公开(公告)号：DE3161547D1

公开(公告)日：1984-01-05

申请号：DE3161547

申请日：1981-06-25

Applicant: IBM

Inventor： DUBETSKY DERRY JAY ,  HERRON LESTER WYNN ,  MASTER RAJ NAVINCHANDRA

IPC: C03C8/16 ,  C03C10/00 ,  C03C10/04 ,  H01L21/48 ,  H01L23/12 ,  H01L23/52 ,  H05K1/03 ,  H05K1/09 ,  H05K3/46 ,  C04B35/64 ,  C04B39/00 ,  H01G4/30

Abstract: Enhanced planarity and dimensional integrity of sintered glass-ceramic structures containing multi-level (e.g. copper) conductor patterns is obtained by a two stage firing of the structure, first between the anneal and softening points of the crystallizable glass particles in the structure, interrupting the firing, superimposing a lightweight platen on the structure, and heating through the coalescing temperature to the crystallization temperature of the glass.

公开(公告)号：DE3671580D1

公开(公告)日：1990-06-28

申请号：DE3671580

申请日：1986-06-18

Applicant: IBM

Inventor： BOSS DAVID W ,  DUBETSKY DERRY JAY

IPC: H01L23/538 ,  C04B35/64 ,  H01L21/48 ,  H01L23/52 ,  H05K1/00 ,  H05K1/03 ,  H05K1/09 ,  H05K3/00 ,  H05K3/46

Abstract: A method of fabricating a multilayer ceramic sub­strate with an internal conductive metallurgy circuit network, wherein additional green sheet material (36) is added to the stack (30) of ceramic green sheets during assembly to areas of the substrate outside of the con­ductive metallurgy to compensate for the volume of conductive metal paste and to thereby eliminate or minimize substrate distortion during the sintering operation.

公开(公告)号：BR8603483A

公开(公告)日：1987-03-04

申请号：BR8603483

申请日：1986-07-24

Applicant: IBM

Inventor： BOSS DAVID W ,  DUBETSKY DERRY JAY

IPC: H01L23/538 ,  C04B35/64 ,  H01L21/48 ,  H01L23/52 ,  H05K1/00 ,  H05K1/03 ,  H05K1/09 ,  H05K3/00 ,  H05K3/46 ,  H05K7/20

Abstract: A method of fabricating a multilayer ceramic sub­strate with an internal conductive metallurgy circuit network, wherein additional green sheet material (36) is added to the stack (30) of ceramic green sheets during assembly to areas of the substrate outside of the con­ductive metallurgy to compensate for the volume of conductive metal paste and to thereby eliminate or minimize substrate distortion during the sintering operation.

公开(公告)号：DE3066432D1

公开(公告)日：1984-03-08

申请号：DE3066432

申请日：1980-11-18

Applicant: IBM

Inventor： DUBETSKY DERRY JAY

IPC: B28B1/30 ,  C04B35/64 ,  C04B41/80 ,  C04B41/81 ,  F27D3/12 ,  H05K1/03 ,  H05K3/46 ,  F27D5/00

Abstract: A method of achieving uniform shrinkage of a laminated green ceramic substrate during sintering wherein the substrate is placed on a flat, relatively thick plate of refractory material such as molybdenum, tantalum or tungsten or alloys thereof with the flat plate provided with a thin surface coating layer of a ceramic material, and heating the substrate to a sintering temperature and maintaining the temperature for a time sufficient to sinter the substrate. A setter plate for supporting a planar green ceramic substrate during the sintering operation, the setter plate is made of a refractory material and provided with a thin ceramic coating at least on the top surface.