中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

31 records (took 0.024 seconds)

    Process for preparing a bonding resin
    23.
    发明专利
    Process for preparing a bonding resin 未知

    公开(公告)号：SE1850467A1

    公开(公告)日：2019-10-21

    申请号：SE1850467

    申请日：2018-04-20

    Applicant: STORA ENSO OYJ

    Inventor： ZAFAR ASHAR ,  NASLI BAKIR BEN ,  EKSTRÖM JESPER

    IPC: C09J197/00 ,  B32B21/08 ,  C08L97/00 ,  C09J161/06

    Abstract: The present invention relates to a process for preparing a bonding resin, wherein a resin prepared from lignin, phenol and formaldehyde is mixed with a resin prepared from phenol and formaldehyde to achieve a mixture useful as a bonding resin useful in the manufacture of laminates, mineral wool insulation and wood products such as plywood, laminated veneer lumber (LVL), medium density fiberboards (MDF) and particle boards.

    BINDER COMPRISING MODIFIED LIGNIN
    25.
    发明专利
    BINDER COMPRISING MODIFIED LIGNIN 未知

    公开(公告)号：SE2330316A1

    公开(公告)日：2025-01-07

    申请号：SE2330316

    申请日：2023-07-06

    Applicant: STORA ENSO OYJ

    Inventor： ARESKOGH DIMITRI ,  EKSTRÖM JESPER

    IPC: C09J197/00 ,  C07B41/02 ,  C08H8/00 ,  C08L97/00

    Abstract: The present invention is directed to a process for preparing a binder, wherein lignin is subjected to demethylation whereby methoxy groups of lignin are converted to hydroxy groups. The demethylated lignin is mixed with a crosslinker and heated. The invention is also directed a binder obtained according to the process and to the use thereof.

    Use of bonding resin
    26.
    发明专利
    Use of bonding resin 未知

    公开(公告)号：SE544700C2

    公开(公告)日：2022-10-18

    申请号：SE1950574

    申请日：2019-05-15

    Applicant: STORA ENSO OYJ

    Inventor： ZAFAR ASHAR ,  NASLI BAKIR BEN ,  EKSTRÖM JESPER

    IPC: C09J163/00 ,  B27N3/00 ,  B32B21/00 ,  C08L1/00 ,  C08L3/00 ,  C08L5/00 ,  C08L63/00 ,  C08L89/00 ,  C08L93/00 ,  C08L99/00 ,  C09J101/00 ,  C09J103/00 ,  C09J105/00 ,  C09J189/00 ,  C09J193/00 ,  C09J199/00

    Abstract: The present invention relates to the use of a bonding resin prepared by providing an aqueous solution comprising at least one biobased product selected from tannin, starch, soy protein, glycerol, chitin, pectin, dextrose or other carbohydrates, or a mixture thereof and mixing the aqueous solution with one or more of glycerol diglycidyl ether, polyglycerol diglycidyl ether, polyglycerol polyglycidyl ether, glycerol triglycidyl ether, sorbitol polyglycidyl ether, alkoxylated glycerol polyglycidyl ether, trimethylolpropane triglycidyl ether, trimethylolpropane diglycidyl ether, polyoxypropylene glycol diglycidylether, polyoxypropylene glycol triglycidyl ether, diglycidylether of cyclohexane dimethanol, resorcinol diglycidyl ether, isosorbide diglycidyl ether, pentaerythritol tetraglycidyl ether, ethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether having 2-9 ethylene glycol units, propylene glycol diglycidyl ether having 1-5 propylene glycol units, and/or diglycidyl ether of terminal diol having a linear carbon chain of 3-6 carbon atoms; and optionally one or more additives. The bonding resin is used in the manufacture of laminates, mineral wool insulation or engineered wood products such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF) or particle boards. Preferably, the bonding resin does not comprise lignin.

    Proceso para preparar una resina adhesiva.
    27.
    发明专利
    Proceso para preparar una resina adhesiva. 未知

    公开(公告)号：CL2021003339A1

    公开(公告)日：2022-08-26

    申请号：CL2021003339

    申请日：2021-12-14

    Applicant: STORA ENSO OYJ

    Inventor： ZAFAR ASHAR ,  EKSTRÖM JESPER

    IPC: B27N3/00 ,  B32B21/00 ,  C08H7/00 ,  C08L63/00 ,  C08L97/00 ,  C09D163/00 ,  C09D197/00 ,  C09J163/00 ,  C09J197/00

    Abstract: La presente invención se refiere a un proceso para preparar una resina adhesiva, la lignina en forma sólida o en forma de dispersión en agua se mezcla con un reticulante; y opcionalmente uno o más aditivos seguido de la adición de una solución básica. La resina adhesiva es útil, por ejemplo, en la fabricación de laminados, aislamientos de lana mineral y productos de madera como madera contrachapada, tableros de virutas orientadas (OSB), madera de chapa laminada (LVL), tableros de fibra de densidad media (MDF), tableros de fibra de alta densidad (HDF), suelos de parqué, madera contrachapada curvada, tableros de partículas chapados, tableros de MDF o de partículas chapados, laminados o aislamientos de lana mineral.

    Process for preparing a bonding resin
    29.
    发明专利
    Process for preparing a bonding resin 未知

    公开(公告)号：AU2020307468A1

    公开(公告)日：2021-12-16

    申请号：AU2020307468

    申请日：2020-06-22

    Applicant: STORA ENSO OYJ

    Inventor： ZAFAR ASHAR ,  EKSTRÖM JESPER

    IPC: C09J197/00 ,  B27N3/00 ,  B32B21/00 ,  C08H7/00 ,  C08L63/00 ,  C08L97/00 ,  C09D163/00 ,  C09D197/00 ,  C09J163/00

    Abstract: The present invention relates to a process for preparing a bonding resin, lignin in solid form or in the form of a dispersion in water is mixed with a crosslinker; and optionally one or more additives followed by addition of a basic solution. The bonding resin is useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF), parquet flooring, curved plywood, veneered particleboards, veneered MDF or particle boards, laminates or mineral wool insulation.

Patent Agency Ranking