公开(公告)号：JP2003069219A

公开(公告)日：2003-03-07

申请号：JP2001251995

申请日：2001-08-22

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーション

Inventor： OSUMI KOICHI ,  TSUKADA YUTAKA

IPC: H05K3/40 ,  H05K1/11 ,  H05K3/00 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a method for designing a through hole for raising a wiring density and enhancing insulating reliability and to provide a printed wiring board having the through hole designed by the method. SOLUTION: The method for designing the through hole comprises a step of determining a position of a first through hole 10a of adjacent through holes 10a, 10b at a position for cutting a first fiber 12a, and a step of determining a position of the second through hole 10b of the adjacent through holes 10a, 10b at a position for not simultaneously cutting the first fiber 12a and the second fiber 12b by cutting the second fiber 12b intersecting with the first fiber 12a.

Abstract translation: 要解决的问题：提供一种用于设计用于提高布线密度并提高绝缘可靠性的通孔的方法，并提供具有通过该方法设计的通孔的印刷线路板。 解决方案：用于设计通孔的方法包括确定相邻通孔10a，10b的第一通孔10a在用于切割第一纤维12a的位置处的位置的步骤，以及确定第二通孔 在通过切割与第一纤维12a交叉的第二纤维12b的同时切割第一纤维12a和第二纤维12b的位置处的相邻通孔10a，10b的孔10b。

公开(公告)号：JPH10135642A

公开(公告)日：1998-05-22

申请号：JP26147897

申请日：1997-09-26

Applicant: IBM

Inventor： TSUKADA YUTAKA ,  TSUCHIDA SHUHEI

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To reduce through hole connections to be minimum by interconnecting the signal wiring conductors of different wiring layers using via holes formed in interlayer insulating layers. SOLUTION: Wiring layers including wiring layers separated by interlayer insulating layers 28 are formed on one side of a double-sided copper-clad circuit board. The via holes 30 are formed in the interlayer insulating layers 28 and the signal wiring conductors 26 of the different wiring layers are interconnected through the via holes 30. Power potential or ground potential from one side of the double-sided copper-clad circuit board to the other side is interconnected by the through-hole made through the board. Thus, the use of the large through- hole becomes minimum and therefore the size of a circuit package can considerably be reduced.

公开(公告)号：JPH08264956A

公开(公告)日：1996-10-11

申请号：JP6445895

申请日：1995-03-23

Applicant: IBM

Inventor： MIZUMOTO SHOGO ,  TSUKADA YUTAKA

IPC: H01L23/498 ,  H05K3/46

Abstract: PURPOSE: To perform wiring freely in an SLC layer by maintaining the conductor path securing function of a through hole, which is electrically connected to a solder ball located at the opposite surface of the electrode of a semiconductor chip mounted on a multilayer substrate. CONSTITUTION: An SLC layer 13, which is provided on the first surface of a multilayer substrate, is connected to a conductor path 25 provided in a through hole 5 whose inside is filled and electrically connected to a solder bump 22 provided on the opposite surface of the first surface through the conductor path 25. Therefore, the distance of the wiring length between the connecting terminal of a substrate chip and the solder bump can be shortened, and thus the noises can be decreased. At the same time, since the mounting distance between the chips can be shortened, the fact contributes to high integration degree. Furthermore, since the wiring of the SLC layer 13 is not blocked by the presence of the through hole, the freedom of the wiring design can be secured.

公开(公告)号：JPH08242077A

公开(公告)日：1996-09-17

申请号：JP2970495

申请日：1995-02-17

Applicant: IBM

Inventor： MIZUMOTO SHOGO ,  TSUKADA YUTAKA

IPC: H05K3/40 ,  H05K1/11 ,  H05K3/00 ,  H05K3/10 ,  H05K3/42 ,  H05K3/46

Abstract: PURPOSE: To electrically connect two or more layers to each other by a method, wherein there is formed a second insulation layer having a second via hole located directly above a first via hole, so as to come into contact with a first insulation layer. CONSTITUTION: A plating layer 330 made of a conductive layer is made in a first via hole 340, formed in a first insulation layer 310 on a board 300, and thereafter the first via hole 340 is filled with a metal, a metal paste, resin, etc. This filled surface is smoothed and another second insulation layer 320 is formed thereon, and in the second insulation layer 320, a second via hole 350 is formed substantially directly above the filled first via hole 340, and a plating layer 360 is formed on the second via hole 350. Thereby, two or more insulation layers 310, 320 can be connected electrically to each other.

公开(公告)号：JPH06338540A

公开(公告)日：1994-12-06

申请号：JP12913793

申请日：1993-05-31

Applicant: IBM

Inventor： TSUKADA YUTAKA ,  TSUCHIDA SHUHEI ,  MAEDA YOJI

IPC: H01L21/60 ,  H01L21/321

Abstract: PURPOSE: To provide a semiconductor chip, which is high in reliability, is easily mounted on a motherboard, has a low profile, is lightweight and is low in cost, a method of manufacturing the chip and a device mounted with such a semiconductor chip. CONSTITUTION: In a semiconductor device with a support substrate mounted with a semiconductor chip, a constant length of wires 5 are erected on pads 4 on a chip 3 by ball bonding. The base parts of the wires 5 are connected with the pads 4 as ball bonding parts 7. Ball parts 8, consisting of the same material as that for the wires, are respectively formed on the points of the wires 5 by a laser. These ball parts 8 are connected with pads 2 on a substrate 1 through each solder 6, to form the semiconductor device into a semiconductor device 10 mounted with the semiconductor chip 3.

公开(公告)号：JPH06275766A

公开(公告)日：1994-09-30

申请号：JP5723793

申请日：1993-03-17

Applicant: IBM

Inventor： TSUKADA YUTAKA ,  KOBAYAKAWA TAIICHI ,  MAEDA YOJI ,  TSUCHIDA SHUHEI

IPC: H01L23/50 ,  H01L23/498 ,  H05K1/18 ,  H05K3/34

Abstract: PURPOSE: To provide an electric connecting structure of a semiconductor device for simply electrically and simultaneously mechanically connecting effectively by using a plurality of fine leads at tabs on a substrate mounted with an IC chip and electrodes on a printed circuit board. CONSTITUTION: Leads 120 are fixed at front side and bottom of a substrate 100 via resin tapes 130, 132 and 134. The leads 120 are bent to have circular arc-like protrusions protruding from the same flat surface as the bottom of the substrate in the case of fixing them to the substrate, electrically connected to electrodes 115 on a printed circuit board 110 at the protrusion via solder or conductive adhesive 140, and simultaneously mechanically connected to the substrate and the printed circuit board.