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公开(公告)号:SE1951516A1
公开(公告)日:2021-06-21
申请号:SE1951516
申请日:2019-12-20
Applicant: STORA ENSO OYJ
Inventor: ZAFAR ASHAR , PHAM HUYNH TRAM ANH , EKSTRÖM JESPER , HÄGG KATARINA
IPC: C09J197/02 , B27N3/00 , B32B21/00 , C07G1/00 , C08H7/00 , C08L63/00 , C08L97/02 , C09D163/00 , C09D197/02 , C09J163/00
Abstract: The present invention relates to a process for preparing a bonding resin, wherein lignin is provided in the form of a solution in ammonia and/or an organic base and mixed with one or more crosslinkers and optionally one or more additives. The bonding resin is useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF), parquet flooring, curved plywood, veneered particleboards, veneered MDF or particle boards. The bonding resin is also useful for example in composites, molding compounds and foundry applications.
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公开(公告)号:SE544477C2
公开(公告)日:2022-06-14
申请号:SE2050834
申请日:2020-07-03
Applicant: STORA ENSO OYJ
Inventor: ZAFAR ASHAR , ALMQVIST DAVID , ARESKOGH DIMITRI , HÄGG KATARINA
IPC: C09D197/00 , B29B9/08 , B30B11/16
Abstract: The present invention is directed to a process for preparing coating compositions containing up to 100% bio-based content. The coating compositions are used for coating metal, paper and wood substrates in various applications. The process for preparing the coating composition comprises the steps of providing lignin, wherein the lignin is agglomerated and has a particle size distribution such that at least 80 wt-% of the agglomerates have a diameter within the range of from 0.2 mm to 5.0 mm, dissolving the agglomerated lignin in an organic solvent, and mixing the solution with a crosslinker to obtain a coating composition.
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公开(公告)号:SE1851222A1
公开(公告)日:2020-04-09
申请号:SE1851222
申请日:2018-10-08
Applicant: STORA ENSO OYJ
Inventor: NASLI BAKIR BEN , HÄGG KATARINA
IPC: C07G1/00 , C08H8/00 , C08L97/00 , C09J197/00
Abstract: The present invention relates to an improved process for preparing an aqueous dispersion of lignin and the use of said suspension in the preparation of a resin.
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公开(公告)号:SE2050834A1
公开(公告)日:2022-01-04
申请号:SE2050834
申请日:2020-07-03
Applicant: STORA ENSO OYJ
Inventor: ZAFAR ASHAR , ALMQVIST DAVID , ARESKOGH DIMITRI , HÄGG KATARINA
IPC: C09D197/00 , B29B9/08 , B30B11/16
Abstract: The present invention is directed to a process for preparing coating compositions containing up to 100% bio-based content. The coating compositions are used for coating metal, paper and wood substrates in various applications. The process for preparing the coating composition comprises the steps of providing lignin, wherein the lignin is agglomerated and has a particle size distribution such that at least 80 wt-% of the agglomerates have a diameter within the range of from 0.2 mm to 5.0 mm, dissolving the agglomerated lignin in an organic solvent, and mixing the solution with a crosslinker to obtain a coating composition.
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公开(公告)号:SE542796C2
公开(公告)日:2020-07-07
申请号:SE1851222
申请日:2018-10-08
Applicant: STORA ENSO OYJ
Inventor: NASLI BAKIR BEN , HÄGG KATARINA
IPC: C07G1/00 , C08H8/00 , C08L97/00 , C09J197/00
Abstract: The present invention relates to an improved process for preparing an aqueous dispersion of lignin and the use of said suspension in the preparation of a resin.
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公开(公告)号:AU2020407553A1
公开(公告)日:2022-06-09
申请号:AU2020407553
申请日:2020-12-16
Applicant: STORA ENSO OYJ
Inventor: ZAFAR ASHAR , PHAM HUYNH TRAM ANH , HÄGG KATARINA , EKSTRÖM JESPER
IPC: C09J197/02 , B27N3/00 , B32B21/00 , C07G1/00 , C08H7/00 , C08L63/00 , C08L97/02 , C09D163/00 , C09D197/02 , C09J163/00
Abstract: The present invention relates to a process for preparing a bonding resin, wherein lignin is provided in the form of a solution in ammonia and/or an organic base and mixed with one or more crosslinkers and optionally one or more additives. The bonding resin is useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF), parquet flooring, curved plywood, veneered particleboards, veneered MDF or particle boards. The bonding resin is also useful for example in composites, molding compounds and foundry applications.
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