POLYAMIDE-IMIDE RESIN COMPOSITION
    22.
    发明专利

    公开(公告)号:JPH0253855A

    公开(公告)日:1990-02-22

    申请号:JP20371688

    申请日:1988-08-18

    Abstract: PURPOSE:To obtain a polyamide-imide resin composition having excellent properties of characteristic polyimide and excellent processing properties and/or low water absorption by blending a polyamide-imide with a specific amount of a specific polyimide. CONSTITUTION:(A) 100 pts.wt. aromatic polyamide-imide containing a repeating unit shown by formula I (Ar is trifunctional aromatic group containing one or more benzene rings; Z is bifunctional organic group), preferably one containing repeating units shown by formula II and formula III is blended with (B) >=1 pt.wt. - =2C aliphatic group, alicyclic group or monocyclic aromatic group), mixed in a dry state and kneaded in a molten state to give a composition.

    AROMATIC POLYESTER IMIDE RESIN COMPOSITION

    公开(公告)号:JPH01319565A

    公开(公告)日:1989-12-25

    申请号:JP15224788

    申请日:1988-06-22

    Abstract: PURPOSE:To obtain aromatic polyether imide-based resin composition for molding having excellent processability and improved heat resistance, chemical resistance and mechanical strength by blending specific thermoplastic polyimide to aromatic polyether imide. CONSTITUTION:(A) 100 pts.wt. aromatic polyether imide is blended with (B) 1-100 pts.wt. thermoplastic polyimide having repeating unit expressed by formula II (R is tetrafunctional group selected from >=2C aliphatic group, cycloaliphatic group or monocyclic aromatic group, etc.), obtained by imidizing of polyamic acid resulted from reaction of ether diamine expressed by formula I and at least one tetracarboxylic dianhydride, by, for instance, preliminary blending of A and B in Henschel mixer, etc., made to powdery, then mixed in molten state at 280-420 deg.C, preferably 300-400 deg.C with twin-screw melt extruder, etc., to afford the aimed aromatic polyether imide resin composition.

    POLYIMIDE-BASED RESIN COMPOSITION
    24.
    发明专利

    公开(公告)号:JPH01282260A

    公开(公告)日:1989-11-14

    申请号:JP11040688

    申请日:1988-05-09

    Abstract: PURPOSE:To obtain the subject composition excellent in heat and chemical resistance, mechanical strength and moldability by mixing a specified polyimide with a specified aromatic polyamideimide in a specified amount. CONSTITUTION:(A) 99.9-50wt.% polyimide expressed by formula III obtained by reacting an etherdiamine of formula I with a tetracarboxylic dianhydride of formula II (R is tetravalent group selected from noncondensed polycyclic aromatic groups where >=2C aliphatic group, cyclic aliphatic group, etc., are mutually connected directly or through crosslinking members) is blended with (B) 0.1-50wt.% aromatic polyamideimide expressed by formula IV (Ar is trivalent aromatic group containing at least one benzene ring; Z is divalent organic group).

    POLYIMIDE RESIN COMPOSITION
    25.
    发明专利

    公开(公告)号:JPH01279966A

    公开(公告)日:1989-11-10

    申请号:JP10908288

    申请日:1988-05-06

    Abstract: PURPOSE:To improve the heat resistance, mechanical strength, etc., without impairing the excellent characteristics inherent in polyimide by incorporating a specified amount of an aromatic polyamide-imide into a polyimide having specified repeating units. CONSTITUTION:The title composition is prepared by incorporating 0.1-50wt.% aromatic polyamide-imide (e.g., of formula II or III) into 99.9-50wt.% polyimide having repeating units of formula I (wherein R is a tetravalent group selected from among a 2C or higher aliphatic group, an alicyclic group, a monocyclic aromatic group, a condensed polycyclic aromatic group, etc.) This resin composition is suitably used in the field of aerospace equipment, etc. Said polyimide can be obtained by reacting an etherdiamine of formula IV with a tetracarboxylic acid dianhydride to give a polyamic acid and imidating this acid.

    POLYIMIDE RESIN COMPOSITION
    26.
    发明专利

    公开(公告)号:JPH01240565A

    公开(公告)日:1989-09-26

    申请号:JP6351888

    申请日:1988-03-18

    Abstract: PURPOSE:To obtain a polyimide resin for molding, having remarkably excellent moldability in addition to the excellent characteristic properties of polyimide, by compounding a specific thermoplastic polyimide with a specific amount of an aromatic polyether imide. CONSTITUTION:The objective polyimide resin composition is composed of (A) 99.5-5wt.% of a thermoplastic polyimide having the recurring unit of formula III and produced by reacting (i) an ether diamine of formula I (X is direct bond, 1-10C bivalent hydrocarbon group, hexafluorinated isopropylidene group, etc.; Y1-Y4 are H, lower alkyl, lower alkoxy, etc.) and a small amount of other diamine as an arbitrary component with (ii) one or more kinds of tetracarboxylic acid dianhydride of formula II (R is tetravalent group such as >=2C aliphatic group or cycloaliphatic group) and (B) 0.1-50wt.% of an aromatic polyether imide containing the group of formula IV (Z is trifunctional aromatic group bonding with adjacent carbon through two functional groups; Ar is bivalent aromatic group) as main recurring unit.

    POLYPHENYLENE SULFIDE-BASED RESIN COMPOSITION

    公开(公告)号:JPH01217065A

    公开(公告)日:1989-08-30

    申请号:JP4236088

    申请日:1988-02-26

    Abstract: PURPOSE:To obtain a resin composition having extremely improved heat resistance and mechanical strength in addition to the properties of polyphenylene sulfide, by mixing a polyphenylene sulfide with a specific amount of specific polyimide resin. CONSTITUTION:(A) 100 pts.wt. polyphenylene sulfide consisting of the repeating unit expressed by formula l is blended with (B) 1-100 pts.wt. polyimide resin consisting of the repeating unit expressed by formula II (R is tetrafunctional group selected from >=2C aliphatic group, alicyclic group and monocyclic aromatic group) obtained by dehydration and cyclization of polyamic acid prepared by reaction of 4,4'-bis[4-(4-aminophenoxy) phenoxyphenyl] sulfone and tetracarboxylic acid dianhydride. For instance, powder of A is dry-blended with powder of B and melt-blended by twin-screw extruder, etc., at 300-440 deg.C to afford the aimed composition.

    PRODUCTION OF POLYIMIDE OF GOOD PROCESSABILITY

    公开(公告)号:JPH01131239A

    公开(公告)日:1989-05-24

    申请号:JP28755387

    申请日:1987-11-16

    Abstract: PURPOSE:To obtain the title polymer with stabilized flowability at low temperature, having excellent processability, mechanical properties and thermal characteristics, by effecting the reaction between a tetracarboxylic dianhydride, an ether diamine, and a dicarboxylic anhydride. CONSTITUTION:(A) 1.0 mole of a tetracarboxylic dianhydride of formula I (R is aliphatic or aromatic) such as ethylenetetracarboxylic dianhydride is dissolved in an organic solvent such as N,N-dimethylformamide. Then, (B) 0.9-1.0 mole of an ether diamine of formula II (X is 1-10C hydrocarbon, carbonyl; Y1-Y4 are H, lower alkyl) such as bis [4-(3-aminophenoxy)phenyl] methane and (C) 0.001-1.0 mole of a dicarboxylic amhydride of formula III (Z is 1-10C aliphatic or alicyclic group) such as methylamine to give the subject polyimide having the recurring units of formula IV as a basal skeletal unit.

    POLYIMIDE
    29.
    发明专利

    公开(公告)号:JPS6411131A

    公开(公告)日:1989-01-13

    申请号:JP16691587

    申请日:1987-07-06

    Abstract: PURPOSE:To obtain a polyimide containing a specific recurring unit, having excellent heat resistance and thermoresistant adhesion as well as improved mechanical characteristics and capable of providing a base material for space and aircraft having good moldability. CONSTITUTION:The aimed polyimide having recurring units expressed by the formula and obtained by polymerizing bis[4-{4-(4-amino-alpha,alpha-dimethylbenzyl) phenoxy}phenyl]sulfone with 4,4-(p-phenylenedioxy)diphthalic anhydride and further subjecting the resultant polyamide to cycodehydration.

    POLYIMIDE AND HEAT-RESISTANT ADHESIVE COMPRISING SAME

    公开(公告)号:JPS649226A

    公开(公告)日:1989-01-12

    申请号:JP16394087

    申请日:1987-07-02

    Abstract: PURPOSE:To obtain a polyimide having excellent processability as well as excellent heat resistance inherent in polyimide, having a low water absorptivity and good transparency and being useful as a heat-resistant adhesive, comprising a specified ether diamine and a tetracarboxylic acid dianhydride. CONSTITUTION:This polyimide has repeating units of formula I (wherein R is a tetravalent group selected from among a 2C or higher aliphatic group, a cycloaliphatic group, a monocyclic aromatic group, a condensed polycyclic aromatic group and an noncondensed polycyclic aromatic group and a noncondensed polycyclic aromatic group composed of aromatic groups bonded together directly or through bridging members). Said polyimide can be obtained by effecting ring closure through dehydration of a polyamic acid obtained by polymerizing an ether diamine of formula II, namely, bis[4-{4-(4-aminophenoxy) phenoxy}phenyl]sulfone with at least one tetracarboxylic acid dianhydride.

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