Abstract:
Structure (10) integrated on a semiconductor substrate (11) comprising at least one elementary Peltier cell which comprises: a conductive region (15) formed in the semiconductor substrate (11) being less resistive with respect to the semiconductor substrate (11), a first semiconductive region (19) projecting from the semiconductor substrate (11) in electric contact with the conductive region (15), a second semiconductive region (23) projecting from the semiconductor substrate (11) in electric contact with the conductive region (15) and spaced from the first semiconductive region (19), the first semiconductive region (19) and the second semiconductive region (23) having different type of conductivity.
Abstract:
It is described a device (100) for emitting optical radiation integrated on a substrate (1) of semiconductor material, comprising: - an active means layer (10) comprising a main area (30) generating the radiation, - a first (7) and second (11) electro-conductive layers for an electric signal generating an electric field to which an exciting current is associated, - a dielectric region (8') included between said first (7) and second (11) layers in order to space corresponding peripheral portions of said first (7) and second (11) layers from each other such that the electric field being present in the main area is higher than the one being present between said peripheral portions thus facilitating a corresponding generation of the exciting current in the main area (30).
Abstract:
Method for realising a sensor device (20) suitable for detecting the presence of chemical substances and comprising, as detection element, an active film (24) of metallic nanoparticles able to interact with the chemical substances to determine a variation of the global electric conductivity of the film (24). The method comprises the steps of preparing an ink comprising a solution of metallic nanoparticles, and depositing the obtained ink on a supporting substrate (26) by means of ink-jet printing so as to form the active film (24).
Abstract:
Monolithically integrated pressure sensors of outstanding quality and versatility are produced through micromechanical surface structures definition techniques. A microphonic cavity in the semiconductor substrate is monolithically formed by cutting by plasma etching the front side or the back side of the silicon wafer a plurality of trenches or holes deep enough to extend for at least part of its thickness into a purposely made doped buried layer of opposite type of conductivity of the substrate and of the epitaxial layer grown over it; electrochemically etching through such trenches, the silicon of the buried layer with an electrolytic solution suitable for selectively etching the doped silicon of said opposite type of conductivity, making the silicon of the buried layer porous; and oxidizing and leaching away the silicon so made porous. Preferably, the trenches or holes for accessing the doped buried layer are cut through the epitaxial layer and not through the rear of the monocrystalline silicon substrate thus avoiding the burden of precisely aligning the mask on the rear surface with the masks that are used on the front surface of the substrate. Moreover, the thickness of the substrate is normally much greater than that of the epitaxial layer and thus the need to cut relatively deep and narrow trenches requiring the use of special plasma etching equipment is avoided.
Abstract:
The invention relates to a method and an isolation device for providing optimum galvanic isolation between two low-voltage electronic devices (A,B), with the devices (A,B) being optically coupled together. The isolation device is essentially an opto-electronic integrated structure comprising a waveguide (17) that is formed between two separate circuit portions integrated in respective regions (13,13') of the same semiconductor substrate. Thus, the circuit portions (A,B) are fully galvanically isolated from each other, while the optical signal is transmitted therebetween through an integrated waveguide that is photolithographically patterned in the semiconductor.
Abstract:
A process for forming a thin layer of Silicon nanocrystals in an oxide layer is disclosed. The process comprises, on a semiconductive substrate, thermally oxidizing a first portion of the substrate into an oxide layer, forming Silicon ions within the layer of oxide, and thermally treating the Silicon ions to become the thin layer of Silicon nanocrystals. In the inventive process the formation of the Silicon ions is by ionic implantation of the Silicon ions into the oxide at an ionization energy of between .1 keV and 7keV, and preferably between 1 and 5 keV. This allows the Silicon atoms to coalesce in a lower temperature than would otherwise be possible. Additionally, more than one layer of nanocrystals can be formed by performing more than one implantation at more than one energy level. Embodiments of the invention can be used to form non-volatile memory devices with a very high quality having a very small size.