公开(公告)号：US20220020708A1

公开(公告)日：2022-01-20

申请号：US16916644

申请日：2020-07-17

Applicant: Northrop Grumman Systems Corporation

Inventor： Dah-Weih Duan ,  Elizabeth T. Kunkee ,  Stephane Larouche

IPC: H01L23/66 ,  H01P1/203

Abstract: An exemplary semiconductor technology implemented channelized filter includes a dielectric substrate with semiconductor fabricated metal traces on one surface, and input and output ports. A signal trace connected between the input and output port carries the signal to be filtered. Filter traces connect at intervals along the length of the signal trace to provide a reactance that varies with frequency. Ground traces provide a reference ground. A silicon enclosure with semiconductor fabricated cavities has a metal layer deposited over it. The periphery of the enclosure is dimensioned to engage corresponding ground traces about the periphery of the substrate. Walls of separate cavities enclose each of the filter traces to individually surround each thereby providing electromagnetic field isolation. Metal-to-metal conductive bonds are formed between cavity walls that engage the ground traces to establish a common reference ground. The filter traces preferably meander to minimize the footprint area of the substrate.

公开(公告)号：US20170310028A1

公开(公告)日：2017-10-26

申请号：US15648593

申请日：2017-07-13

Applicant: Northrop Grumman Systems Corporation

Inventor： Charles M. Jackson ,  Elizabeth T. Kunkee

IPC: H01R12/71 ,  H01R12/91 ,  H01R12/70 ,  B33Y10/00 ,  B33Y80/00

CPC classification number: H01R12/714 ,  B33Y10/00 ,  B33Y80/00 ,  H01L21/4853 ,  H01L23/49811 ,  H01R12/52 ,  H01R12/7005 ,  H01R12/91 ,  H01R13/2428 ,  H05K1/144 ,  H05K3/4007 ,  H05K2201/042 ,  H05K2201/09754

Abstract: An exemplary miniature support has upper and lower spaced-apart engagement surfaces each having at least a portion that are parallel to each other. Two supports each with an end supporting the upper engagement surface and another end supporting the lower engagement surface. The two supports have a spring-like property so that the upper and lower engagement surfaces can repeatedly move between an uncompressed state when not engaged to provide an interconnection and a compressed state when engaged between two opposing boards to provide an interconnection between the boards. The connector is preferably made using 3-D printing and may be integrally made as part of a board also made using the same 3-D printing. The support may have upper and lower engagement surfaces and at least one of the at least two supports that are conductive to establish connectivity between the upper and lower engagement surfaces.

公开(公告)号：US09801269B1

公开(公告)日：2017-10-24

申请号：US15150834

申请日：2016-05-10

Applicant: Northrop Grumman Systems Corporation

Inventor： Charles M. Jackson ,  Elizabeth T. Kunkee

IPC: H05K1/11 ,  H05K1/14 ,  H05K1/02 ,  H01P3/08 ,  H01P3/06

CPC classification number: H05K1/025 ,  H01R12/523 ,  H01R12/714 ,  H01R13/2407 ,  H05K1/0222 ,  H05K1/0242 ,  H05K1/144 ,  H05K3/184 ,  H05K3/326 ,  H05K3/365 ,  H05K3/4015 ,  H05K3/4092 ,  H05K3/467 ,  H05K3/4679 ,  H05K2201/0311 ,  H05K2201/0397 ,  H05K2201/042 ,  H05K2201/09663 ,  H05K2201/09672 ,  H05K2201/0979 ,  H05K2201/09809 ,  H05K2201/10257 ,  H05K2201/10378

Abstract: A resilient electrical connector assembly includes a base PCB and stacked layers of interconnected resilient conductive structures where each structure has at least two resilient conductive strips and at least two conductive contacts. One contact is integrated with a conductive path on the base PCB and another contact pad is positioned to establish a conductive path with a target PCB when the latter is mounted parallel to the base PCB. The resilient conductive strips flex due to a compressive force exerted between the base PCB and target PCB on the stacked layers. The resilient conductive structures are formed by depositing metal to sequentially form each of the stacked layers with one contact being initially formed in engagement with the conductive path on the base PCB.

公开(公告)号：US20170187167A1

公开(公告)日：2017-06-29

申请号：US15458375

申请日：2017-03-14

Applicant: Northrop Grumman Systems Corporation

Inventor： Robert R. Rice ,  Elizabeth T. Kunkee

IPC: H01S5/22 ,  H01S5/065 ,  H01S5/20 ,  H01S5/028

CPC classification number: H01S5/22 ,  H01L21/265 ,  H01L21/425 ,  H01L21/76825 ,  H01L45/165 ,  H01L51/105 ,  H01S5/02469 ,  H01S5/0287 ,  H01S5/0425 ,  H01S5/0655 ,  H01S5/1014 ,  H01S5/1053 ,  H01S5/1064 ,  H01S5/2036 ,  H01S2301/166

Abstract: One embodiment is a wide stripe semiconductor waveguide, which is cleaved at a Talbot length thereof, the wide stripe semiconductor waveguide having facets with mirror coatings. A system provides for selective pumping the wide stripe semiconductor waveguide to create and support a Talbot mode. In embodiments according to the present method and apparatus the gain is patterned so that a single unique pattern actually has the highest gain and hence it is the distribution that oscillates.

公开(公告)号：US09640948B2

公开(公告)日：2017-05-02

申请号：US15151538

申请日：2016-05-11

Applicant: Northrop Grumman Systems Corporation

Inventor： Robert R. Rice ,  Elizabeth T. Kunkee

IPC: H01L21/44 ,  H01S5/22 ,  H01S5/042 ,  H01S5/024 ,  H01S5/028 ,  H01S5/065 ,  H01S5/10 ,  H01S5/20

CPC classification number: H01S5/22 ,  H01L21/265 ,  H01L21/425 ,  H01L21/76825 ,  H01L45/165 ,  H01L51/105 ,  H01S5/02469 ,  H01S5/0287 ,  H01S5/0425 ,  H01S5/0655 ,  H01S5/1014 ,  H01S5/1053 ,  H01S5/1064 ,  H01S5/2036 ,  H01S2301/166

Abstract: One embodiment is a wide stripe semiconductor waveguide, which is cleaved at a Talbot length thereof, the wide stripe semiconductor waveguide having facets with mirror coatings. A system provides for selective pumping the wide stripe semiconductor waveguide to create and support a Talbot mode. In embodiments according to the present method and apparatus the gain is patterned so that a single unique pattern actually has the highest gain and hence it is the distribution that oscillates.