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    Process for preparing a bonding resin
    22.
    发明专利
    Process for preparing a bonding resin 未知

    公开(公告)号：SE1850830A1

    公开(公告)日：2020-01-03

    申请号：SE1850830

    申请日：2018-07-02

    Applicant: STORA ENSO OYJ

    Inventor： ZAFAR ASHAR ,  NASLI BAKIR BEN ,  PHAM HUYNH TRAM ANH ,  HJELM LARS ,  JANSSON LI ,  TORSSELL STAFFAN

    IPC: C09J197/00 ,  C08H7/00 ,  C08L97/00 ,  C09J161/12

    Abstract: The present invention relates to a process for preparing a bonding resin, wherein lignin is provided in the form of an aqueous solution and mixed with one or more of glycerol diglycidyl ether, glycerol triglycidyl ether, sorbitol polyglycidyl ether, ethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether having 2-9 ethylene glycol units, propylene glycol diglycidyl ether having 1-3 propylene glycol units, and/or diglycidyl ether of terminal diol having a linear carbon chain of 3-6 carbon atoms; and optionally one or more additives. The bonding resin is useful for example in the manufacture of laminates, mineral wool insulation and wood products such as plywood, laminated veneer lumber (LVL), medium density fiberboards (MDF) , high density fiberboards (HDF) and particle boards.

    Formulación adhesiva que comprende lignina
    24.
    发明专利
    Formulación adhesiva que comprende lignina 未知

    公开(公告)号：CL2020002713A1

    公开(公告)日：2021-04-09

    申请号：CL2020002713

    申请日：2020-10-20

    Applicant: STORA ENSO OYJ

    Inventor： NASLI BAKIR BEN ,  ZAFAR ASHAR ,  EKSTRÖM JESPER

    IPC: C08H8/00 ,  C08L97/00 ,  C09J161/00 ,  C09J197/00

    Abstract: La presente invención se refiere a una formulación adhesiva que comprende lignina, adecuada para su uso en la manufactura de, por ejemplo, productos de madera. La lignina se proporciona en forma de una solución o dispersión o en forma de sólido seco, como en forma de un polvo. La formulación adhesiva también comprende resina fenol-formaldehído (PF) y/o resina lignina-fenolformaldehído (LPF). La formulación adhesiva también puede comprender diluyentes, endurecedores, rellenos y otros aditivos, para lograr una formulación adhesiva útil en la manufactura de, por ejemplo, productos de madera, como madera contrachapada y madera microlaminada (LVL). La formulación adhesiva también se puede usar en la manufactura de laminados y tableros de partículas orientadas.

    Use of bonding resin
    26.
    发明专利
    Use of bonding resin 未知

    公开(公告)号：SE1950574A1

    公开(公告)日：2020-11-16

    申请号：SE1950574

    申请日：2019-05-15

    Applicant: STORA ENSO OYJ

    Inventor： ZAFAR ASHAR ,  NASLI BAKIR BEN ,  EKSTRÖM JESPER

    IPC: C09J163/00 ,  B27N3/00 ,  B32B21/00 ,  C08L1/00 ,  C08L3/00 ,  C08L5/00 ,  C08L63/00 ,  C08L89/00 ,  C08L93/00 ,  C08L99/00 ,  C09J101/00 ,  C09J103/00 ,  C09J105/00 ,  C09J189/00 ,  C09J193/00 ,  C09J199/00

    Abstract: The present invention relates to the use of a bonding resin prepared by providing an aqueous solution comprising at least one biobased product selected from tannin, starch, soy protein, glycerol, chitin, pectin, dextrose or other carbohydrates, or a mixture thereof and mixing the aqueous solution with one or more of glycerol diglycidyl ether, polyglycerol diglycidyl ether, polyglycerol polyglycidyl ether, glycerol triglycidyl ether, sorbitol polyglycidyl ether, alkoxylated glycerol polyglycidyl ether, trimethylolpropane triglycidyl ether, trimethylolpropane diglycidyl ether, polyoxypropylene glycol diglycidylether, polyoxypropylene glycol triglycidyl ether, diglycidylether of cyclohexane dimethanol, resorcinol diglycidyl ether, isosorbide diglycidyl ether, pentaerythritol tetraglycidyl ether, ethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether having 2-9 ethylene glycol units, propylene glycol diglycidyl ether having 1-5 propylene glycol units, and/or diglycidyl ether of terminal diol having a linear carbon chain of 3-6 carbon atoms; and optionally one or more additives. The bonding resin is used in the manufacture of laminates, mineral wool insulation or engineered wood products such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF) or particle boards. Preferably, the bonding resin does not comprise lignin.

    ADHESIVE FORMULATION COMPRISING LIGNIN
    29.
    发明专利
    ADHESIVE FORMULATION COMPRISING LIGNIN 未知

    公开(公告)号：CA3096813A1

    公开(公告)日：2019-10-24

    申请号：CA3096813

    申请日：2019-04-16

    Applicant: STORA ENSO OYJ

    Inventor： NASLI BAKIR BEN ,  ZAFAR ASHAR ,  EKSTROM JESPER

    IPC: C09J197/00 ,  C08H8/00 ,  C08L97/00 ,  C09J161/00

    Abstract: The present invention relates to an adhesive formulation comprising lignin, suitable for use in the manufacture of for example wood products.The lignin is provided in the form of a solution or dispersion or in dry solid form, such as in the form of a powder. The adhesive formulation also comprises phenol- formaldehyde (PF) resin and/or lignin-phenol-formaldehyde (LPF) resin. The adhesive formulation may also comprise extenders, hardeners, fillers and other additives, to achieve an adhesive formulation useful in the manufacture of for example wood products, such as plywood and laminated veneer lumber (LVL).The adhesive formulation can also be used in the manufacture of laminates and oriented strand boards.

    Process for preparing a bonding resin
    30.
    发明专利
    Process for preparing a bonding resin 未知

    公开(公告)号：SE1850467A1

    公开(公告)日：2019-10-21

    申请号：SE1850467

    申请日：2018-04-20

    Applicant: STORA ENSO OYJ

    Inventor： ZAFAR ASHAR ,  NASLI BAKIR BEN ,  EKSTRÖM JESPER

    IPC: C09J197/00 ,  B32B21/08 ,  C08L97/00 ,  C09J161/06

    Abstract: The present invention relates to a process for preparing a bonding resin, wherein a resin prepared from lignin, phenol and formaldehyde is mixed with a resin prepared from phenol and formaldehyde to achieve a mixture useful as a bonding resin useful in the manufacture of laminates, mineral wool insulation and wood products such as plywood, laminated veneer lumber (LVL), medium density fiberboards (MDF) and particle boards.

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