公开(公告)号：MX2011012575A

公开(公告)日：2012-02-21

申请号：MX2011012575

申请日：2010-05-31

Applicant: INTEGRAN TECHNOLOGIES INC

Inventor： PALUMBO GINO ,  GONZALEZ FRANCISCO ,  TOMANTSCHGER KLAUS ,  MCCREA JONATHAN ,  PANAGIOTOPOULOS KONSTANTINOS ,  ERB UWE ,  FACCHINI DIANA ,  NAGARAJAN NANDAKUMAR ,  KATUGAHA HERATH ,  VICTOR JARED J

IPC: B32B15/08 ,  C23C16/06

Abstract: Se describen los artículos poliméricos con chapa metálica que contienen recubrimientos metálicos de grano fino y/o amorfos, estructurales/capas que contienen opcionalmente partículas sólidas dispersas en éste. Los recubrimientos metálicos de grano fino y/o amorfos son particularmente adecuados para artículos fuertes y de peso ligero, moldes de precisión, artículos deportivos, partes automovilísticas y componentes expuestos a los ciclos térmicos, aunque el coeficiente de expansión térmica lineal (CLTE) de la capa metálica y el sustrato no sean similares. La interfase entre la capa metálica y el polímero es adecuadamente pretratada para resistir los ciclos térmicos sin falla.

公开(公告)号：CA2674403A1

公开(公告)日：2009-06-25

申请号：CA2674403

申请日：2008-12-18

Applicant: INTEGRAN TECHNOLOGIES INC

Inventor： NAGARAJAN NANDAKUMAR ,  AUST KARL ,  TOMANTSCHGER KLAUS ,  BROOKS IAIN ,  LIN PETER ,  PALUMBO GINO ,  GONZALEZ FRANCISCO

IPC: C25D5/50

Abstract: Polycrystalline materials are prepared by electrodeposition of a precurso r material that is subsequently heat-treated to induce at least a threefold increase in the grain size of the material to yield a relatively high fracti on of 'special' low .SIGMA. grain boundaries and a randomized crystallograph ic texture. The precursor metallic material has sufficient purity and a fine -grained microstructure (e.g., an average grain size of 4 nm to 5 µm). The r esulting metallic material is suited to the fabrication of articles requirin g high mechanical or physical isotropy and/or resistance to grain boundary-m ediated deformation or degradation mechanisms.

公开(公告)号：ES2301666T3

公开(公告)日：2008-07-01

申请号：ES02754753

申请日：2002-06-25

Applicant: INTEGRAN TECHNOLOGIES INC

Inventor： PALUMBO GINO ,  BROOKS IAIN ,  MCCREA JONATHAN ,  HIBBARD GLENN D ,  GONZALEZ FRANCISCO ,  TOMANTSCHGER KLAUS

IPC: C25D1/04 ,  C25D5/02 ,  C25D5/06 ,  C25D5/18 ,  C25D5/20 ,  C25D7/04 ,  C25D15/02 ,  C25D17/00 ,  C25D21/12

Abstract: Un proceso para electrodepositar catódicamente un material metálico seleccionado sobre un sustrato permanente o temporal en forma nanocristalina con un tamaño de grano promedio de menos de 100 nm usando electrodeposición por impulsos a una velocidad de deposición de al menos 0,05 mm/h, que comprende: proporcionar un electrolito acuoso que contiene iones del material metálico, mantener el electrolito a una temperatura en el intervalo de entre 0 a 85° C, proporcionar un ánodo y un cátodo en contacto con dicho electrolito, hacer pasar uno sólo o múltiples impulsos de corriente catódica C.D. entre el ánodo y el cátodo a una frecuencia de impulso de corriente catódica en el intervalo de aproximadamente 0 y 1000 Hz, a intervalos de impulso durante los cuales la corriente pasa durante un periodo de tiempo tcontacto en el intervalo de aproximadamente 0,1 a 50 mseg y no pasa durante un periodo de tiempo treposo en el intervalo de aproximadamente 0 a 500 mseg, y hacer pasar uno solo o mútliples impulsos de corriente anódica C.D. entre el cátodo y el ánodo a intervalos durante los cuales la corriente pasa durante un periodo de tiempo tanódico en el intervalo de 0 a 50 mseg, estando un ciclo de trabajo en un intervalo del 5 al 100% y una carga catódica (Qcatódica) por intervalo siendo siempre mayor que una carga anódica (Qanódica).

公开(公告)号：DE10262102B4

公开(公告)日：2006-06-22

申请号：DE10262102

申请日：2002-06-25

Applicant: INTEGRAN TECHNOLOGIES INC

Inventor： PALUMBO GINO ,  ERB UWE ,  MCCREA JONATHAN ,  HIBBARD GLENN D ,  BROOKS IAIN ,  GONZALEZ FRANCISCO ,  TOMANTSCHGER KLAUS

IPC: C25D5/18

Abstract: A reinforcing metallic patch is electroplated to cover the degraded portion without covering the non-degraded portion of metallic workpiece, where the electrodeposited metal of metallic patch has an average grain size of 1000 nm or less. An independent claim is also included for process for in-situ electroforming structural reinforcing layer.

公开(公告)号：DE10228323A1

公开(公告)日：2004-01-29

申请号：DE10228323

申请日：2002-06-25

Applicant: INTEGRAN TECHNOLOGIES INC

Inventor： PALUMBO GINO ,  ERB UWE ,  MCCREA JONATHAN ,  HIBBARD GLENN D ,  BROOKS IAIN ,  GONZALEZ FRANCISCO ,  TOMANTSCHGER KLAUS

IPC: C25D5/02 ,  C25D5/06 ,  C25D5/18 ,  C25D7/04 ,  C25D15/02

Abstract: A reinforcing metallic patch is electroplated to cover the degraded portion without covering the non-degraded portion of metallic workpiece, where the electrodeposited metal of metallic patch has an average grain size of 1000 nm or less. An independent claim is also included for process for in-situ electroforming structural reinforcing layer.

公开(公告)号：EP1461470A4

公开(公告)日：2005-09-14

申请号：EP01989121

申请日：2001-11-26

Applicant: INTEGRAN TECHNOLOGIES INC

Inventor： PALUMBO GINO ,  AUST KARL T ,  LIMOGES DAVID L ,  GONZALEZ FRANCISCO ,  TOMANTSCHGER KLAUS ,  LIN PETER K

IPC: C22C11/06 ,  C22F1/00 ,  C22F1/12 ,  H01M4/68 ,  C22C11/00

Abstract: Recrystallized lead and lead alloy positive current collectors and connectors such as straps and lugs for use e.g. in lead acid batteries and electrowinning anodes, having an increased percentage of special grain boundaries in at least part of the microstructure, which have been provided by a process comprising of (i) cold or hot rolling or cold or hot extrusion or (ii) steps of deforming the lead or lead alloy, and subsequently annealing the lead or lead alloy. Either a single cycle of working and annealing can be provided, or a plurality of such cycles can be provided. The amount of deformation, the recrystallization time and temperature, and the number of repetitions of such steps are selected to ensure that a substantial increase in the population of special grain boundaries is provided in the microstructure, to improve resistance to creep, intergranular corrosion and intergranular cracking of the current collectors and connectors during battery service, and result in extended battery life and the opportunity to reduce the size and weight of the battery.

公开(公告)号：EP2438216A4

公开(公告)日：2012-11-14

申请号：EP10782857

申请日：2010-05-31

Applicant: INTEGRAN TECHNOLOGIES INC

Inventor： FACCHINI DIANA ,  GONZALEZ FRANCISCO ,  MCCREA JONATHAN ,  UETZ MIKE ,  PALUMBO GINO ,  TOMANTSCHGER KLAUS ,  NAGARAJAN NANDAKUMAR ,  VICTOR JARED J ,  ERB UWE

IPC: C25D3/12 ,  B32B15/01 ,  C22C19/07 ,  C25D3/56 ,  C25D7/00 ,  C25D15/00

CPC classification number: B32B15/01 ,  C22C19/07 ,  C25D3/12 ,  C25D3/562 ,  C25D15/00

Abstract: Free standing articles or articles at least partially coated with substantially porosity free, fine-grained and/or amorphous Co-bearing metallic materials optionally containing solid particulates dispersed therein, are disclosed. The electrodeposited metallic layers and/or patches comprising Co provide, enhance or restore strength, wear and/or lubricity of substrates without reducing the fatigue performance compared to either uncoated or equivalent thickness Cr coated substrate. The fine-grained and/or amorphous metallic coatings comprising Co are particularly suited for articles exposed to thermal cycling, fatigue and other stresses and/or in applications requiring anti-microbial and hydrophobic properties.

公开(公告)号：EP2222897A4

公开(公告)日：2012-04-04

申请号：EP08861084

申请日：2008-12-18

Applicant: INTEGRAN TECHNOLOGIES INC

Inventor： PALUMBO GINO ,  BROOKS IAIN ,  TOMANTSCHGER KLAUS ,  LIN PETER ,  AUST KARL ,  NAGARAJAN NANDAKUMAR ,  GONZALEZ FRANCISCO

IPC: C25D5/50

CPC classification number: C22F1/08 ,  C21D1/06 ,  C21D9/0068 ,  C25D3/12 ,  C25D3/38 ,  C25D5/50