公开(公告)号：US20140319630A1

公开(公告)日：2014-10-30

申请号：US14265053

申请日：2014-04-29

Applicant: STMicroelectronics S.r.l.

Inventor： Sebastiano Conti ,  Matteo Perletti ,  Roberto Carminati ,  Lorenzo Baldo ,  Alessandro Morcelli

IPC: H04R19/00

CPC classification number: H04R19/005 ,  H01L29/84 ,  H04R1/04 ,  H04R19/04

Abstract: An assembly of a MEMS sensor device envisages: a first die, integrating a micromechanical detection structure and having an external main face; a second die, integrating an electronic circuit operatively coupled to the micromechanical detection structure, electrically and mechanically coupled to the first die and having a respective external main face. Both of the external main faces of the first die and of the second die are set in direct contact with an environment external to the assembly, without interposition of a package.

Abstract translation: MEMS传感器装置的组件设想：第一管芯，集成微机械检测结构并具有外部主面; 集成了可操作地耦合到微机械检测结构的电子电路，电和机械耦合到第一管芯并且具有相应的外部主面。 第一模具和第二模具的外部主面都被设置成与组件外部的环境直接接触，而不插入封装件。

公开(公告)号：US10288874B2

公开(公告)日：2019-05-14

申请号：US15293061

申请日：2016-10-13

Applicant: STMicroelectronics S.r.l.

Inventor： Roberto Carminati ,  Sebastiano Conti ,  Sonia Constantini

IPC: G02B26/08 ,  H04N5/225 ,  G02B26/10 ,  H04N13/211 ,  H04N13/236 ,  H04N13/254 ,  G01B11/25 ,  G03B21/00

Abstract: A mirror micromechanical structure has a mobile mass carrying a mirror element. The mass is drivable in rotation for reflecting an incident light beam with a desired angular range. The mobile mass is suspended above a cavity obtained in a supporting body. The cavity is shaped so that the supporting body does not hinder the reflected light beam within the desired angular range. In particular, the cavity extends as far as a first side edge wall of the supporting body of the mirror micromechanical structure. The cavity is open towards, and in communication with, the outside of the mirror micromechanical structure at the first side edge wall.

公开(公告)号：US20190120710A1

公开(公告)日：2019-04-25

申请号：US16220498

申请日：2018-12-14

Applicant: STMicroelectronics S.R.L.

Inventor： Enri Duqi ,  Sebastiano Conti ,  Sonia Costantini

IPC: G01L9/00 ,  G01L9/06 ,  B81C1/00 ,  B81B7/00

Abstract: A pressure sensor designed to detect a value of ambient pressure of the environment external to the pressure sensor includes: a first substrate having a buried cavity and a membrane suspended over the buried cavity; a second substrate having a recess, hermetically coupled to the first substrate so that the recess defines a sealed cavity the internal pressure value of which provides a pressure-reference value; and a channel formed at least in part in the first substrate and configured to arrange the buried cavity in communication with the environment external to the pressure sensor. The membrane undergoes deflection as a function of a difference of pressure between the pressure-reference value in the sealed cavity and the ambient-pressure value in the buried cavity.

公开(公告)号：US09975756B2

公开(公告)日：2018-05-22

申请号：US15276613

申请日：2016-09-26

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Enri Duqi ,  Sebastiano Conti ,  Lorenzo Baldo ,  Flavio Francesco Villa

IPC: G01L9/00 ,  H01L21/00 ,  B81B7/00 ,  B81C1/00 ,  B81B3/00

CPC classification number: B81B7/0038 ,  B81B3/0086 ,  B81B7/0019 ,  B81B7/0061 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2207/012 ,  B81C1/00269

Abstract: A micro-electro-mechanical pressure sensor device, formed by a cap region and by a sensor region of semiconductor material. An air gap extends between the sensor region and the cap region; a buried cavity extends underneath the air gap, in the sensor region, and delimits a membrane at the bottom. A through trench extends within the sensor region and laterally delimits a sensitive portion housing the membrane, a supporting portion, and a spring portion, the spring portion connecting the sensitive portion to the supporting portion. A channel extends within the spring portion and connects the buried cavity to a face of the second region. The first air gap is fluidically connected to the outside of the device, and the buried cavity is isolated from the outside via a sealing region arranged between the sensor region and the cap region.

公开(公告)号：US09096424B2

公开(公告)日：2015-08-04

申请号：US14312307

申请日：2014-06-23

Applicant: STMicroelectronics S.r.l.

Inventor： Sebastiano Conti ,  Benedetto Vigna ,  Mario Francesco Cortese

IPC: H04R25/00 ,  B81C1/00 ,  B81B7/00 ,  H04R1/28 ,  H04R19/00 ,  H04R19/04 ,  B81B3/00 ,  H04R1/04 ,  H04R1/06 ,  H04R1/08

CPC classification number: B81C1/00158 ,  B81B3/0018 ,  B81B7/0061 ,  B81B2201/0257 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48479 ,  H01L2924/00014 ,  H01L2924/16151 ,  H01L2924/16152 ,  H04R1/04 ,  H04R1/06 ,  H04R1/086 ,  H04R1/2838 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003 ,  H01L2224/48471 ,  H01L2224/4554 ,  H01L2924/00012

Abstract: A microelectromechanical-acoustic-transducer assembly has: a first die integrating a MEMS sensing structure having a membrane, which has a first surface in fluid communication with a front chamber and a second surface, opposite to the first surface, in fluid communication with a back chamber of the microelectromechanical acoustic transducer, is able to undergo deformation as a function of incident acoustic-pressure waves, and faces a rigid electrode so as to form a variable-capacitance capacitor; a second die, integrating an electronic reading circuit operatively coupled to the MEMS sensing structure and supplying an electrical output signal as a function of the capacitive variation; and a package, housing the first die and the second die and having a base substrate with external electrical contacts. The first and second dice are stacked in the package and directly connected together mechanically and electrically; the package delimits at least one of the front and back chambers.

Abstract translation: 微机电声换能器组件具有：集成具有膜的MEMS感测结构的第一模具，其具有与前室相反流体连通的第一表面和与第一表面相对的第二表面，其与背面流体连通 微机电声换能器的腔室能够经受作为入射声压波函数的变形，并且面向刚性电极以形成可变电容电容器; 集成了可操作地耦合到MEMS感测结构并且提供作为电容变化的函数的电输出信号的电子阅读电路; 以及包装体，其容纳所述第一模具和所述第二模具，并且具有带有外部电触点的基底基板。 第一和第二骰子堆叠在包装中并机械和电气直接连接在一起; 该包装限定前室和后室中的至少一个。

公开(公告)号：US20130334627A1

公开(公告)日：2013-12-19

申请号：US13916416

申请日：2013-06-12

Applicant: STMicroelectronics International N.V. ,  STMicroelectronics S.r.l.

Inventor： Sebastiano Conti ,  Benedetto Vigna

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/0021 ,  B81C1/00158 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/16151 ,  H01L2924/16152 ,  H04R19/005 ,  H01L2924/00014

Abstract: Described herein is a semiconductor integrated device assembly, which envisages: a package defining an internal space; a first die including semiconductor material; and a second die, distinct from the first die, also including semiconductor material; the first die and the second die are coupled to an inner surface of the package facing the internal space. The second die is shaped so as to partially overlap the first die, above the inner surface, with a portion suspended in cantilever fashion above the first die, by an overlapping distance.

Abstract translation: 这里描述的是一种半导体集成器件组件，其设想为：限定内部空间的封装; 包括半导体材料的第一裸片; 以及与第一模具不同的第二模具，还包括半导体材料; 第一模具和第二模具耦合到面向内部空间的封装的内表面。 第二模具成形为使得第一模具在内表面上部分地以悬臂方式悬挂在第一模具上方的部分重叠距离。

公开(公告)号：US11353503B2

公开(公告)日：2022-06-07

申请号：US16451660

申请日：2019-06-25

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Paolo Aranzulla ,  Fabiano Frigoli ,  Massimo Greppi ,  Marco Camerani ,  Sebastiano Conti ,  Guglielmo Roccasalvo ,  Enrico Rosario Alessi ,  Massimiliano Pesaturo

IPC: G01R31/28 ,  G01M3/32

Abstract: A method for testing the hermetic seal of a packaged device, which includes: a package that delimits a device chamber; and a transducer device, which is arranged within the device chamber and generates an electrical signal indicating at least one physical quantity external to the package. The testing method includes the steps of: imposing a reference pressure in the device chamber; arranging the packaged device in a testing chamber in which a testing pressure is present, different from the reference pressure; and subsequently detecting possible pressure variations within the device chamber.

公开(公告)号：US11254561B2

公开(公告)日：2022-02-22

申请号：US16730480

申请日：2019-12-30

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Enri Duqi ,  Bruno Murari ,  Sebastiano Conti

IPC: H01L29/82 ,  B81B3/00 ,  B81B7/00

Abstract: A packaged pressure sensor, comprising: a MEMS pressure-sensor chip; and an encapsulating layer of elastomeric material, in particular PDMS, which extends over the MEMS pressure-sensor chip and forms a means for transferring a force, applied on a surface thereof, towards the MEMS pressure-sensor chip.

公开(公告)号：US10962431B2

公开(公告)日：2021-03-30

申请号：US16220498

申请日：2018-12-14

Applicant: STMicroelectronics S.R.L.

Inventor： Enri Duqi ,  Sebastiano Conti ,  Sonia Costantini

IPC: G01L9/00 ,  G01L9/06 ,  B81B7/00 ,  B81C1/00

Abstract: A pressure sensor designed to detect a value of ambient pressure of the environment external to the pressure sensor includes: a first substrate having a buried cavity and a membrane suspended over the buried cavity; a second substrate having a recess, hermetically coupled to the first substrate so that the recess defines a sealed cavity the internal pressure value of which provides a pressure-reference value; and a channel formed at least in part in the first substrate and configured to arrange the buried cavity in communication with the environment external to the pressure sensor. The membrane undergoes deflection as a function of a difference of pressure between the pressure-reference value in the sealed cavity and the ambient-pressure value in the buried cavity.

公开(公告)号：US10101578B2

公开(公告)日：2018-10-16

申请号：US15368184

申请日：2016-12-02

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Roberto Carminati ,  Enri Duqi ,  Sebastiano Conti

IPC: H04N3/08 ,  G02B26/08 ,  B81B3/00 ,  H04N9/31

Abstract: A micro-electro-mechanical device, wherein a platform is formed in a top substrate and is configured to turn through a rotation angle. The platform has a slit and faces a cavity. A plurality of integrated photodetectors is formed in a bottom substrate so as to detect the light through the slit and generate signals correlated to the light through the slit. The area of the slit varies with the rotation angle of the platform and causes diffraction, more or less marked as a function of the angle. The difference between the signals of two photodetectors arranged at different positions with respect to the slit yields the angle.