Abstract:
PROBLEM TO BE SOLVED: To prevent the light loss caused by absorption of propagated light to a metal electrode of a light modulator, by matching the velocity of a microwave of the light modulator and to reduce a driving voltage. SOLUTION: The light modulator includes: a substrate 1 which is composed of an X plate or an offset X plate of electro-optical single crystal and has a thickness of ≤30 μm; a signal electrode 2 and grounding electrodes 3A and 3B provided on one principal surface 1a of the substrate 1; and modulating parts 6A and 6B which are formed in a gap between the signal electrode and the grounding electrodes and composed of intra-gap grooves 8 recessed from the principal surface 1a of the substrate and channel type optical waveguides provided in bottoms of the intra-gap grooves. A modulating voltage is applied to the signal electrode and the grounding electrodes to modulate light propagated in the modulating parts. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To use an optical device as a wavelength multiplexing optical terminal component excellent in characteristics and reliability without using optical transmission elements such as a lens and an optical waveguide. SOLUTION: The optical device 10A comprises an optical fiber installation part 12 where an optical fiber 24 is installed, a slit 26 formed so as to cross the optical axis of the optical fiber 24, and an optical branching member 30 which is inserted in the slit 26 and branches a part of signal light 28 transmitted in the optical fiber 24, and also comprises an optical branching part 14 for guiding the branch light 32 from the optical branching member 30 to the outside of the optical fiber 24, an optical path changing part 34 for changing the optical path of the branch light 32 guided to the outside of the optical fiber 24, a waveguide member 16 used as an outgoing medium for the optical path changing part 34, and a filter 18 formed on the surface of the waveguide member 16. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To improve the reliability of a monitor function for signal light by reducing an interference influence of light reflected by other parts on reflected light on a multi-layered surface of a filter member. SOLUTION: The surface of the filter member 20 on the side of the multi-layer film 56 is defined as a 1st surface 70, and the surface of the filter member 20 on the side of a quartz substrate 54 is defined as a 2nd surface 72; and the surface of the filter member 20 which faces the 1st surface is defined as a 1st internal wall surface 74 and the surface of the filter member 20 which faces the 2nd surface 72 is defined as a 2nd internal wall surface 76. In this case, one or more surfaces among a 1st internal wall surface 74 and a 2nd internal wall surface 76 of a slit 18 and the 2nd surface 72 of the filter member 20 are not parallel to the 1st surface 70 of the filter member 20. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To properly make alignment between arrays like the alignment between a laser diode array and an optical fiber array by measuring the quantity of the light generated from the first light module via the second light module, and aligning the first light module and the second light module. SOLUTION: A laser diode array 2 held by a chuck section 13 is moved in the direction Y and the direction Z by the first moving device 21, a fiber array 3 held by a chuck section 34 is moved in the direction Z and rotated in the direction of θZ by the second moving device 51, and both arrays 2, 3 are kept in contact with each other. The light quantity is measured by a photodiode array connected to the fiber array 3, and the laser diode array 2 and fiber array 3 are aligned. A controller 60 controls the actions of individual devices and controls all actions at the time of aligning.
Abstract:
A handle substrate of a composite substrate for a semiconductor is provided. The handle substrate is composed of polycrystalline alumina. The handle substrate includes an outer peripheral edge part with an average grain size of 20 to 55 µm and a central part with an average grain size of 10 to 50 µm. The average grain size of the outer peripheral edge part is 1.1 times or more and 3.0 times or less of that of the central part of the handle substrate.
Abstract:
It is provided an insulating substrate including through holes for conductors arranged in the insulating substrate. A thickness of the insulating substrate is 25 to 100 µ m, and a diameter of the through hole is 20 to 100 µ m. The insulating substrate includes a main body part and exposed regions exposed to the through holes and is composed an alumina sintered body. A relative density of the alumina sintered body is 99.5 percent or higher. The alumina sintered body has a purity of 99.9 percent or higher, and has an average grain size of 3 to 6 µ m in said main body part. Alumina grains are plate-shaped in the exposed region and the plate-shaped alumina grains have an average length of 8 to 25 µ m.
Abstract:
It is provided a handle substrate of a composite substrate for a semiconductor. The handle substrate is composed of a translucent polycrystalline alumina. A purity of alumina of the translucent polycrystalline alumina is 99.9% or higher, an average of a total forward light transmittance of the translucent polycrystalline alumina is 60% or higher in a wavelength range of 200 to 400 nm, and an average of a linear light transmittance of the translucent polycrystalline alumina is 15% or lower in a wavelength range of 200 to 400 nm.