公开(公告)号：WO2005066635A1

公开(公告)日：2005-07-21

申请号：PCT/US2004/043363

申请日：2004-12-24

Applicant: INTEL CORPORATION ,  RAO, Valluri ,  MA, Qing ,  YAMAKAWA, Mineo ,  BERLIN, Andrew ,  WANG, Li-Peng ,  ZHANG, Yuegang

Inventor： RAO, Valluri ,  MA, Qing ,  YAMAKAWA, Mineo ,  BERLIN, Andrew ,  WANG, Li-Peng ,  ZHANG, Yuegang

IPC: G01N33/543

CPC classification number: G01N33/54373 ,  B82Y15/00 ,  B82Y30/00 ,  G01N27/126 ,  G01N29/022 ,  G01N29/036 ,  G01N29/2437 ,  G01N29/348 ,  G01N33/0031 ,  G01N2291/02466 ,  G01N2291/0255 ,  G01N2291/0256 ,  G01N2291/0426 ,  Y10T436/11 ,  Y10T436/143333 ,  Y10T436/144444 ,  Y10T436/25375

Abstract: Systems and methods for detecting the presence of biomolecules in a sample using biosensors that incorporate resonators which have functionalized surfaces for reacting with target biomolecules. In one embodiment, a device includes a piezoelectric resonator having a functionalized surface configured to react with target molecules, thereby changing the mass and/or charge of the resonator which consequently changes the frequency response of the resonator. The resonator’s frequency response after exposure to a sample is compared to a reference, such as the frequency response before exposure to the sample, a stored baseline frequency response or a control resonator’s frequency response.

Abstract translation: 使用包含具有功能化表面以与靶生物分子反应的共振器的生物传感器来检测样品中存在生物分子的系统和方法。 在一个实施例中，器件包括压电谐振器，其具有被配置为与靶分子反应的官能化表面，从而改变谐振器的质量和/或电荷，从而改变谐振器的频率响应。 将曝光后的谐振器频率响应与参考值进行比较，例如在暴露于采样之前的频率响应，存储的基准频率响应或控制谐振器的频率响应。

公开(公告)号：WO2004062025A1

公开(公告)日：2004-07-22

申请号：PCT/US2003/038313

申请日：2003-12-03

Applicant: INTEL CORPORATION

Inventor： MA, Qing ,  HAYDEN III, Joseph ,  CHOU, Tsung-Kuan, Allen ,  TRAN, Quan

IPC: H01P3/00

CPC classification number: H01P11/003 ,  H01P3/003 ,  H05K1/0219 ,  H05K1/0237 ,  H05K3/243 ,  H05K2201/09236 ,  H05K2201/09736 ,  H05K2201/098

Abstract: Coplanar waveguides have a center signal line and a pair of ground lines on either side formed of a sputtered material such as gold (Au). Such waveguides are subject to what is known as the edge effect at high frequency operation causing currents to concentrate and flow along adjacent edges of the lines. Providing a thicker plated layer only on adjacent edges of the lines provide substantial performance improvements over sputtered lines alone while saving significant amount of Au, thus reducing costs.

Abstract translation: 共平面波导具有中心信号线，并且由诸如金（Au）的溅射材料形成的任一侧上的一对接地线。 这种波导在高频操作下受到所谓的边缘效应的影响，导致电流集中并沿着线的相邻边缘流动。 仅在线路的相邻边缘上提供较厚的镀层，从而在单独的溅射线路上提供显着的性能改进，同时节省大量的Au，从而降低成本。

公开(公告)号：WO2003083883A3

公开(公告)日：2003-10-09

申请号：PCT/US2003/003798

申请日：2003-02-07

Applicant: INTEL CORPORATION

Inventor： MA, Qing ,  BERRY, Michele ,  WONG, Daniel ,  RAO, Valluri ,  HECK, John

IPC: B81B7/00

Abstract: A MEMS device (14) may be formed in a hermetic cavity (42) by sealing a pair of semiconductor structures (22, 32) to one another, enclosing the MEMS device (12). The two structures (22, 32) may be coupled using surface mount techniques as one example, so that the temperatures utilized may be compatible with many MEMS applications. Electrical interconnection layers (40) in one or the other of these structures may be utilized to allow electrical interconnections from the exterior world to the MEMS components (14) within the cavity (42).

公开(公告)号：WO2002015266A3

公开(公告)日：2002-02-21

申请号：PCT/US2001/025060

申请日：2001-08-10

Applicant: INTEL CORPORATION

Inventor： MU, Xiao-Chun ,  MA, Qing ,  FUJIMOTO, Harry

IPC: H01L23/31

Abstract: A microelectronic package including a microelectronic die having an active surface and at least one side. An encapsulation material is disposed adjacent the microelectronic die side(s), wherein the encapsulation material includes at least one surface substantially planar to the microelectronic die active surface. A first dielectric material layer may be disposed on at least a portion of the microelectronic die active surface and the encapsulation material surface. At least one conductive trace is then disposed on the first dielectric material layer. The conductive trace(s) is in electrical contact with the microelectronic die active surface. At least one conductive trace extends adjacent the microelectronic die active surface and adjacent the encapsulation material surface.

公开(公告)号：WO2014098985A1

公开(公告)日：2014-06-26

申请号：PCT/US2013/046635

申请日：2013-06-19

Applicant: INTEL CORPORATION

Inventor： MA, Qing ,  EID, Feras ,  LIN, Kevin ,  SWAN, Johanna M. ,  TEH, Weng Hong ,  RAO, Valluri R.

IPC: G01C19/00 ,  G01C19/04 ,  G01P15/14 ,  B81C1/00

CPC classification number: G01C19/56 ,  G01C19/5776

Abstract: This invention relates to inductive inertial sensors employing a magnetic drive and/or sense architecture. In embodiments, translational gyroscopes utilize a conductive coil made to vibrate in a first dimension as a function of a time varying current driven through the coil in the presence of a magnetic field. Sense coils register an inductance that varies as a function of an angular velocity in a second dimension. In embodiments, the vibrating coil causes first and second mutual inductances in the sense coils to deviate from each other as a function of the angular velocity. In embodiments, self-inductances associated with a pair of meandering coils vary as a function of an angular velocity in a second dimension. In embodiments, package build-up layers are utilized to fabricate the inductive inertial sensors, enabling package-level integrated inertial sensing advantageous in small form factor computing platforms, such as mobile devices.

Abstract translation: 本发明涉及采用磁驱动和/或感测架构的感应惯性传感器。 在实施例中，平移陀螺仪利用在第一维度中制成的导电线圈作为在存在磁场的情况下驱动通过线圈的时变电流的函数。 感应线圈记录在第二维度上作为角速度的函数变化的电感。 在实施例中，振动线圈使得感测线圈中的第一和第二互感器作为角速度的函数彼此偏离。 在实施例中，与一对曲折线圈相关联的自感量作为第二维度中的角速度的函数而变化。 在实施例中，使用封装积层来制造感应惯性传感器，使得能够在诸如移动设备的小尺寸计算平台中有利的封装级集成惯性感测。

公开(公告)号：WO2014004067A1

公开(公告)日：2014-01-03

申请号：PCT/US2013/045026

申请日：2013-06-10

Applicant: INTEL CORPORATION

Inventor： LIN, Kevin, L. ,  MA, Qing ,  EID, Feras ,  SWAN, Johanna ,  TEH, Weng Hong

IPC: H01L25/07 ,  H01L25/065

CPC classification number: G01L9/0042 ,  B81B7/0058 ,  B81B7/0077 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2203/04 ,  B81C1/00246 ,  G01L9/0047 ,  G01L9/007 ,  G01L9/0073 ,  H01L24/19 ,  H01L29/84 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2924/1461 ,  H01L2924/18162

Abstract: A semiconductor package having an air pressure sensor and methods to form a semiconductor package having an air pressure sensor are described. For example, a semiconductor package includes a plurality of build-up layers. A cavity is disposed in one or more of the build-up layers. An air pressure sensor is disposed in the plurality of build-up layers and includes the cavity and an electrode disposed above the cavity. Also described are various approaches to fabricating a semiconductor package having a hermetically sealed region.

Abstract translation: 描述了具有空气压力传感器的半导体封装和形成具有气压传感器的半导体封装的方法。 例如，半导体封装包括多个堆积层。 空腔设置在一个或多个堆积层中。 空气压力传感器设置在多个积聚层中，并且包括空腔和设置在空腔上方的电极。 还描述了制造具有气密密封区域的半导体封装的各种方法。

公开(公告)号：WO2008002943A1

公开(公告)日：2008-01-03

申请号：PCT/US2007/072163

申请日：2007-06-26

Applicant: INTEL CORPORATION ,  MA, Qing ,  RAO, Valluri, R. ,  CHOU, Tsung-kuan, Allen

Inventor： MA, Qing ,  RAO, Valluri, R. ,  CHOU, Tsung-kuan, Allen

IPC: H01L27/115 ,  H01L21/8247

CPC classification number: B82Y10/00 ,  G11B9/04 ,  G11B9/1436 ,  G11B9/1472

Abstract: An apparatus comprising a substrate, a heater formed on the substrate, and a phase-change layer formed on the heater. The heater comprises a heater layer and first and second electrodes electrically coupled to the heater layer. A process comprising forming a heater on a substrate and forming a phase-change layer on the heater. The heater comprises a heater layer and first and second electrodes electrically coupled to the heater layer.

Abstract translation: 一种包括基板，形成在基板上的加热器和形成在加热器上的相变层的装置。 加热器包括加热器层和电耦合到加热器层的第一和第二电极。 一种方法，包括在基底上形成加热器并在加热器上形成相变层。 加热器包括加热器层和电耦合到加热器层的第一和第二电极。

公开(公告)号：WO2007005701A3

公开(公告)日：2007-01-11

申请号：PCT/US2006/025755

申请日：2006-06-29

Applicant: INTEL CORPORATION ,  MA, Qing ,  WANG, Li-Peng ,  RAO, Valluri

Inventor： MA, Qing ,  WANG, Li-Peng ,  RAO, Valluri

IPC: G01N29/02 ,  G01N29/036 ,  G01N33/543

Abstract: An FBAR device may be chemically functionalized by depositing an interactive layer so that targeted chemicals are preferentially adsorbed. Such miniaturized chemical sensors may be combined with wireless network technology. For example, a chemical sensor may be integrated in a cell phone, PDA, a watch, or a car with wireless connection and GPS. Since such devices are widely populated, a national sensor network may be established. Consequently, a national toxicity map can be generated in real time. Detailed chemical information may be obtained, such as if a chemical is released by a source fixed on ground or by a moving object, or if is spread by explosives or by wind and so on.

公开(公告)号：WO2006105528A1

公开(公告)日：2006-10-05

申请号：PCT/US2006/012602

申请日：2006-03-31

Applicant: INTEL CORPORATION ,  WANG, Li-Peng ,  MA, Qing ,  RAO, Valluri ,  PAUL, Goutam

Inventor： WANG, Li-Peng ,  MA, Qing ,  RAO, Valluri ,  PAUL, Goutam

IPC: G01H1/00

CPC classification number: G01H1/00

Abstract: An apparatus comprising a substrate and an array of vibration sensors formed on the substrate, the array comprising two or more vibration sensors, wherein each vibration sensor in the array has a different noise floor and a different operational frequency range than any of the other vibration sensors in the array. A process comprising forming an array of vibration sensors on a substrate, the array comprising two or more vibration sensors, wherein each of the two or more vibration sensors in the array has a different noise floor and a different operational frequency range than any of the other vibration sensors in the array. Other embodiments are disclosed and claimed.

Abstract translation: 一种包括衬底和形成在衬底上的振动传感器阵列的装置，该阵列包括两个或更多个振动传感器，其中阵列中的每个振动传感器具有与任何其它振动传感器不同的本底噪声和不同的工作频率范围 在阵列中。 一种方法，包括在衬底上形成振动传感器阵列，所述阵列包括两个或更多个振动传感器，其中所述阵列中的所述两个或更多个振动传感器中的每一个具有与其他任何其它振动传感器不同的本底噪声和不同的工作频率范围 阵列中的振动传感器。 公开和要求保护其他实施例。

公开(公告)号：WO2004008635A1

公开(公告)日：2004-01-22

申请号：PCT/US2003/022105

申请日：2003-07-11

Applicant: INTEL CORPORATION (a Delaware Corporation) (a Delaware Corporation)

Inventor： MA, Qing ,  SHIM, Dong

IPC: H03H9/02

CPC classification number: H03H9/0542 ,  H03H9/02779 ,  H03H9/6403

Abstract: Microelectromechanical system (MEMS) apparatus and methods for surface acoustic wave (SAW) switching are disclosed. The apparatus includes a piezoelectric substrate having spaced apart input and output SAW transducers. A MEMS switch is arranged between the input and output SAW transducers The MEMS switch has a deformable member in electromagnetic communication with one or more actuation electrodes formed on or above the substrate. The deformable member is deformable to mechanically contact the substrate to deflect or absorb a SAW generated by the input SAW transducer.

Abstract translation: 公开了用于表面声波（SAW）切换的微机电系统（MEMS）装置和方法。 该装置包括具有间隔开的输入和输出SAW换能器的压电基片。 MEMS开关布置在输入和输出SAW换能器之间MEMS开关具有与形成在基板上或上方的一个或多个致动电极电磁连通的可变形构件。 可变形构件可变形以机械地接触衬底以偏转或吸收由输入SAW换能器产生的SAW。