and diffusion processes. The isolation barrier layer has an organic component as a binder which thermally decomposes, either in a heating step before metal deposition or during the diffusion cycle, leaving no carbonaceous residue but leaving an inert, inorganic standoff to support the metal. After diffusion of the metal, the remaining inorganic standoff layer, overlying metal and any undiffused metal remaining on the non-patterned substrate is easily removed by a standard technique, such as ultrasonics.
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9.
公开(公告)号:DE3060057D1
公开(公告)日:1982-01-14
申请号:DE3060057
申请日:1980-01-16
Applicant: IBM
Inventor: HERRON LESTER WYNN , MASTER RAJ NAVINCHANDRA , TUMMALA RAO RAMAMAHARA
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公开(公告)号:MY134821A
公开(公告)日:2007-12-31
申请号:MYPI9503713
申请日:1995-12-01
Applicant: IBM , CARBORUNDUM CO
Inventor: CASEY JON ALFRED , REITTER ANDREW MICHAEL , SHINDE SUBHASH LAXMAN , VALLABHANENI RAO VENKATESWARA , YOUNGMAN ROBERT A , CORDERO CARLA NATALIA , FASANO BENJAMIN VITO , GOLAND DAVID BRIAN , HANNON ROBERT , HARRIS JONATHAN H , HERRON LESTER WYNN , JOHNSON GREGORY MARVIN , PATEL NIRANJAN MOHANLAL
IPC: B22F3/00 , B22F7/02 , B32B18/00 , C04B35/581 , C04B37/02 , C04B41/51 , C04B41/52 , C04B41/88 , C04B41/89 , C22C29/16 , H01L21/48 , H01L23/373 , H05K1/03 , H05K3/24 , H05K3/40 , H05K3/46
Abstract: DISCLOSED IS AN ALUMINUM NITRIDE BODY HAVING GRADED ETALLURGY AND A METHOD FOR MAKING SUCH A BODY. THE ALUMINUM NITRIDE ODY HAS AT LEAST ONE VIA AND INCLUDES A FIRST LAYER IN DIRECT ONTACT WITH THE ALUMINUM NITRIDE BODY AND A SECOND LAYER IN DIRECT NTACT WITH, AND THAT COMPLETELY ENCAPSULATES, THE FIRST LAYER. THE FIRST LAYER INCLUDES 30 TO 60 VOLUME PERCENT ALUMINUM ITRIDE AND 40 TO 70 VOLUME PERCENT TUNGSTEN AND/OR MOLYBDENUM WHILE THE SECOND LAYER INCLUDES 90 TO 100 VOLUME PERCENT OF TUNGSTEN AND/OR MOLYBDENUM 0 TO 10 VOLUME PERCENT OF ALUMINUM NITRIDE. (FIG. 1)
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