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    PACKAGED PRESSURE SENSOR DEVICE AND CORRESPONDING METHOD FOR DETECTING THE PRESENCE OF FOREIGN MATERIAL
    21.
    发明公开
    PACKAGED PRESSURE SENSOR DEVICE AND CORRESPONDING METHOD FOR DETECTING THE PRESENCE OF FOREIGN MATERIAL 审中-公开

    公开(公告)号：EP4242619A1

    公开(公告)日：2023-09-13

    申请号：EP23154620.1

    申请日：2023-02-02

    Applicant: STMicroelectronics S.r.l.

    Inventor： GIUSTI, Domenico ,  DUQI, Enri

    IPC: G01L19/06 ,  G01L19/14 ,  G01L27/00 ,  G01N9/24

    Abstract: A pressure sensor device (1) has: a pressure detection structure (2) provided in a first die (4) of semiconductor material; a package (20), configured to internally accommodate the pressure detection structure in an impermeable manner, the package having a base structure (21) and a body structure (22), arranged on the base structure, with an access opening (30) in contact with an external environment and internally defining a housing cavity (23), in which the first die (4) is arranged covered with a coating material (32). A piezoelectric transduction structure (35), of a ultrasonic type, is accommodated in the housing cavity, in order to allow detection of foreign material (42) above the coating material and within the package. In particular, the piezoelectric transduction structure (35) is integrated in the first die (4), which comprises a first portion (4'), wherein the pressure detection structure (2) is integrated, and a second portion (4"), separate and distinct from the first portion (4'), wherein the piezoelectric transduction structure (35) is integrated.

    MEMS ULTRASONIC TRANSDUCER DEVICE WITH IMPROVED DAMPING OF THE OSCILLATIONS OF A MEMBRANE OF THE SAME, AND MANUFACTURING PROCESS OF THE SAME
    22.
    发明公开
    MEMS ULTRASONIC TRANSDUCER DEVICE WITH IMPROVED DAMPING OF THE OSCILLATIONS OF A MEMBRANE OF THE SAME, AND MANUFACTURING PROCESS OF THE SAME 审中-公开

    公开(公告)号：EP4183490A1

    公开(公告)日：2023-05-24

    申请号：EP22206037.8

    申请日：2022-11-08

    Applicant: STMicroelectronics S.r.l.

    Inventor： GIUSTI, Domenico ,  FERRERA, Marco ,  TENTORI, Lorenzo

    IPC: B06B1/06

    Abstract: MEMS ultrasonic transducer, MUT, device (1), comprising a semiconductor body (3) with a first (3A) and a second (3B) main surface and including: a first chamber (15) extending into the semiconductor body (3) at a distance from the first main surface (3A); a membrane (18) formed by the semiconductor body (3) between the first main surface (3A) and the first chamber (15); a piezoelectric element (19) on the membrane (18); a second chamber (20) extending into the semiconductor body (3) between the first chamber (15) and the second main surface (3B); a central fluidic passage (22) extending into the semiconductor body (3) from the second main surface (3B) to the first chamber (15) and traversing the second chamber (20); and one or more lateral fluidic passages (21) extending into the semiconductor body (3) from the second main surface (3B) to the second chamber (20). The one or more lateral fluidic passages (21), the central fluidic passage (22) and the second chamber (20) define a fluidic recirculation path that fluidically connects the first chamber (15) with the outside of the semiconductor body (3).

    MEMS ACTUATOR AND MANUFACTURING PROCESS THEREOF
    23.
    发明公开
    MEMS ACTUATOR AND MANUFACTURING PROCESS THEREOF 审中-公开

    公开(公告)号：EP4148016A1

    公开(公告)日：2023-03-15

    申请号：EP22192423.6

    申请日：2022-08-26

    Applicant: STMicroelectronics S.r.l.

    Inventor： GIUSTI, Domenico ,  LAZZARI, Carla Maria

    IPC: B81B3/00

    Abstract: MEMS actuator (10) comprising: a semiconductor body (12) with a first surface (12a), defining a housing cavity (22) facing the first surface (12a) and having a bottom surface (22a), the semiconductor body (12) further defining a fluidic channel (25) in the semiconductor body (12) with a first end (25') across the bottom surface (22a); and a strainable structure (20) which extends into the housing cavity (22), is coupled to the semiconductor body (12) at the bottom surface (22a), and defines an internal space (24) facing the first end (25') of the fluidic channel (25) and comprising at least a first and a second internal subspace (26', 26") connected to each other and to the fluidic channel (25). When a fluid is pumped through the fluidic channel (25) into the internal space (24), the first and second internal subspaces (26', 26") expand straining the strainable structure (20) along the first axis (Z) and generating an actuation force (F att ) exerted by the strainable structure (20) along the first axis (Z), in the opposite direction with respect to the housing cavity (22).

    MICROPUMP MEMS DEVICE FOR MOVING OR EJECTING A FLUID, IN PARTICULAR MICROBLOWER OR FLOWMETER
    25.
    发明公开
    MICROPUMP MEMS DEVICE FOR MOVING OR EJECTING A FLUID, IN PARTICULAR MICROBLOWER OR FLOWMETER 审中-公开

    公开(公告)号：EP3726056A1

    公开(公告)日：2020-10-21

    申请号：EP20169715.8

    申请日：2020-04-15

    Applicant: STMicroelectronics S.r.l.

    Inventor： GIUSTI, Domenico ,  BALDO, Lorenzo ,  DUQI, Enri

    IPC: F04B43/04 ,  F04B45/047 ,  F04B43/02

    Abstract: The micropump device (1) is formed in a monolithic body (3) of semiconductor material integrating a plurality of actuator elements (5) arranged side-by-side. Each actuator element (5) has a first chamber (15) extending at a distance from a first face (3A) of the monolithic body; a membrane (18) arranged between the first face (3A) and the first chamber (15); a piezoelectric element (19) extending on the first face (3A) over the membrane (18); a second chamber (20), arranged between the first chamber (15) and a second face (3B) of the monolithic body; a fluidic inlet path (10) fluidically connecting the second chamber (20) with the outside of the monolithic body (3); and a fluid outlet opening (11) extending in a transverse direction in the monolithic body (3) from the second face (3B) as far as the second chamber (20), through the first chamber (15). The monolithic formation of a plurality of actuator elements and the possibility of driving the actuator elements at different voltages enable precise adjustment of flows, from very low values to high values.

    MINIATURIZED LOAD SENSOR DEVICE HAVING LOW SENSITIVITY TO THERMO-MECHANICAL PACKAGING STRESS, IN PARTICULAR FORCE AND PRESSURE SENSOR
    26.
    发明公开
    MINIATURIZED LOAD SENSOR DEVICE HAVING LOW SENSITIVITY TO THERMO-MECHANICAL PACKAGING STRESS, IN PARTICULAR FORCE AND PRESSURE SENSOR 审中-公开
    小型化的负载传感器装置对热机械包装应力，特别是力和压力传感器具有低灵敏度

    公开(公告)号：EP3252449A1

    公开(公告)日：2017-12-06

    申请号：EP16206884.5

    申请日：2016-12-23

    Applicant: STMicroelectronics S.r.l.

    Inventor： CALTABIANO, Daniele ,  ABBASI GAVARTI, Mohammad ,  MURARI, Bruno ,  BRIOSCHI, Roberto ,  GIUSTI, Domenico

    IPC: G01L9/00 ,  G01L1/04

    Abstract: A load-sensing device (10), arranged in a package (12) forming a chamber (24). The package (12) has a deformable substrate (21) configured, in use, to be deformed by an external force. A sensor unit (11) is in direct contact with the deformable substrate (21) and is configured to detect deformations of the deformable substrate. An elastic element (15) is arranged within of the chamber (24) and acts between the package (12) and the sensor unit (11) to generate, on the sensor unit, a force keeping the sensor unit in contact with the deformable substrate. For example, the deformable substrate is a base (21) of the package (12), and the elastic element is a metal lamina (15) arranged between the lid (22) of the package (12) and the sensor unit (11). The sensor unit (11) may be a semiconductor die integrating piezoresistors.

    Abstract translation: 负载感测装置（10），其布置在形成腔室（24）的包装（12）中。 包装（12）具有可变形的基底（21），该基底在使用中被配置为通过外力而变形。 传感器单元（11）与可变形基板（21）直接接触并且被配置为检测可变形基板的变形。 弹性元件（15）布置在腔室（24）内并且作用在封装（12）和传感器单元（11）之间，以在传感器单元上​​产生保持传感器单元与可变形基底 。 例如，可变形衬底是封装（12）的基座（21），并且弹性元件是布置在封装（12）的盖（22）和传感器单元（11）之间的金属薄片（15） 。 传感器单元（11）可以是集成压敏电阻器的半导体管芯。

    PIEZOELECTRIC MICROMACHINED PRESSURE TRANSDUCER WITH HIGH SENSITIVITY AND RELATED MANUFACTURING PROCESS
    27.
    发明公开
    PIEZOELECTRIC MICROMACHINED PRESSURE TRANSDUCER WITH HIGH SENSITIVITY AND RELATED MANUFACTURING PROCESS 审中-公开

    公开(公告)号：EP4283272A1

    公开(公告)日：2023-11-29

    申请号：EP23172036.8

    申请日：2023-05-08

    Applicant: STMicroelectronics S.r.l.

    Inventor： GIUSTI, Domenico ,  QUAGLIA, Fabio ,  FERRERA, Marco

    IPC: G01L9/00 ,  B06B1/06 ,  G01H11/08 ,  G01N29/02 ,  G01N29/24

    Abstract: Micromachined pressure transducer including: a fixed body (5) of semiconductor material, which laterally delimits a main cavity (7); a transduction structure (6), which is suspended on the main cavity (7) and includes at least a pair of deformable structures (10) and a movable region (8), which is formed by semiconductor material and is mechanically coupled to the fixed body (5) through the deformable structures (10). Each deformable structure (10) includes: a support structure (15) of semiconductor material, which includes a first and a second beam (20,22), each of which has ends fixed respectively to the fixed body (5) and to the movable region (8), the first beam (20) being superimposed, at a distance, on the second beam (22); and at least one piezoelectric transduction structure (12,14), mechanically coupled to the first beam (20). The piezoelectric transduction structures (12,14) are electrically controllable so that they cause corresponding deformations of the respective support structures (15) and a consequent translation of the movable region (8) along a translation direction (H).

    ANGULAR PIEZOELECTRIC ACTUATOR FOR A MEMS SHUTTER AND MANUFACTURING METHOD THEREOF
    29.
    发明公开
    ANGULAR PIEZOELECTRIC ACTUATOR FOR A MEMS SHUTTER AND MANUFACTURING METHOD THEREOF 审中-公开

    公开(公告)号：EP3933460A1

    公开(公告)日：2022-01-05

    申请号：EP21182607.8

    申请日：2021-06-29

    Applicant: STMicroelectronics S.r.l.

    Inventor： GIUSTI, Domenico ,  MERLI, Massimiliano

    IPC: G02B5/00 ,  G02B26/02 ,  G02B26/04

    Abstract: The MEMS actuator (10) is formed by a main body (15) that has a central portion (29A), couplable to a substrate (11), and a peripheral portion (29B), which is suspended over the substrate when the central portion is coupled to the substrate and has a deformable structure (35*), which at rest has a spiral planar shape, extends around the central portion (29A), and forms a plurality of membranes (35) arranged in succession. The MEMS actuator has a plurality of bearing structures (38, 39) and, for each bearing structure, a corresponding piezoelectric actuator (40). The bearing structures are fixed at the top to the deformable structure (35*) and laterally delimit corresponding cavities (37), each having a lateral opening (AP) facing the central portion (29A) of the main body (15) and closed at the top by a corresponding membrane (35), of which a fixed part is fixed to the underlying bearing structure and a suspended part is laterally offset with respect to the underlying bearing structure. The piezoelectric actuators are controllable so as to cause a deformation of the corresponding membrane and a rotation of the bearing structures around the central portion of the main body.

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