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公开(公告)号：US10440836B2
公开(公告)日：2019-10-08
申请号：US15138261
申请日：2016-04-26
Applicant: Kinsus Interconnect Technology Corp.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yi-Nong Lin
Abstract: Provided is a double layer circuit board and a manufacturing method thereof. The double layer circuit board comprises a substrate, a first circuit layer formed on a first surface of the substrate, a second circuit layer formed on a second surface of the substrate, and at least one connecting pillar formed in and covered by the substrate. Each one of the at least one connecting pillar includes a first end connected to the first circuit layer and a second end connected to the second circuit layer. A terminal area of the second end is greater than a terminal area of the first end. Therefore, the second circuit layer is firmly connected to the first circuit layer through the at least one connecting pillar. A yield rate of the double layer circuit board may be increased.
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公开(公告)号：US20190189335A1
公开(公告)日：2019-06-20
申请号：US16285138
申请日：2019-02-25
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yi-Nong Lin
CPC classification number: H01F27/2804 , H01F2027/2809 , H05K1/0393 , H05K1/113 , H05K1/118 , H05K1/165 , H05K3/4617 , H05K3/4644
Abstract: A buildup board structure incorporating magnetic induction coils and flexible boards is disclosed. The buildup board structure includes at least one first buildup unit or at least one second buildup unit. The first buildup unit includes at least one first buildup body, the second buildup unit includes at least one second buildup body. Any two adjacent buildup bodies are separated by a covering layer provided with a central hole for electrical insulation. All central holes are aligned. Each buildup body includes a plurality of flexible boards, and each flexible board is embedded with a plurality of magnetic induction coils surrounding the corresponding central hole and connected through connection pads. The first and/or second buildup bodies are easily laminated in any order by any number as desired such that the effect of magnetic induction provided by the magnetic induction coils embedded in the buildup board structure are addable to greatly enhance the overall effect of magnetic induction.
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公开(公告)号：US10256028B2
公开(公告)日：2019-04-09
申请号：US15086333
申请日：2016-03-31
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yi-Nong Lin
Abstract: A buildup board structure incorporating magnetic induction coils and flexible boards is disclosed. The buildup board structure includes at least one first, second and third buildup bodies modular and stackable. Any two adjacent buildup bodies are separated by a covering layer provided with a central hole for electrical insulation. All central holes are aligned. Each buildup body includes a plurality of flexible boards, and each flexible board is embedded with a plurality of magnetic induction coils surrounding the corresponding central hole and connected through connection pads. The first, second and third buildup bodies are easily laminated in any order by any number as desired such that the effect of magnetic induction provided by the magnetic induction coils embedded in the buildup board structure are addable to greatly enhance the overall effect of magnetic induction.
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公开(公告)号：US10039185B2
公开(公告)日：2018-07-31
申请号：US15130724
申请日：2016-04-15
Applicant: Kinsus Interconnect Technology Corp.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yi-Nong Lin
CPC classification number: H05K1/115 , H05K1/113 , H05K3/0047 , H05K3/0079 , H05K3/0094 , H05K3/108 , H05K3/18 , H05K3/429 , H05K3/4644 , H05K3/4647 , H05K2203/054 , Y10T29/49165
Abstract: Provided is a landless multilayer circuit board and a manufacturing method thereof. The manufacturing method includes steps of forming a first circuit on a first substrate, patterning a photoresist layer to form at least one via between the first circuit and a second circuit, forming at least one connecting pillar in the at least one via, removing the photoresist layer, forming a second substrate to cover the at least one connect pillar, and forming the second circuit on the second substrate. The second circuit is connected to the first circuit through the at least one connecting pillar. When the second circuit is formed, the at least one via does not need to be filled, thereby making the second circuit flat.
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Patent Agency Ranking
公开(公告)号：US20180132351A1
公开(公告)日：2018-05-10
申请号：US15863605
申请日：2018-01-05
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yi-Nong Lin
CPC classification number: H05K1/09 , H05K1/0298 , H05K1/144 , H05K3/4614 , H05K2201/0367 , H05K2201/042 , H05K2201/09472
Abstract: A multi-layer circuit board includes a first circuit board, conducting blocks, a second circuit board, and conducting recesses. The first circuit board has a first conductor layer mounted on the first circuit board. The conducting blocks are mounted on the first circuit board and electrically connected to the first conductor layer. The second circuit board has a second conductor layer mounted thereon and facing the first circuit board. The conducting recesses are formed in the second circuit board, electrically connected to the second conductor layer, and corresponding to the respective conducting blocks. The insulating layer is mounted between the first conductor layer and the second conductor layer. The second circuit board is on the first circuit board, the conducting blocks are respectively mounted in the conducting recesses to electrically connect the first conductor layer and the second conductor layer.
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公开(公告)号：US20170318671A1
公开(公告)日：2017-11-02
申请号：US15143354
申请日：2016-04-29
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yi-Nong Lin
CPC classification number: H05K1/09 , H05K1/0298 , H05K1/144 , H05K3/4614 , H05K2201/0367 , H05K2201/042 , H05K2201/09472
Abstract: A multi-layer circuit board includes a first circuit board, multiple conducting blocks, a second circuit board, and multiple conducting recesses. The first circuit board has a first conductor layer formed thereon. The conducting blocks are mounted on the first circuit board and electrically connected to the first conductor layer. The second circuit board has a second conductor layer mounted thereon and facing the first circuit board. The conducting recesses are formed in the surface of the second circuit board. Each conducting recess has a conducting layer electrically connected to the second conductor layer. When the conducting blocks are mounted in the conducting recesses, the first conductor layer and the second conductor layer are electrically connected through the conducting blocks and the conducting recesses. As can be separated from the first circuit board for test of the two conductor layers, the yield of the second circuit board is enhanced.
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公开(公告)号：US20170311443A1
公开(公告)日：2017-10-26
申请号：US15138261
申请日：2016-04-26
Applicant: Kinsus Interconnect Technology Corp.
Inventor： Ting-Hao LIN , Chiao-Cheng Chang , Yi-Nong Lin
CPC classification number: H05K3/42 , H05K1/0284 , H05K1/0296 , H05K1/112 , H05K3/007 , H05K3/4647 , H05K2201/0376 , H05K2203/0733 , H05K2203/1476 , Y10T29/49165
Abstract: Provided is a double layer circuit board and a manufacturing method thereof. The double layer circuit board comprises a substrate, a first circuit layer formed on a first surface of the substrate, a second circuit layer formed on a second surface of the substrate, and at least one connecting pillar formed in and covered by the substrate. Each one of the at least one connecting pillar includes a first end connected to the first circuit layer and a second end connected to the second circuit layer. A terminal area of the second end is greater than a terminal area of the first end. Therefore, the second circuit layer is firmly connected to the first circuit layer through the at least one connecting pillar. A yield rate of the double layer circuit board may be increased.
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公开(公告)号：US20170287617A1
公开(公告)日：2017-10-05
申请号：US15086333
申请日：2016-03-31
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yi-Nong Lin
CPC classification number: H01F27/2804 , H01F2027/2809 , H05K1/0393 , H05K1/113 , H05K1/118 , H05K1/165 , H05K3/4617 , H05K3/4644
Abstract: A buildup board structure incorporating magnetic induction coils and flexible boards is disclosed. The buildup board structure includes at least one first, second and third buildup bodies modular and stackable. Any two adjacent buildup bodies are separated by a covering layer provided with a central hole for electrical insulation. All central holes are aligned. Each buildup body includes a plurality of flexible boards, and each flexible board is embedded with a plurality of magnetic induction coils surrounding the corresponding central hole and connected through connection pads. The first, second and third buildup bodies are easily laminated in any order by any number as desired such that the effect of magnetic induction provided by the magnetic induction coils embedded in the buildup board structure are addable to greatly enhance the overall effect of magnetic induction.
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公开(公告)号：US20170103844A1
公开(公告)日：2017-04-13
申请号：US14877981
申请日：2015-10-08
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yi-Nong Lin
CPC classification number: H01F27/2804 , H01F41/041 , H01F2027/2809 , H05K1/00 , H05K1/165 , H05K3/00 , H05K3/4635 , H05K2201/09063
Abstract: A winged coil structure and a method of manufacturing the same are disclosed. The winged coil structure includes an upper flexible plate, at least one upper magnetic induction coil, at least one upper connection pad, a lower flexible plate, at least one lower magnetic induction coil, at least one lower connection pad, at least one gold finger, a dielectric layer and at least one connection plug. The connection plug connects the upper connection pad and the lower connection pad through thermal pressing such that the gold finger, the upper magnetic induction coil, the upper connection pad, the lower connection pad, the connection plug, the lower connection pad and the lower magnetic induction coil are electrically connected. The upper flexible plate is provided with notched lines to be easily bent without damage to the upper and lower magnetic induction coils. Thus, a bendable feature for magnetic induction coils is provided.
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